G10 FR4 7MM Search Results

LS-BGA49B-61

Abstract: g10 fr4 7mm
Contextual Info: Top View 7mm [0.276"] 1.1mm [0.043"] 7mm [0.276"] 1.1mm [0.043"] 0.8mm typ. 4.8mm [0.189"] 4.8mm [0.189"] 1 3.76mm [0.148"] 1.42mm [0.056"] 2 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non

g10 fr4 7mm

Contextual Info: Top View RoHS Compliant 11 20 7.6mm 10.2mm 10 1 25.4mm 7.6mm 2.5mm Typ. 3 1 11.9mm 11.9mm assembled 2 Side View End View 0.65mm pitch typ. Description: Package Converter 20 position DIP to 20 Position SOIC. Pinout 1:1 7mm 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent

g10 fr4 7mm

Abstract: FR4 substrate 1.6mm FR4 1.6mm substrate pitch 0.75mm BGA SF-BGA48G-B-03 bga 6x8 0.3mm pitch BGA
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

FR4 substrate 1.6mm

Abstract: FR4 1.6mm substrate bga 6x8 SF-BGA48H-B-03 pitch 0.75mm BGA g10 fr4 7mm
Contextual Info: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 8.5mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]

PB-BGA48G-Z-01

Abstract: g10 fr4 7mm
Contextual Info: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 7mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top View 33.02mm [1.300"] 3 * This height varies depending on the screw position.

PB-BGA36B-Z-01

Abstract: g10 fr4 7mm
Contextual Info: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 8.5mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top V iew 33.02mm [1.300"] 3 * This height varies depending on the screw position.

PB-BGA48H-Z-01

Abstract: g10 fr4 7mm Fr43
Contextual Info: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 8.5mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top View 33.02mm [1.300"] 3 * This height varies depending on the screw position.

IPC-4101

Abstract: IPC4553 345C SF-SO20E-L-41 IPC-4553 g10 fr4 7mm
Contextual Info: RoHS COMPLIANT 7mm 5.2mm Compatible target board land pattern not to scale A < 0.235 B > 0.335 13mm 0.016" A 1.27mm pitch typ. B 2.54mm 0.46mm±0.03mm dia. Top View 4.7mm 7.58mm±0.38mm 2 4 1 3 0.65 mm pitch typ. End View Side View Description: Surface mount foot (SF)

g10 fr4 7mm

Abstract: SF-BGA49B-B-62 bga 0.8mm pitch 49 balls
Contextual Info: 7mm [0.276"] Top View 1.1mm [0.043"] 1.1mm [0.043"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 7mm [0.276"] -62 Sn96.5Ag3.0Cu0.5 0.8mm typ. -62F* *RoHS Compliant 4.8mm [0.189"] Side View Detail A 2 Detail A 2.83mm [0.112"] 2.48mm [0.098"]

SG-BGA-7050

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

g10 fr4 7mm

Abstract: SG-BGA-7039 micron 100 ball BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-8003

Abstract: 18X18
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

SG-BGA-6047

Abstract: 17X17
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

size 0204

Abstract: SG-BGA-6258 6258
Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm 42.23mm Compression plate distributes forces evenly

SG-BGA-6201

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

6135

Abstract: SG-BGA-6135
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer

SG-BGA-6006

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

SG-BGA-6246

Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm Compression plate distributes forces evenly 42.23mm

transistor tt 6093

Abstract: transistor c 6093 tt 6093 c 6093 SG-BGA-6093 6093
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

SG-BGA-6220

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer

SG-BGA-6226

Contextual Info: 32.51mm GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection 7 32.51mm Minimum real estate required A Compression plate distributes forces evenly A Ball guide prevents over compression of elastomer

octagon

Abstract: SG-BGA-6245
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm 42.225mm

Contextual Info:  LatticeECP3 PCI Express Solutions Board – Revision A User’s Guide August 2012 Revision: EB43_01.2  LatticeECP3 PCI Express Solutions Board – Revision A User’s Guide Introduction As PCI Express applications have emerged, the LatticeECP3 FPGA family has become a well-suited solution for

R114 082 000

Abstract: Radiall R114 665 110 R114 005 000 SMB R114 186 000 R114 665 000 right angle Female m12 PCB connector 1.33 cm male connector SMB r114.003 R114 426 000 SMB connector
Contextual Info: SMB CONTENTS PAGE SMB Introduction. 4 General . 5