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SG-BGA-7050
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 400; Top Pitch (mm): 0.65; IC Array X: 20; IC Array Y: 20; Socket Lid: ZIF (screw); Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.33; IC Size X (mm): 14; IC Size Y (mm): 14; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.27; IC Ball Height Max (mm): 0.37; IC Ball Diameter Max (mm): 0.45; Max Package Code: Part Description: GHz BGA Socket (ZIF) |
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