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Semtech Corporation TDS5311P.C 1-LINE 53V 24A TVS EOS SLP2020P6 - Bulk (Alt: TDS5311P.C)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	TDS5311P.C	Bulk		26 Weeks	3,000	1 - 10 - 100 - 1000 - 10000 $0.37	Buy Now
Microchip Technology Inc CDS5311UR-1 Current Regulator _ DO-213AB, Projected EOL: 2049-02-05
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	CDS5311UR-1			32 Weeks		1 $143.67 10 $143.67 100 $143.67 1000 $143.67 10000 $143.67	Buy Now
Master Electronics	CDS5311UR-1					1 - 10 - 100 $129.68 1000 $129.68 10000 $129.68	Buy Now
Microchip Technology Inc CDS5311UR-1/TR Current Regulator _ DO-213AB, Projected EOL: 2049-02-05
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	CDS5311UR-1/TR			32 Weeks		1 $143.82 10 $143.82 100 $143.82 1000 $143.82 10000 $143.82	Buy Now
Master Electronics	CDS5311UR-1/TR					1 - 10 - 100 $129.82 1000 $129.82 10000 $129.82	Buy Now

DS5311 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
32E32 Abstract: 3MD12 Contextual Info: DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task	OCR Scan	ds5311fp 68hc11 32e32 3md12	PDF
8132 Abstract: passivation DS5003 Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: July 11, 1994 To: Subject: PRODUCT CHANGE NOTICE – F42101 Description: DS500X/DS53XX Passivation Change The DS500X and DS53XX products (DS5001, DS5002, DS5003, DS5004, DS5311, DS5340) will undergo a change in passivation from the current single layer 10 KA Hotwall OXIDE passivation to a 10	Original	f42101 ds500x/ds53xx ds500x ds53xx +8ds5001 ds5002 ds5003 ds5004 ds5311 ds5340 8132 passivation	PDF
DS2311 Contextual Info: JUN li 1993 DS5311FP P R E L IM IN A R Y PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task	OCR Scan	ds5311fp 68hc11 03736c ds2311	PDF
68hc11a Contextual Info: JU N i l 1993 DS5311FP PRELIM INARY PALLAS DS5311FP 68HC11 Softener Chip s e m ic o n d u c to r FEATURES • Softens 68HC11-based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV program/data storage - Serial bootstrap loading - In-system program changes adapt HC11 to task	OCR Scan	ds5311fp 68hc11 68hc11-based 68hc11a	PDF
hc11 Abstract: simm 68hc11 ds5311fp Contextual Info: DS5311FP FULL DATA SHEET AVAILABLE - CALL 214-450-3836 DALLAS SEMICONDUCTOR DS5311FP 68HC 11 S oftener Chip PACKAGE OUTLINE FEATURES • Softens 68HC11 -based systems - Converts up to 64K bytes of CMOS RAM into lithium-backed NV prograrrtfdata storage - Serial bootstrap loading	OCR Scan	ds5311fp 68hc11 ds2311 72-pin +4ds5311fphc11 ds5311 hc11 simm 68hc11	PDF
Contextual Info: 8M x 64 Bit 3.3V BUFFERED EDO DIMM Extended Data Out EDO DRAM DIMM 6480AsEDM4G10TK 168 Pin 8Mx64 EDO DIMM Buffered, 4k Refresh, 3.3V Pin Assignment General Description The 6480AsEDM4G10TK is a 8Mx64 bit, 10 chip, 3.3V, 168 Pin DIMM module consisting of (8) 8Mx8	Original	6480asedm4g10tk 8mx64 ds531-1	PDF
DS1235YW Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885	Original	ds87520 ds87523 ds87530 ds2118 +15ds1302 ds1315 ds17485 ds1721 ds83ch20 ds1235yw ds1480 ds1235ywl ds2228-1mg ds1242 ds2402 ds2403 ds1990a-f50 ds2228-4mg ds1833a	PDF
SOFTENER Abstract: DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40 Contextual Info: D S63« P R O D U C T P R E V IE W DALLAS . DS53xx Micro Softener Chips s e m ic o n d u c to r FEATURES PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed	OCR Scan	ds53xx ds5340 ds5303 ds2340 +9ds2301 softener ds63 ds5311fp intel end of life 80c196 register file ds5396fp hd6303 nec v40	PDF
register file Abstract: INTEL END OF LIFE 80C196 80C196 BOOT HD6301 Contextual Info: DS53xx PRODUCT PREVIEW DALLAS SEMICONDUCTOR FEATURES DS53xx Micro Softener Chips PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed NV program/data storage	OCR Scan	ds53xx -ds5340fp ds5340 ds5303 +7ds2340 ds2301 06149q register file intel end of life 80c196 80c196 boot hd6301	PDF
DS1235YW Abstract: DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241 Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE DS87520 TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1585 DS1306 DS17485 DS1307 DS17885 DS1315 DS1803 DS1623 DS1806 DS1627 DS2430A DS1670 DS2437 DS1673	Original	ds87520 ds87523 ds87530 ds2118 +14ds1302 ds1721 ds83ch20 ds12885b ds1235yw ds1235ywl ds2228-1mg ds1242 ds1868 ds1187 ds1480 ds1671 ds83520 ds1241	PDF