FB2012 Search Results

FB2012

Abstract: ACX balun ACX filter ACX band pass ACX Multilayer Chip bluetooth csr BC multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

Contextual Info: SMD MULTI-LAYER FERRITE CHIP BEADS SMD MULTI-LAYER FERRITE CHIP BEADS High Impedance FB Series 2012 Package Part Number Impedance (Ω) @ 100 MHz DCR (Ω) max. I (mA) max. FB201209U800-LFR 80 ± 25% 0.15 300 FB201209U121-LFR 120 ± 25% 0.25 300 FB201209U151-LFR 150 ± 25%

07N2R4C

Abstract: FB2012 ACX balun ACX filter ACX band pass ACX Multilayer Chip bluetooth csr BC multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

Contextual Info: Philips Semiconductors Futurebus+ Products Preliminary specification Futurebus+ central arbitration controller GENERAL DESCRIPTION OF THE FB2012A FB2012A A requesting module becomes the bus master only after it receives the bus grant and the current bus master releases its tenure the

Futurebus

Contextual Info: Philips Semiconductors Section 7 Futurebus+ Products Data Sheets ICs for Data Communications CONTENTS Introduction F u tu re b u s + / BTL: A high perform ance standard for advanced com puting and com m unication system s . 917 FB2012A F uturebus+ central arbitration controller . 919

FB2012

Abstract: FB2012A FB2012AA P896
Contextual Info: • bbSBTSM OOTMÖMl S73 * S I C 3 Philips Semiconductors Futurebus+ Products Preliminary specification Futurebus+ central arbitration controller GENERAL DESCRIPTION OF THE FB2012A FB2012A A requesting module becomes the bus master only after it receives the bus grant and the current bus master releases its tenure the

1AM Diode

Contextual Info: Philips Sem iconductors Futurebus+ Products Prelim inary specification Futurebus+ central arbitration controller GENERAL DESCRIPTION OF THE FB2012A FB2012A A requesting module becomes the bus master only after it receives the bus grant and the current bus master releases its tenure the

bluetooth csr BC

Abstract: ACX Multilayer Chip FB2012 ACX balun ACX filter ACX band pass multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

ACX Multilayer Chip

Abstract: FB2012 MTK chipset ACX balun ACX filter ACX band pass multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

FB2012

Abstract: ACX Multilayer Chip ACX balun ACX filter ACX band pass bluetooth csr BC multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

FB2012

Abstract: 74F786 FB2040
Contextual Info: FEB n ijr P h ilip s C o m p o n en ts —S ig n e tic s FB2012 F u tu reb u s+ C en tra l A rb itra tio n C o n tro ller P r e lim in a r y S p e c ific a tio n D ec em b er 0 6 ,1990 RQH[13-0]* 28 RQL[13-0]* JTAG 4 CENTRAL ARBITRATION CONTROLLER 14 GR[13-0]*

SG0005

Abstract: FB2012A FB2012AA GR10 SG00052
Contextual Info: Philips Semiconductors Futurebus+ Products Preliminary specification Futurebus+ central arbitration controller FB2012A A requesting module becomes the bus master only after it receives the bus grant and the current bus master releases its tenure the current bus master has released its request, but may still be in the

FB2012

Abstract: ACX balun ACX filter ACX band pass ACX Multilayer Chip bluetooth csr BC multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

up/IRC 8961

Contextual Info: Philips Semiconductors Futurebus+ Products Preliminary specification Futurebus+ central arbitration controller GENERAL DESCRIPTION OF THE FB2012A FB2012A A requesting module becomes the bus master only after it receives the bus grant and the current bus master releases its tenure the

spw 080

Abstract: LEM3225 CL-2M2012-900JT TKS 0603 FBM3216HS800-T ACB2012M-150-T LAL04TB 494LYF FBM2125HS420-T m5258
Contextual Info: CT Technologies - Cross Reference Competitor Part CTC Part 0402R CT0402CSF 0402CS-P CT0402CSF 0402CS L CT0402CSF 0402CS CT0402CSF 0402 CT0402CSF 555-0402 CT0402CSF PE-0402CD CT0402CSF 0402AS CT0402CSF ELJNK CT0402CSF GLZG CT0402CSF KQ0402 CT0402CSF KQT0402L

Contextual Info: SMD Multilayer Ferrite Chip Beads Standard FB Series Part Number Impedance 00 At 100MHz DC Resistance £2) MAX Rated Current (mA) MAX Part Number Impedance CO) At 100MHz DC Resistance (£2) MAX Rated Current (mA) MAX FBI60808U090 9±25% 0.20 500 FB321611B190

Futurebus

Abstract: parallel bus arbitration IEEE-896 FB2012AA
Contextual Info: Philips Semiconductors Data Communications Products Futurebus+ / BTL: A high performance standard for advanced computing and communication systems INTRODUCTION INTRODUCTION Major Applications: Futurebus+ specifications were developed by several participants

68652

Abstract: ne5050
Contextual Info: ICs for Data Communications AM26LS31 Alphanumeric Product List Q uad high-speed differential line d r iv e r . 685 AM 26LS32/AM 26LS33 Q uad high-speed differential line receivers .

Futurebus

Abstract: IEEE896 IEEE-896
Contextual Info: Philips Sem iconductors Data Com m unications Products Futurebus+ / BTL: A high performance standard for advanced computing and communication systems INTRODUCTION INTRODUCTION Major Applications: Futurebus+ specifications were developed by several participants

202Y

Abstract: FB322513T-600Y-S FB-3225
Contextual Info: Cal-Chip Electronics, Incorporated FB SERIES Multilayer Ferrite Chip Beads OUTLINE • Cal-Chip ferrite chip EMI suppressors provide a powerful means of EMI/RFI attenuation for electronic equipment. These products are highly produced with the use of magnetic material and, multilayered technology.

52A25

Contextual Info: | SURFACE MOUNT MULTILAYER CHIP BEADS ^ i. i ii . PART NUMBER KEY: Ferrile 1 FB XX XX XX [A ] [B ] [C] XX XXX if Terminol Electrode ; Impedance: o b c • ob X 10c 0 H"h Moteriol Code: U. Z, 6, or G Dimensions: Length [A ] x Width [ B] x Thickness [C ] Product Identifier: Frontier Multiloyer Chip Beods

NE5180A

Abstract: NE5224 AM26LS32M "Line Receiver" CMOS N48 Differential Line Receiver duart AM26LS31C AM26LS31M FB2012A
Contextual Info: Philips Semiconductors Replacement list ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ

PLCC68 cpu

Abstract: FB2012 SC28L19x plcc68 PLCC68 package PLCC84 package robot control SC28L194A1A SC28L198 2698B
Contextual Info: W RELESS BUSINESS LINE UARTs / DUSCCs Benno Ritter W RELESS BUSINESS LINE NNN-FML-Y-1 UARTs Universal Asynchronous Receiver Transmitter UART Parallel Bus Tx Serial Universal Synchronous Asynchronous Receiver Transmitter Tx Serial Rx (USART) Rx Parallel Bus

Contextual Info: SMD MULTI-LAYER FERRITE CHIP BEADS SMD MULTI-LAYER FERRITE CHIP BEADS Standard FB Series FB160808 0603 Series FB160808U090-LFR Impedance (Ω) @ 100 MHz 9 ± 25% DCR (Ω) max. 0.20 I (mA) max. 500 Part Number Impedance (Ω) @ 100 MHz DCR (Ω) max. I (mA) max.