SG-BGA-6006 Search Results

SG-BGA-6006 Result Highlights (5)

Part	Manufacturer	Description	Download
60066-5004LF	Amphenol Communications Solutions	Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 5 Row, Press-Fit, 90 Position, Select Load, Standard	PDF
60066-5002LF	Amphenol Communications Solutions	Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 90 Position, Select Load, Standard	PDF
60066-5003LF	Amphenol Communications Solutions	Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 90 Position, Select Load, Standard	PDF
TMS320C28342ZEPQ	Texas Instruments	Delfino Microcontroller 256-BGA
TMS320C28344ZEPQ	Texas Instruments	Delfino Microcontroller 256-BGA

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
SG-BGA-6006		Ironwood Electronics	GHz BGA Sockets-1.0mm; IC Size X (mm): 19; IC Size Y (mm): 19; IC Array X: 16; IC Array Y: 16; Max Pincount: 256; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: BGA256G; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)	Original	PDF	67.45KB	4