DPZ256 Search Results

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Abstract: 6115 l500m DPZ256
Contextual Info: RPR 1 3 1993 DPZ256X32V3 256K X 32 FLASH ELPROM VERSA-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D P Z 2 5 6 X 3 2 V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

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Contextual Info: V V, i -5 l i £7 DPZ256W16A3 SD PM ; Dense-Pac Microsystems, Inc ^ 2S6K X 16 FLASH EEPROM DENSE-STACK M ODULE PRELIMINARY DESCRIPTION: The DPZ256W16A3 “ DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: D E N S E -P A C 8 Megabit FLASH EEPROM M IC R f S YS TE M S DPZ256X32IV3 D E S C R IP T IO N : The DPZ256X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC) mounted on a co-fired ceramic substrate. It offers

Contextual Info: 4 Megabit FLASH EEPROM DPZ256X16In3 DESCRIPTION: The DPZ256X16In3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a

050I

Contextual Info: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight

Contextual Info: 4 Megabit FLASH EEPROM DPZ256X16In3 DESCRIPTION: The DPZ256X16In3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a

Contextual Info: f n n i M ' • DPZ256X8A3 - * V * Dense-Pac Microsystems, Inc. ^ _ 256K X 8 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY DESCRIPTION: The DPZ256X8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic

Contextual Info: 4 Megabit FLASH EEPROM B E M E - F A C M IC'RÙ& YST E-MsS D P Z 2 5 6 X 1 6 ln 3 D E S C R IP T IO N : The DPZ256X16ln3 '"STACK'7 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ. Available in straight

Contextual Info: DENSE-PAC ,A s .v MICROSYSTEMS 4 MEGABIT FLASH EEPROM J DPZ256X16ln3 D E S C R IP T IO N : The D P Z 256X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight

Contextual Info: DENSE-PAC 8 MEGABIT FLASH EEPROM DPZ256X32IV3 M I C R O S Y S T E M S D E S C R IP T IO N : The D P Z 2 5 6 X 3 2 IV 3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadiess Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

IA315

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit FLASH EEP R O M DPZ256S32IW DESCRIPTION: The D P Z 2 5 6 S 3 2 IW is a 256K x 32 high-speed C M O S FLASH E E P R O M module comprised of eight 128K x 8 monolithic C M O S FLA SH EE P R O M 's, an advanced high-speed C M O S decoder, and

Contextual Info: DENSE-PAC 8 Megabit FLASH EEPROM DPZ256S32IW MI CROS YSTEMS DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CM OS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EEPROM 's, an advanced high-speed CM OS decoder, and decoupling capacitors surface mounted on an FR-4 SIM M substrate.

DPZ256

Contextual Info: 8 Megabit FLASH EEPROM DPZ256X32IV3 DESCRIPTION: The DPZ256X32IV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: 8 Megabit FLASH EEPROM DPZ256S32IW DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CMOS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EEPROM’s, an advanced high-speed CMOS decoder, and decoupling capacitors surface mounted on an FR-4 SIMM substrate.

ma071.02

Contextual Info: D P Z 2 5 6 X 1 6 A 3 256 X 16 FLASH EEPROM G ULLW IN G STACK M ODULE PRELIMINARY DESCRIPTION: The DPZ256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

62A26

Contextual Info: DENSE-PAC 8 Megabit FLASH EEPROM M ICROSYSTEMS DPZ256X32IV3 D E S C R I P T IO N : The D PZ256X32IV 3 "VER SA -STA CK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: □PM Dense-Pac Microsystems, In c DPZ256X16V3 ^ 25 6K X 16 FLASH EEPRO M VERSA-STACK M O D U LE PRELIMINARY DESCRIPTION: T h e D P Z 2 5 6 X 1 6 V 3 " V E R S A - S T A C K " m o d u le is a revolutionary new memory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers

Contextual Info: MFk DPZ256X16H3 COPM 256 X 16 FLASH EEPROM CULLW ING STACK MODULE PRELIMINARY DESCRIPTION: The D PZ256X16H 3 FLASH “ STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC slacked and leaded for surface mount

Contextual Info: DEN SE-PAC MICROSYSTEMS x P ,/b^ • 8 m e g a b it f l a s h e e p ro m \V DPZ256X32IV3 D E S C R IP T IO N : T he D P Z 2 5 6 X 3 2 IV 3 "VERSA-STACK" m odule ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

Contextual Info: DENSE-PAC MIC ROS Y ST E MS 8 Megabit FLASH EEPRO M DPZ256S32IW DESCRIPTION: The DPZ256S32IW is a 256K x 32 high-speed CMOS FLASH EEPROM module comprised of eight 128K x 8 monolithic CMOS FLASH EEPROM's, an advanced high-speed CMOS decoder, and decoupling capacitors surface mounted on an FR-4 SIMM substrate.

Contextual Info: 4 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ256X16ln3 DESCRIPTION: The DPZ256X16ln3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded packages, or mounted on a

DP5Z

Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS