DUAL-IN-LINE 16 DIP Search Results

C08 27M

Contextual Info: TELEDYNE COMP ONE NT S aaE ûW bOa D GODt , 4 S 4 T SD5501 SEMICONDUCTOR N-CHANNEL DEPLETION-MODE 4-CHANNEL D-MOS FET ARRAY ORDERING INFORMATION Sorted Chips in Waffle Pack 16-Pin Ceramic Duat In-Line Package 16-Plrt Plastic Dual In-Line Package SD5501CHPSD5501J

TDP1603

Abstract: TDP1403
Contextual Info: TDP Vishay Thin Film Molded, Dual-In-Line Resistor, Through Hole Network FEATURES Actual Size Vishay Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio tolerance to

Contextual Info: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100 Ω to 100 kΩ resistance range. The networks feature ratio

Contextual Info: TDP www.vishay.com Vishay Dale Thin Film Molded, Dual-In-Line Thin Film Resistor, Through Hole Network FEATURES Actual Size Vishay Dale Thin Film offers two standard circuits in a 14 pins and 16 pins molded dual-in-line over a 100  to 100 k resistance range. The networks feature ratio

TDA1220B

Abstract: tda 100w mono toko coil 7k TOKO 10K TOKO KACS 6A65 ferrite rod antenna TDA1220 TOKO CERAMIC FILTER 455 4A7525N
Contextual Info: TDA1220B AM-FM QUALITY RADIO The TDA1220B is a monolithic integrated circuit in a 16-lead dual in-line package. It is intended for quality receivers produced in large quantities. The functions incorporated are: DIP-16 Plastic 0.25 AM SECTION – Preamplifier and double balanced mixer

GDIP1-T16

Abstract: GDIP1T-16
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Frit Seal Packages CERDIP F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A) LEAD FINISH c1 16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL E M -Bbbb S C A-B S -C- S1 0.200

Braze Dual-In-Line 16 Packages

Abstract: CDIP2-T16
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages SBDIP D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C) LEAD FINISH c1 -A- 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE -DBASE METAL E b1 M (b) M -Bbbb S C A - B S SECTION A-A

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC To Top / Package Lineup / Package Index DIP-16P-M03 EIAJ code :∗DIP016-P-0300-1 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-16P-M03 16-pin plastic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C01 EIAJ code :∗DIP016-G-0300-2 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C01 16-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C02 EIAJ code :∗DIP016-G-0300-3 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C02 16-pin ceramic DIP

somc1603

Abstract: SOMC-1601 SOMC1601 DALE SOMC1603 resistor somc1603 somc1403 somc-1403 SOMC20 SOMC140 SOMC1405
Contextual Info: SOMC Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Medium Body, Small Outline, Molded DIP, Surface Mount FEATURES • Isolated, bussed and dual terminator schematics available • 14, 16 or 20 terminal package • Molded case construction • Thick film resistive elements

tape head pre amplifier

Abstract: TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

TAPE RECORDER bias

Abstract: TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

D16-4148

Abstract: D16-4150
Contextual Info: D16-4148 And D16-4150 Switching Diode Array 8700 E. Thomas Road Scottsdale, AZ 85251 602 941-6300 FEATURES • • • 8 Isolated lines Standard 16 pin Dual-In-Line Package UL 94V-0 Flammability Classification MECHANICAL • • • • • Molded 16 Pin Dip

MAD1108

Contextual Info: MAD1108 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: 602 941-6300 Fax (602) 947-1503 Switching Diode Array FEATURES • • • 8 Diode Array Standard 16 pin Dual-In-Line Package UL 94V-0 Flammability Classification MECHANICAL • • • • Molded 16 Pin Dip

16-Pin Plastic DIP

Abstract: DIP-16P-M05
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC To Top / Package Lineup / Package Index DIP-16P-M05 EIAJ code :∗DIP016-P-0300-3 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold Package width 283 mil

"multiplier accumulator"

Abstract: 64 bit booth multiplier 16 bit multiplier
Contextual Info: b »V2 o < i 5 *J TACT1010-65E 16-BIT BY 16-BIT MULTIPLIER/ACCUMULATOR 361 i D 2834, DECEMBER 1986 7 - 7^ • jb OR N DUAL-IN-LINE PACKAGE 16-Bit by 16-Bit Parallel Multiplication/Accumulation TOP VIEW • 35-Bit-Wide Accumulator • Inputs are TTL-Voltage Compatible

41cw

Contextual Info: 41CE M , 41CW(L) Dual 2-Line to 4-Line Decoder/Demultiplexer The 41CE(M) and 41CW(L) devices are bipolar, NPN, sealed junction, silicon integrated circuits. They are available in 16-pin plastic DIPs. Truth Table Inputs Sei ect B A X L L Strobel X L H H L L

LS153

Contextual Info: LS153 Dual 4- to 1-Line Data Selector/Multiplexer The LS153 is a bipolar, NPN, sealed-junction, silicon integrated circuit. It is manufactured in lowpower Schottky technology and is available in a wire-bonded, 16-pin plastic DIP or surface mount package. l 7 | 2G

N8T3404N

Contextual Info: 8T3404 Signetics Latch High Speed 6-Bit Latch Product Specification Logic Products FEATURES • Low input load current: ,25mA max., 1/6 standard TTL input load • Minimum line reflection: low voltage diode input clamp • Outputs sink 10mA min. • 16-pin dual in-line package

tea2025l

Contextual Info: UNISONIC TECHNOLOGIES CO.,LTD. TEA2025 LINEAR INTEGRATED CIRCUIT STEREO AUDIO AMPLIFIER „ DESCRIPTION The UTC TEA2025 is a monolithic integrated audio amplifier in a 16-pin plastic dual in line package. It is designed for portable cassette players and radios.

Contextual Info: SOGC 01,03, 05 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Small Outline Molded Dip, 01, 03, 05 Schematics, 16 or 20 Pins FEATURES .110" [2.79mm ] maximum seated height Rugged, molded case construction .050" [1.27mm] lead spacing Reduces total assembly costs

tea2025

Abstract: 5.1 audio amplifier diagram schematic audio amplifier 6v diagram AMPLIFIER 5W 100 audio amplifier circuit diagram AUDIO AMPLIFIER SCHEMATIC circuit diagram stereo amplifier 3v AUDIO AMPLIFIER CIRCUIT DIAGRAM
Contextual Info: TEA2025 2.5W * 2 Audio amplifier STEREO AUDIO AMPLIFIER DESCRIPTION The BM TEA2025 is a monolithic integrated audio amplifier in a 16-pin plastic dual in line package. It is designed for portable cassette players and radios. FEATURES *Working Voltage down to 3V