DPS51 Search Results

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32ML7DPS512X32MW MI G R Ö S Y S ! B M S DESCRIPTION: The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: 8 Megabit High Speed CM OS SRAM D E N S E - P A C DPS512X 16Cn3/DPS512X 16Bn3 M IC RO SYSTEM S DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ''STACK7' modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .

Contextual Info: 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

DPS512X8MKN3

Contextual Info: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 PRELIMINARY DESCRIPTION: The DPS512X8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable

DPS512X32MKY5

Contextual Info: 16 Megabit High Speed SRAM DPS512X32MKY5 PRELIMINARY DESCRIPTION: The DPS512X32MKY5 is the 512K x 32 SRAM module that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four 512K x 8 SRAM’s that are configured as 512K x 32.

DPS512S8AP

Abstract: 165001
Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS512S8AP DESC RIPTIO N: The DPS512S8AP is a high speed 5 1 2K x 8 high-density, lo w -p o w e r static RAM m odule comprised of four high speed ceramic 128K x 8 monolithic SRAM's, an advanced high-speed CMOS

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Abstract: we 510
Contextual Info: D EN S E - P A C 8 Megabit CMOS SRAM M I C R O S Y S T E M S DPS512X 16n3 DESCRIPTION: The DPS512X16n3 SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J” leaded

50-PIN

Abstract: DPS512X16A3
Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabits CM OS SRAM DPS512Xl6n3 D ESCRIPTIO N ; The DPS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded

Dense-Pac Microsystems

Abstract: 1024KX8 SRAM 35nS
Contextual Info: D E N S E -P A C 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 M I C R O S Y S T E M S DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC .

Contextual Info: DENSE-PAC X P ^ _ 4 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512S8BN DESCRIPTION: The DPS512S8BN is a high speed military 5 1 2 K X 8 high-density, static RAM module comprised of four high speed ceramic 128K X 8 monolithic SRAM's, an

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32MFn3 High Speed S R A M "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO.

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

DPS512S8

Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS512S8 EJ4/E L4/RJ4/RL4 M I C R O S Y S T E M S DESCRIPTION: The DPS512S8EJ4/EL4/RJ4/RL4 surface mount SRAM modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines four

Contextual Info: DENSE-PAC MICROSYSTEMS 16 Megabit CMOS SRAM DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: P IN -O U T D IA G R A M The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 16Cn3/DPS512X 16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS512S8U D E S C R IP T IO N : The DPS512S8U isa 5 1 2 K X 8 high-density, low-power static RAM module comprised of four 128K X 8 monolithic SRAM's, an advanced high-speed CM O S decoder and decoupling capacitors

Contextual Info: □PM DPS512X32AV3 Dense-Pac Microsystems. Inc. HIGH SPEED 512K X 32 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPS512X32AV3 “ VERSA-STACK" m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable leadless C hip Carriers SLCC m ounted on a

Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 MICROSYSTEMS PRELIMINARY D ESC R IP TIO N : The DPS512X8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired

DPS512E8MGG

Contextual Info: 512Kx8, 55 - 120ns, DLCC 30A142-00 B 4 Megabit CMOS SRAM DPS512E8MGG DESCRIPTION: The DPS512E8MGG is a monolithic 512K x 8 Static Random Access Memory SRAM fabricated using CMOS technology. It is designed for use in high density, low power applications. All pins are TTL

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Abstract: DPS512M8MKJ DPS512M8KH
Contextual Info: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512M8MKH/DPS512M8MKJ DESCRIPTION: The DPS512M8MKH/DPS512M8MKJ are 4,194,304 bit High Speed Satic Random Access Memory monolithics organised as 524,288 words by 8 bits. The DPS512M8MKH/DPS512M8MKJ uses 8 common

Contextual Info: DENSE-PAC 12 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X24MFn3 ADVANCED INFORMATION DESCRIPTION : The DPS512X24MFn3 High Speed SRAM "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32MXP MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "J"-Leads.