| SOT380-1 |
|
NXP Semiconductors
|
Footprint for wave soldering |
|
Original |
PDF
|
| SOT380-1 |
|
NXP Semiconductors
|
Plastic leaded chip carrier; 20 leads |
|
Original |
PDF
|
| SOT38-1 |
|
Philips Semiconductors
|
|
|
Original |
PDF
|
| SOT385-1 |
|
NXP Semiconductors
|
Plastic leadless module carrier |
|
Original |
PDF
|
| SOT385-1_122 |
|
NXP Semiconductors
|
PLLMC; bulk pack; 12NC ending 122 |
|
Original |
PDF
|
| SOT386-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT386-1 |
|
Original |
PDF
|
| SOT386-1 |
|
NXP Semiconductors
|
Plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm |
|
Original |
PDF
|
| SOT387-3 |
|
NXP Semiconductors
|
Plastic shrink quad flat package;128 leads (lead length 1.6 mm); body 14 x 20 x 2.72 mm |
|
Original |
PDF
|
| SOT389-1 |
|
Philips Semiconductors
|
Plastic Low Profile Quad flat Package |
|
Original |
PDF
|
