FG900 Search Results

FG900

Contextual Info: R Fine Pitch BGA FG900 Package PK038 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

FGG900

Abstract: FG900 UG112 MS-034
Contextual Info: Fine-Pitch BGA FG900/FGG900 Package PK038 (v1.4) November 12, 2009 X-Ref Target - Figure 1 PK038_01_110309 2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries.

PK500

Contextual Info: 100% Material Declaration Data Sheet for Spartan -3 FG900 Cu Wire Package PK500 (v1.1) March 19, 2012 Average Weight: 3.949 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3

FG900

Abstract: PK038
Contextual Info: R Fine-Pitch BGA FG900 Package PK038 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

SPARTAN-3 XC3S400 PQ208

Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
Contextual Info: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

XCF00S

Abstract: spartan 3a FGG900 DS099 XCN07010
Contextual Info: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.

SPARTAN-3

Abstract: DS099 XCF00S FGG900
Contextual Info: ds313.fm Page 1 Thursday, September 15, 2005 11:39 AM Spartan-3L Low Power FPGA Family R DS313 v1.1 September 15, 2005 Preliminary Product Specification Introduction Spartan -3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members

XAPP133

Abstract: vhdl code for lvds driver d flip-flop PCI33 PQ240 TQ144 BG352 BG432 CS144 HQ240
Contextual Info: Application Note: Virtex Series R Using the Virtex SelectI/O Resource XAPP133 v2.6 November 5, 2002 Summary The Virtex FPGA series includes a highly configurable, high-performance SelectI/O™ resource to provide support for a wide variety of I/O standards. The SelectI/O resource is a

SPARTAN-3 XC3S400 PQ208

Abstract: XC3S400 PQ208 xc3s2000 fg676 XC3S200 PQ208
Contextual Info: Spartan-3 1.2V FPGA Family: Introduction and Ordering Information R DS099-1 v1.1 April 24, 2003 Advance Product Specification Introduction The 1.2V Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.

Contextual Info: 89 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics Product Specification DS162 v3.0 October 17, 2011 Spartan-6 FPGA Electrical Characteristics Spartan -6 LX and LXT FPGAs are available in various speed grades, with -3 having the highest performance. The DC and

sis 968

Abstract: vhdl code for complex multiplication and addition 200E 300E 400E 600E PCI33 3 bit right left shift register verilog vHDL prog
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-2 v2.3 November 9, 2001 Preliminary Product Specification Architectural Description Virtex-E Array The Virtex-E user-programmable gate array, shown in Figure 1, comprises two major configurable elements: configurable logic blocks (CLBs) and input/output blocks (IOBs).

diode T25-4

Abstract: IC AN214 N345 pioneer amplifier an214 XCV1600E ac3 amplifier circuit diagram AN214 amplifier horizontal driver transistor D155 K235 XCV300E-6PQ240C
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.2 November 9, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels)

Field Programmable Gate Arrays

Abstract: DS022-1 XCV1000E XCV100E MB 300E FPGA Virtex 6 pin configuration XCV1600E XCV2000E XCV200E XCV300E
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.3 July 17, 2002 Production Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels)

FG676

Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

1156-BALL

Abstract: bga 896 411PI BF957 132-ball package
Contextual Info: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

Routability

Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
Contextual Info: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.

FPGA Virtex 6

Abstract: aj4 diode IO-L93N v1-3 F1 AB29 AG29 ak27 diode PCI33 XAPP235 XCV200
Contextual Info: Application Note: Virtex-E Families R Virtex Package Compatibility Guide XAPP235 v1.3 June 20, 2000 Summary This package compatibility guide describes the pinouts and established guidelines for package compatibility between the Virtex family and the Virtex-E and Virtex-E Extended Memory

QF32

Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
Contextual Info: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)

SPARTAN-3 XC3S400 PQ208

Abstract: AFG320 SPARTAN-3 XC3S400 microblaze XAPP462 XC3S200 PQ208 pin diagram xc3s400 pinout TQG144
Contextual Info: Spartan-3 FPGA Family: Complete Data Sheet R DS099 July 13, 2004 Advance Product Specification This document includes all four modules of the Spartan -3 FPGA data sheet. Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics

GSR 10,8

Abstract: DLL5 BG432 ic 404 BB112 equivalent
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.0 April 2, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 Kb to 4 Mb system gates - 130 MHz internal performance (four LUT levels)

XC6SLX45

Abstract: XC6SLX150 Xilinx Spartan-6 LX9 XC6SLX75 xc6slx150t XC6SLX25CSG324 XC6SLX4 xc6slx16 XC6SLX4 2 CSG225 I XC6SLX25-CSG324
Contextual Info: 80 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics DS162 v2.1 May 20, 2011 Preliminary Product Specification Spartan-6 FPGA Electrical Characteristics Spartan -6 LX FPGAs are available in -3, -3N, -2, and -1L speed grades, with -3 having the highest performance.

xc6slx16

Abstract: XC6SLX45 XC6SLX25 XC6SLX150 XC6SLX9 XC6SLX16 Spartan-6 LX45 efuse XC6SLX150T SPARTAN 6 DS162 CSG324
Contextual Info: 69 Spartan-6 FPGA Data Sheet: DC and Switching Characteristics DS162 v1.3 February 22, 2010 Advance Product Specification Spartan-6 FPGA Electrical Characteristics Spartan -6 LX FPGAs are available in -3, -2, and -1L speed grades, with -3 having the highest performance. Spartan-6 LXT