GS816136 Search Results

GS816136T-133

Contextual Info: GS816118 T/D /GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

GS8161E18

Abstract: GS8161E18T-225 GS8161E18T-250 GS8161E36
Contextual Info: GS8161E18 T/D /GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

GS816118B

Abstract: GS816118BT-150 GS816118BT-200 GS816118BT-250 GS816136B
Contextual Info: Preliminary 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: GS816118 T/D /GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

GS816118B

Abstract: GS816118BT-150 GS816118BT-200 GS816118BT-250 GS816136B
Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

GS816118B

Abstract: GS816118BT-150 GS816118BT-200 GS816118BT-250 GS816136B GS816118BD-200I 8161xxb GS816118BD-200 GS816136BGT-200
Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

GS816118B

Abstract: GS816118BT-150 GS816118BT-200 GS816118BT-250 GS816136B
Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

Contextual Info: GS816118D GT/D /GS816132D(D)/GS816136D(GT/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

Contextual Info: Preliminary GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

mcl 03a

Abstract: GS816118A GS816118AT-300
Contextual Info: Preliminary GS816118A T/D /GS816132A(D)/GS816136A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 300 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Features Flow Through/Pipeline Reads

35-AG

Abstract: GS816118BGT-150I
Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

Contextual Info: GS816118D GT/D /GS816132D(D)/GS816136D(GT/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS816118D GT/D /GS816132D(D)/GS816136D(GT/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply

Contextual Info: Preliminary GS816118D GT/D /GS816132D(D)/GS816136D(GT/D) 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS816118D GT/D /GS816132D(D)/GS816136D(GT/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline

Contextual Info: GS816118B T/D /GS816132B(D)/GS816136B(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

Contextual Info: Revision: 9/26/02 GS816118/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS816118/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

Contextual Info: Revision: 9/26/02 GS8161Z18/32/36D Supplemental Datasheet Information This supplemental information applies to the GS8161Z18/36T datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS816118D-133

Abstract: GS816118D-150 GS816118D-166 GS816118D-200 GS816118D-225 GS816118D-250 GS816132D-250
Contextual Info: Revision: 9/26/02 GS816118/32/36D Supplemental Datasheet Information This supplemental information applies to the GS816118/36T datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only

GS816118BT-150V

Abstract: GS816118BT-200V GS816118BT-250V
Contextual Info: Preliminary GS8161xxB T/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation

Contextual Info: Preliminary GS816118/36T-225/200/180/166/150/133 1M x 18, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan