SOT386 Search Results

Contextual Info: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

sot386

Abstract: MA26
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

TQFP100

Abstract: tQFP100 package MS-026 MS-026 tqfp100
Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD

MS-026

Abstract: 137e20 TQFP100 MS-026 tqfp100
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B

TQFP100

Abstract: TQFP-100
Contextual Info: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1

pz5064c

Abstract: PZ5064C10BC PZ5064C7A44 PZ5064C7BC PZ5064N10A44 PZ5064N10BC PZ5064N12A44 PZ5064N12BC PZ5064C10A44
Contextual Info: INTEGRATED CIRCUITS PZ5064C/PZ5064N 64 macrocell CPLD with enhanced clocking Preliminary specification Supersedes data of 1998 May 05 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 64 macrocell CPLD with enhanced clocking

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

PZ3128

Abstract: PZ3128IS12A84 PZ3128IS15A84 PZ3128-S12A84 PZ3128-S12BB1 PZ3128-S15A84 PZ5128 OH12 OG5 109
Contextual Info: INTEGRATED CIRCUITS PZ3128 128 macrocell CPLD Product specification Supersedes data of 1997 Apr 28 IC27 Data Handbook Philips Semiconductors 1997 Aug 12 Philips Semiconductors Product specification 128 macrocell CPLD PZ3128 FEATURES Table 1. PZ3128 Features

Contextual Info: INTEGRATED CIRCUITS m m s ^ e eI It Xiiinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family, For more technical or sales information, please see: www.xilinx.com XCR5128 128 macrocell CPLD Product specification Supersedes data of 1997 Aug 12

TQFP100 footprint

Abstract: SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave

Contextual Info: INTEGRATED CIRCUITS im m l y i E I TI Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family, For more technical or sales information, please see: www, xilin i* com XCR3128 128 macrocell CPLD Product specification Supersedes data of 1997 Aug 12

PZ5128CS7

Contextual Info: Philips Sem iconductors Product specification 128 macrocell CPLD with enhanced clocking PZ5128C/PZ5128N FEATURES DESCRIPTION • Industry’s first TotalCMOS PLD - both CM OS design and process technologies The PZ5128C/PZ5128N CPLD Com plex Program mable Logic

Contextual Info: INTEGRATED CIRCUITS NOTICE: SEE ATTACHED ERRATA WHICH FOLLOWS THIS DOCUMENT FOR INFORMATION REGARDING CHANGED SPECIFICATIONS PDI1394L21 1394 full duplex AV link layer controller Preliminary specification Supersedes data of 1998 Dec 16 Philips Semiconductors

Contextual Info: Product specification Philips Semiconductors 128 macrocell CPLD with enhanced clocking PZ5128C/PZ5128N FEATURES DESCRIPTION • Industry’s first TotalCMOS PLD - both CMOS design and process technologies The PZ5128C/PZ5128N CPLD Complex Programmable Logic

Contextual Info: Philips Semiconductors Preliminary specification 64 macrocell CPLO with enhanced clocking FEATURES PZ3064A/PZ3064D Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ3064A/PZ3064D Usable gates

PZ5064CS10

Abstract: PZ5064CS10BC PZ5064CS10A44 PZ5064CS7BC PZ5064CS7A44 PZ5064CS7BP PZ5064NS10A44 PZ5064NS10BC PZ5064NS12A44 PZ5064NS12BC
Contextual Info: INTEGRATED CIRCUITS Xifinx has acquired the entire Philips CoolRunoer 8 £«& ^S g X«i5c ft « »0» »g »0» Low Power CPLD Product Family, For more technical or sales information^ please see; www.xilinx.com l XCR5064C 64 macrocell CPLD with enhanced clocking

XCR3128A

Contextual Info: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3128A 128 macrocell CPLD with enhanced clocking Preliminary specification IC27 Data Handbook

TQFP80 footprint dimensions

Abstract: QFP44 footprint STK403-040
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manchester verilog decoder

Abstract: Philips Semiconductors Selection Guide pzlcp AN057
Contextual Info: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices CPLDs Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22v10 pal

Abstract: pal 002 PZ3128 PZ3128-S12A84 PZ3128-S12BB1 PZ3128-S12BP PZ3128-S15A84 PZ3128-S15BB1 PZ3128-S15BP PZ5128
Contextual Info: Philips Sem iconductors Product specification 128 macrocell CPLD PZ3128 Table 1. PZ3128 Features FEATURES • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ3128 Usable gates • Fast Zero Power FZP™ design technique provides ultra-low

JEDEC B12-43

Abstract: pal 002 PZ3128 PZ5128 PZ5128IS15A84 PZ5128-S10A84 PZ5128-S10BB1 PZ5128-S12A84 PZ5128-S12BB1 PZ5128-S7A84
Contextual Info: Philips Sem iconductors Product specification 128 macrocell CPLD PZ5128 Table 1. PZ5128 Features FEATURES • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ5128 Usable gates • Fast Zero Power FZP™ design technique provides ultra-low

TQFP80 footprint

Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

philips sq8

Abstract: QPP80
Contextual Info: Philips Semiconductors Package information Soldering SURFACE MOUNTED PACKAGES INTRODUCTION There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave