DIP160 Search Results

DIP-16

Abstract: DIP16
Contextual Info: 0.800" 0.225" 0.025" 0.062" 0.500" 0.275" 0.475" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

dip16

Abstract: DIP-16
Contextual Info: 0.800" 0.225" 0.025" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

SOIC 8 pcb pattern

Contextual Info: 20.32mm [0.800"] 1.27mm typ. [0.050"] 17.78mm [0.700"] 6.99mm 12.07mm [0.275"] [0.475"] 0.64mm typ. [0.025"] 1 6.35mm [0.250"] 3 3.24mm [0.127"] 0.46mm dia. typ. [0.018"] 2 15.24mm [0.600"] -01W version 3 level, 0.64mm [0.025"] Sqr. WW pin 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

Contextual Info: 1 22 1 22 11 12 0.800" 0.100" 1 12 0.400" 3 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.

Contextual Info: 20.32mm [0.800"] 5.72mm [0.225"] 0.64mm [0.025"] typ. 1.59mm 12.70mm [0.063"] [0.500"] 6.99mm 12.07mm [0.275"] [0.475"] 1.27mm [0.050"] typ. Top View 1 3.99mm [0.157"] 7.29mm [0.287"] 2 2.54mm [0.100"] typ. Ø 0.46mm [Ø 0.018"] typ. Front View 3 7.62mm [0.300"]

Contextual Info: 17.78mm [.700] 20.32mm [.800] Top View 7.62mm [.300] 3 1 Side View 7.54mm [.297] PC-DIP/DIP16-02 2 3.15mm [.124] 15.24mm [.600] 0.51mm dia. typ. [.020] 17.78mm [.700] 12.88mm [.507] Side View PC-DIP/DIP16-02 W 0.89mm sqr. [.035] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

SO16E

Abstract: SO16E Package PC-SOIC/DIP24-04 SO20G
Contextual Info: L 0.65mm pitch 3.18mm [0.125"] T Y 7.01mm [0.276"] Pin1 0.025" pitch X 0.33mm [0.013"] Top View 1 3.26mm [0.128"] 17.78mm [0.700"] 4.84mm [0.190"] 0.46mm [0.018"] 3 2 15.24mm [0.600"] End View Side View Side View 2.54mm [0.100"] Bottom View Part Number 1 Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]

DIP-16

Abstract: DIP16
Contextual Info: 0.800" 0.225" 0.025" 0.140" 0.150" 0.350" 0.055" 0.050"±0.001" pitch Top View 0.122" 0.475" PC-SOIC/ DIP16-04 0.250" Side View 0.300" 0.018"±0.001" dia typ 0.825" 0.140" PC-SOIC/ DIP16-04W 0.193" 0.700" 0.025"±0.002" Sqr typ 0.100" typ. Description: PACKAGE CONVERTOR

SO8G

Abstract: SO14C DIP-08
Contextual Info: 0.65mm pitch 3.53mm [0.139"] L 7.42mm [0.292"] Pin1 T Y 0.65mm pitch X 3.26mm [0.128"] Top View 10.16mm [0.400"] 1 7.23mm [0.284"] 0.46mm [0.018"] 2 7.62mm [0.300"] 3 Side View End View 2.54mm [0.100"] Part Number Bottom View 1 Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]

SO16E

Abstract: SO16E Package SO20G SO28B
Contextual Info: 0.025" pitch L 3.18mm [0.125"] Y T 7.01mm [0.276"] Pin1 X 0.025" pitch 10.16mm [0.400"] Top View 1 3.26mm [0.128"] 4.84mm [0.190"] 0.46mm [0.018"] 3 7.62mm [0.300"] 2 End View Side View 2.54mm [0.100"] Bottom View Part Number 1 Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]