FCBGA PACKAGE THERMAL RESISTANCE Search Results
FCBGA PACKAGE THERMAL RESISTANCE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 54ACT825/QKA |
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54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP |
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| PQU650M-F-COVER | Murata Manufacturing Co Ltd | PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical | |||
| TPH1R306PL |
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N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQH |
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MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQ5 |
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N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet |
FCBGA PACKAGE THERMAL RESISTANCE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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fcbga package weight
Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749
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EID-LPT-ALX-003 EID-LPT-ALX-004 EID-LPP3-ALX-001 fcbga package weight Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749 | |
fcBGA PACKAGE thermal resistance
Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
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C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise | |
INTEL fcBGA PACKAGE thermal resistance
Abstract: fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide"
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PL1664-65) INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance 273804 PCB design guide T725 intel 830 "design guide" | |
FC-BGA
Abstract: T0812012 daewon tray
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AN-659-1 FC-BGA T0812012 daewon tray | |
TR6878
Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
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1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576 | |
mPGA479M
Abstract: fcBGA PACKAGE thermal resistance pioneer corporation T725 479-pin heat sink
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PL1664-65) mPGA479M fcBGA PACKAGE thermal resistance pioneer corporation T725 479-pin heat sink | |
QFN PACKAGE thermal resistance
Abstract: transistor tip 1050 BGA 31 x 31 tray BGA PACKAGE TOP MARK sg 421 PEAK TRAY bga PEAK TRAY qfn 4 x 4 PEAK TRAY QFN 4x4 NBSG11BAR2 BGA package tray 40 x 40
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NBSG11 NBSG11/D QFN PACKAGE thermal resistance transistor tip 1050 BGA 31 x 31 tray BGA PACKAGE TOP MARK sg 421 PEAK TRAY bga PEAK TRAY qfn 4 x 4 PEAK TRAY QFN 4x4 NBSG11BAR2 BGA package tray 40 x 40 | |
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Contextual Info: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG11 FCBGA-16 NBSG11/D | |
485G
Abstract: NBSG11 NBSG11BAHTBG NBSG11BAR2 NBSG11MN
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NBSG11 NBSG11 FCBGA-16 NBSG11/D 485G NBSG11BAHTBG NBSG11BAR2 NBSG11MN | |
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Contextual Info: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG11 NBSG11 NBSG11/D | |
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Contextual Info: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG14 FCBGA-16 NBSG14/D | |
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Contextual Info: NBSG11 2.5V/3.3V SiGe 1:2 Differential Clock Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG11 is a 1−to−2 differential fanout buffer, optimized for low skew and Ultra−Low JITTER. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG11 FCBGA-16 NBSG11/D | |
FCBGA-16
Abstract: tip 410 transistor 485G NBSG11 NBSG11BA NBSG11BAHTBG NBSG11BAR2 98AON04795D AND802
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NBSG11 NBSG11 FCBGA-16 12DUCTOR NBSG11/D FCBGA-16 tip 410 transistor 485G NBSG11BA NBSG11BAHTBG NBSG11BAR2 98AON04795D AND802 | |
485G
Abstract: NBSG14 NBSG14BAHTBG NBSG14BAR2
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NBSG14 NBSG14 FCBGA-16 NBSG14/D 485G NBSG14BAHTBG NBSG14BAR2 | |
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qfn 3x3 tray dimension
Abstract: PEAK TRAY QFN 4x4 QFN tray qfn 4x4 PEAK TRAY bga QFN tray PEAK TRAY qfn 4 x 4 qfn 4x4 tray dimension QFN tray 3x3 485G NBSG14
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NBSG14 NBSG14 FCBGA-16 NBSG14/D qfn 3x3 tray dimension PEAK TRAY QFN 4x4 QFN tray qfn 4x4 PEAK TRAY bga QFN tray PEAK TRAY qfn 4 x 4 qfn 4x4 tray dimension QFN tray 3x3 485G | |
485G
Abstract: NBSG11 NBSG11BA NBSG11BAR2
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NBSG11 NBSG11/D 485G NBSG11 NBSG11BA NBSG11BAR2 | |
485G
Abstract: NBSG14 NBSG14BA SG14
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NBSG14 NBSG14/D 485G NBSG14 NBSG14BA SG14 | |
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Contextual Info: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG14 NBSG14 NBSG14/D | |
NBSG14Contextual Info: NBSG14 2.5V/3.3V SiGe Differential 1:4 Clock/Data Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com Description The NBSG14 is a 1−to−4 clock/data distribution chip, optimized for ultra−low skew and jitter. Inputs incorporate internal 50 W termination resistors and accept |
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NBSG14 FCBGA-16 NBSG14/D | |
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Contextual Info: NBSG16 2.5V/3.3VĄSiGe Differential Receiver/Driver with RSECL* Outputs *Reduced Swing ECL http://onsemi.com The SG16 is a Silicon Germanium differential receiver/driver. The device is functionally equivalent to the EP16 and LVEP16 devices with much higher bandwidth and lower EMI capabilities. |
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NBSG16 LVEP16 r14525 NBSG16/D | |
AND8020
Abstract: NBSG11 NBSG11BA NBSG11BAR2
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NBSG11 r14525 NBSG11/D AND8020 NBSG11 NBSG11BA NBSG11BAR2 | |
fcBGA PACKAGE thermal resistance
Abstract: AND8020 NBSG14 NBSG14BA NBSG14BAR2 SG14 SG14 marking FCBGA
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NBSG14 r14525 NBSG14/D fcBGA PACKAGE thermal resistance AND8020 NBSG14 NBSG14BA NBSG14BAR2 SG14 SG14 marking FCBGA | |
NBSG16
Abstract: NBSG16BA NBSG16BA100 NBSG16BA500R2 NBSG16BAR2 SG16
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NBSG16 LVEP16 r14525 NBSG16/D NBSG16 NBSG16BA NBSG16BA100 NBSG16BA500R2 NBSG16BAR2 SG16 | |
fcBGA PACKAGE thermal resistance
Abstract: 485G NBSG53A NBSG53ABAHTBG
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NBSG53A FCBGA-16 QFN-16 NBSG53A 16-pin NBSG53A/D fcBGA PACKAGE thermal resistance 485G NBSG53ABAHTBG | |