ENTHONE Search Results

Contextual Info: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

18065

Contextual Info: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

Contextual Info: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

enthone

Contextual Info: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

Contextual Info: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

Contextual Info: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

Contextual Info: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

ASTM-B16-85

Contextual Info: 1111687 36 PIN SSOP TO .6 DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

transistor smd c5c

Abstract: transistor SMD R4d SMD diode C5C smd transistor r4D smd transistor R2C smd diode r4a MLQP48 smd transistor r4c r2d SMD Transistor IRS2093
Contextual Info: IRAUDAMP8 120W x 4 Channel Class D Audio Power Amplifier Using the IRS2093M and IRF6665 By Jun Honda, Yasushi Nishimura and Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of IRAUDAMP8 Demo board;

IRAUDAMP7D

Abstract: IRAUDAMP7D-150 SCHEMATIC 300w power amplifier stereo IRS2092 power amplifier circuit diagram with pcb
Contextual Info: IRAUDAMP7D 25W-500W Scalable Output Power Class D Audio Power Amplifier Reference Design Using the IRS2092 Protected Digital Audio Driver By Jun Honda, Manuel Rodríguez, Wenduo Liu CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of

95-132I25

Abstract: AMS-QQ-N-290
Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

Indium Tac Flux 020

Abstract: CU-106A CU-106A shelf life of BGAS DALE SOMC k type thermocouple utl USR(pet) gold embrittlement
Contextual Info: APPENDIX A Surface Tension and the Self-Centering of BGAs ITS PHYSICS ARE REVIEWED T O G E TH E R W I T H SOLDER TYPE, TEM PERATURE A N D THE PRESENCE OF C O N T A M I N A T E S A N D H O W THEY IN F LU E N C E By Steve G r e a t h o u s e THE S E L F - A L I G N I N G M O V E M E N T OF DEVICES D U R I N G

AMP7S-100

Abstract: diode z104 IRAUDAMP7S-150 7G17A-220MR IRAUDAMP7S-100 inverter 12v to 220 ac mosfet based
Contextual Info: IRAUDAMP7S 25W-500W Scalable Output Power Class D Audio Power Amplifier Reference Design Using the IRS2092S Protected Digital Audio Driver By Jun Honda, Manuel Rodríguez, Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of

SMD TRANSISTOR R59

Abstract: 1N4148 equivalent SMD
Contextual Info: IRAUDAMP19 75W/4 x 2 Channel Class D Audio Power Amplifier Using the IR4301 By Jun Honda, Liwei Zheng CAUTION: International Rectifier suggests the following guidelines for safe operation and handling of IRAUDAMP19 Demo board; • Always wear safety glasses whenever operating Demo Board

SLLA014

Abstract: SN65LVDS31 SN65LVDS32 LVDS connector 30
Contextual Info: Low-Voltage Differential Signaling Design Notes Kevin Gingerich, Technical Staff, Texas Instruments Inc. September 1997 SLLA014 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

BY 028

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-68302 QFP to PGA Adapter for Motorola MC68302 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

132 pin PGA socket

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 96-160M65 - QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 96-128M80 - QFP to PGA Adapter for EIAJ 128 Position, .0315 [.80] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

100-PGM13069-30

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.