E15155 Search Results

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

Contextual Info: 1. M e c h a n ic a l D im e n s io n s : 3 ,0 0 1 2 . S c h e m a t ic : M ox 1. Solderability: Leads shall meet MIL—STD—2D2, Method 208D for solderability. 2. 3. 4. 5. Flammability: UL94-V-0, ASTM oxygen index: > 28% , Temperature rating: 155'C. UL file E151556,

motherboard canada ices 003 class b

Abstract: motherboard n232 canada ices 003 class b motherboard pm8399 motherboard canada ices 003 GB4943-1995 pc motherboard canada ices 003 class b motherboard intel ices 003 class b mercury computer motherboard motherboard canada ices 003 ec 100
Contextual Info: Intel Modular Server System MFSYS25 Technical Product Specification Intel order number E15155-003 Revision 1.0 September, 2007 Enterprise Platforms and Services Division Revision History Intel® Modular Server System MFSYS25 TPS Revision History Date July, 2007

manual motherboard canada ices 003 class b

Abstract: motherboard canada ices-003 class b motherboard canada ices 003 class b motherboard canada ices-003 manual motherboard canada ices 003 class a manual motherboard canada ices 003 class b user Intel Modular Server System MFSYS25 motherboard INTEL ICES-003 MOTHERBOARD CIRCUIT MANUAL ices-003 motherboard intel ices 003 class b
Contextual Info: Intel Modular Server System MFSYS25/MFSYS35 Technical Product Specification Intel order number E15155-006 Revision 1.3 November, 2008 Enterprise Platforms and Services Division Revision History Intel® Modular Server System MFSYS25/MFSYS35 TPS Revision History

P445

Contextual Info: Schem atic: n n RIGHT LEFT .j E lectrical S p e c i f i c a t i o n s : @25°C Is o la tio n V o lta g e : 1 5 0 0 V rm s Is o la tio n V o lta g e : 5 0 0 V rm s Turns 16 M in im u m In s e rtio n O u tp u t to P445+6) RX 1CT;1CT ±3% M inim um @100KHz 10OmV 8mADC

Contextual Info: 1. M echanical D im ensions: TOP VIEW 2 . S c h e m a tic : BOTTOM VIEW E le ctrica l S p ec ific atio n s: OCL: 2 2 0 u H ± 5 % 3 .2 ± 0 .3 @ 79BKHz 1V DCR: 2 .5 O hm s Max Irm s: 0 .2 5 0 Max B ased on 4D°C Tem p Rise Q: 35 Typ @ 796KHz _L CL SRF: 6.2M H z Min

208H

Contextual Info: 1. M echanical D im ensions: 2. Sch em atic: Top View 3. E lectrical Specification s: OCL: 4 7 u H ± 2 0 % I.O K H z, 0.25V Q: 4 0 Min @ 100KHz, 0.1V DCR: 0.011 Isat: Ohms Max 28.0Adc Based on 15%TYP drop in OCL 28.0Adc (Based on 10%TYP drop in OCL at —4 0 ‘ C)

HS 2303

Abstract: astm 2303
Contextual Info: 1. M echan ical Dim ensions: 2. S c h e m a tic : o- A 3 4 .0 0 3 4 .0 0 34.00 O LU U L 9 4 V -0 rated X □ HS Tube 3. E le c t r ic a l S p e c ific a tio n s : OCL: 5uH Typ @10KHz 1V DCR: 0.005 Ohms Typ C urrent Rating: 10 A Max SRF: 175 MHz Typ Voltage Rating:

30-RCT

Abstract: 208H
Contextual Info: Sch em atic: One of Eight 1CT:1 CT RJ45 RX- RD+ 3 o- 8 7 6 5 4 3 2 1 Shld RCT 5 0 RX+ RD- 6 0 - TD+ 1CT: 1CT 1o- TX- TCT 4 0 TD - TX+ 2o- R1 S R2 R3 -L R4 1000pF 2KV R1,R2,R3,R4: 75 OHMS ±1% .J 8 / E lectrical S p ecificatio n s: 25°C Isolation Voltage:

85C77

Contextual Info: Sch em atic: E lectrical S p ecificatio n s: 25°C Isolation Voltage: 1500Vrms INPUT to OUTPUT , 500Vrms(TD to RD) UTP SIDE OCL: 350uH Min @100KHz 100mV 8mADC Rise Time (1 0 — 90%): 2.5ns Typical Insertion Loss (300KHz— 100MHz): — 1.1 dB Maximum Insertion Loss (100MHz— 125MHz): — 1.5dB Maximum

1507

Contextual Info: 1. S c h e m a tic : RJ45 1 o 1CT : 1 TX 2 a 3 o 1C T : 1 4 o RX 5 o 6 o R1 • A A A A /^ R2 R3 naoopF 2KV 7 o R4 8 o9 0 100 R 1 ,R 2 ,R 31R 4 = 7 5 2. E le c tr ic a l S p e c ific a tio n s: 2 5 "'C Isolation Voltage: 1 5 0 0 Vrm s Is o la tio n V o lta g e :

208H

Contextual Info: 1. M echanical D im ensions: 2. Sch em atic: c 3 .0 0 Max 3. E lectrical S p ecificatio n s: 3R9N / 2A 0CL: 3 .9 u H ± 3 0 % ¿0= Q: 1 0 K H z 0 .1 V 12 Min @ 100K H z 0 .1 V DCR: 0 .0 2 7 IDC: 2 .6 0 A Ohm s Typ Max Notes: 1. Solderability: Leads shall meet MIL—STD—202G,

