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    8161E18 Search Results

    8161E18 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    8161E18A
    		GIGA Synchronous Burst SRAMs, 16Meg, 1M x 18,1.8 V and 2.5 V Original PDF 903.2KB 35
    SF Impression Pixel

    8161E18 Price and Stock

    GSI Technology

    GSI Technology GS8161E18DGD-333IV

    SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 5ns/3ns 165-Pin FBGA - Bulk (Alt: GS8161E18DGD-333IV)
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    Avnet Americas GS8161E18DGD-333IV Bulk 24 Weeks 144
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    GSI Technology GS8161E18DGD-375I

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    GSI Technology GS8161E18DGT-250I

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    GSI Technology GS8161E18DGD-150I

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    Mouser Electronics GS8161E18DGD-150I
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    GSI Technology GS8161E18DD-333I

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    8161E18 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    GS8161E18AT-300

    Abstract: 36AD Boundary Scan JTAG Logic
    Contextual Info: Preliminary 8161E18A T/D /GS8161E32A(D)/GS8161E36A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


    Original     		GS8161E18A /GS8161E32A /GS8161E36A 100-Pin 165-Bump 100-lead 8161E18A GS8161ExxA GS8161E18AT-300 36AD Boundary Scan JTAG Logic PDF

    GS8161E18

    Abstract: GS8161E18T-225 GS8161E18T-250 GS8161E36
    Contextual Info: 8161E18 T/D /GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original     		GS8161E18 /GS816132 /GS816136 100-Pin 165-Bump 8161E18 GS8161E18T-225 GS8161E18T-250 GS8161E36 PDF

    Contextual Info: Preliminary 8161E18/36T-250/225/200/166/150/133 1M x 18, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original     		GS8161E18/36T-250/225/200/166/150/133 100-Pin PDF

    GS8161E18

    Abstract: GS8161E18T-250 GS8161E36 A13478
    Contextual Info: Preliminary 8161E18/36T-250/225/200/166/150/133 1M x 18, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original     		GS8161E18/36T-250/225/200/166/150/133 100-Pin 100-lead GS8161E18 GS8161E18T-250 GS8161E36 A13478 PDF

    Contextual Info: Preliminary 8161E18/36T-225/200/180/166/150/133 1M x 18, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original     		GS8161E18/36T-225/200/180/166/150/133 100-Pin GS8161E18T 2000C GS8161E18 2000D GS18/3662 2/2000E; 8161E18 PDF

    GS8161E18D-133

    Abstract: GS8161E18D-150 GS8161E18D-166 GS8161E18D-200 GS8161E18D-225 GS8161E18D-250
    Contextual Info: Revision: 9/26/02 8161E18/32/36D Supplemental Datasheet Information This supplemental information applies to the 8161E18/36T datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only


    Original     		GS8161E18/32/36D GS8161E18/36T 165-bump BGA--x18 8161E18 GS8161E18D-133 GS8161E18D-150 GS8161E18D-166 GS8161E18D-200 GS8161E18D-225 GS8161E18D-250 PDF

    Contextual Info: Revision: 9/26/02 8161E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the 8161E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is


    Original     		GS8161E18/32/36AD GS8161E18/36AT 165-bump BGA--x18 8161E18A PDF

    Contextual Info: 8161E18 T/D /GS816132(D)/GS816136(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original     		GS8161E18 /GS816132 /GS816136 100-Pin 165-Bump 100-lead 8161E18 PDF

    GS8161E18AT-275

    Abstract: GS8161E18AT-300 A1792
    Contextual Info: Preliminary 8161E18/36AT-300/275/250/225/200 1M x 18, 512K x 36 18Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original     		GS8161E18/36AT-300/275/250/225/200 100-Pin 100-lead 10ithout 8161E18A GS8161E18AT-275 GS8161E18AT-300 A1792 PDF

    Contextual Info: Preliminary 8161E18/36T-225/200/180/166/150/133 1M x 18, 512K x 36 16Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original     		GS8161E18/36T-225/200/180/166/150/133 100-Pin 8161E18 GS18/3662 2/2000E; PDF