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SG-BGA-8003
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Ironwood Electronics
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High Frequency GHz Sockets; Max Pincount: 324; Top Pitch (mm): 1; IC Array X: 18; IC Array Y: 18; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.7; IC Size X (mm): 19; IC Size Y (mm): 19; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.31; IC Ball Height Max (mm): 0.41; IC Ball Diameter Max (mm): 0.46; Max Package Code: BGA324; Part Description: GHz BGA Socket (ZIF) |
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