300Hz-3400Hz

Abstract: 007116-1 XFTEL204S
Contextual Info: 1. M echanical D im ensions: 2. S ch em atic: 1 0- 5} res-0 6 Pri Sec 3 o- -O 3. E lectrical 4 Sp ecification s: 25°C Turns Ratio: Pins 1 - 3 : ( 6 - 4 ) = 1:1 ±5% O utput Power: 10mW Typ DCR: 150 Ohms Max, Each Wdg Bandwidth: 2 0 0 H z -4 0 0 0 H z

208H

Abstract: XFATM8Q25
Contextual Info: M ech an ical D im en sio n s: 1. E le c tr ic a l S p e c ific a tio n s: 25°C Isolation: 1.115 Max ° Ocxj tí RCV Turns Ratio: 1CT:1CT PRI:SEC 0.035 — |4|— PRI OCL: 350uH Minimum @100KHz 100mV 8mAdc Insertion Loss: 1.0 dB Max @100KHz - 100MHz Return Loss: — 18dB Min, 2—30 MHz

Contextual Info: 2. S c h e m a tic : SHLD 3 Lefi LED 10 ~1 6 14 irrnrrr- Sec. ° - f Rig ht LED 1 1 O- 12 o- 14 3 2 8 5 6 7 f i TX RCV 3. E lectrical Specification: @25° Isolation: 1500 Vrms 0.5mA 2Sec Pri to Sec Isolation: 500 Vrms 0.5mA 2sec (TX to RCV) Turns Ratio: 1CT:2.5CT ±2% (TX)

Contextual Info: 2 . S c h e m a tic : 1. D im ensions: 0 .8 1 3 I CT: 1 CT Max XFMRS YYWW -a 7 RX + -0 5 CT -a 6 RX- CD o XFATM6TH1 O CT:1 CT T D + 15 oCT 14-0- jv^r-N r-j T D - 16 o- E le c tr ic a l G 00.020 Is o la tio n V o lta g e : Rise T im e In s e rtio n 350uH

Contextual Info: 1. M ech an ical D im en sion s: 0.535 Max X 2. S c h e m a tic : 0.138 Max XFMRS XFHCL4 -4 R 3 N YYWW o moo o in o TOP VIEW SIDE VIEW 3. E le c tr ic a l S p e c ific a tio n s: @25°C 0.542 OCL: 4.3uH±30% @100KHz 0.25V OADC OCL: 2.2uH±30% @100KHz 0.25V 6.1 Adc

LT 2806

Contextual Info: 1. M echanical D im ensions: 2. S c h e m a tic : 0 . 018 ± 0.002 C 0 .2 5 0 MAX E 0.100 2 3 □ o 5EC0NDARY in XFMRS oo >$ XFWB 0976D • YYWW v y 5 o d 4 m -H CM < PRIMARY lO f"- lT) o 3. E le c tric al S p e c ific atio n s: @25DC y . D 0.20Û IMPEDANCE RATIO: Pins 6 - 4 ) ; < 1 - 3 ) = 1 : 2 5 ± 3 %

XFHCl6HP-220M

Abstract: 208H 20 EL
Contextual Info: 1. M echanical D im ensions: 2 . Sch em atic: Top view Side view xJ o -L- O O. ro Front View Q_ ro 3. E lectrical Specification s: 25°C G 3 .7 Typ J_ I > —1 B B OCL: 2 2 u H ± 2 0 % @ 100KHz, U DCR: 135m 0h m s Max F 7 .4 Typ 1.0V Q: tbd Min @ 100KHz, 1.0V

200-4000HZ

Contextual Info: 2. S c h e m a tic : 1. M e c h a n ic a l D i m e n s i o n s : P ri Sec 10- -0 8 40- - 05 3. Electrical Specifications: @25nC TURNS RATIO: 1:1 ±2% C h a m fe r lo ca te s te rm . #1 Reflects 600 ohm s a t PRI with 332 ohm s Load on SEC -0 .6 8 8 |— 0 .0 3 5

101M

Abstract: 208H
Contextual Info: 1. M echanical Dim ensions: 2. Sch em atic: E lectrical Sp ecification s: OCL: 10 0 u H ± 2 0 % @ 1 00K H z 0.1V DCR: 0.550 O hm s Max IDC: 0.300A Max B ase d on 30 % Drop in OCL Q: 30Min @ 1 00K H z 0.1V SRF: 5MHz Min 5.2 Notes: 1. Solderability: Leads shall meet MIL—STD—202G,

UL1850

Abstract: 105VRMS
Contextual Info: 1. M e c h a n ic a l D im e n s i o n s : 2. S ch e m atic: Secondary PrirYiary C h ip (L in e ) 1 o- o 10 4 o- -o 7 2 O- -o 9 5 ° - ' v- o 6 3. E l e c t r i c a l S p e c i f i c a t i o n s : Im p e d a n c e : D esigned to re fle c t 10 0 O hm s on th e p rim a ry

208H

Abstract: 057 98B
Contextual Info: 2. S c h e m a t i c : 1. D im e n s i o n s : Line Chip 1 O- XFMRS □ 9 4o- X F 1313 o7 20 -3 2 H D 5 YYWW A 0.560 C Max 0.536 3 . E l e c t r i c a l S p e c i f i c a t i o n s : @ 25DC Max 0CL: Pins LL Pins 1 -5 1 -5 3 .0 m H = t6% @ 10KHz 0.1V, Tie P ins 2 - 4