DFN0806 Search Results

Contextual Info: MMBT3906FA 40V PNP SMALL SIGNAL TRANSISTOR IN DFN0806 Features Mechanical Data • BVCEO > -40V   IC = -200mA high Collector Current      PD = 435mW Power Dissipation 2 0.48mm package footprint, 16 times smaller than SOT23 0.4mm height package minimizing off-board profile

Contextual Info: BC857BFA 45V PNP SMALL SIGNAL TRANSISTOR IN DFN0806 Features Mechanical Data • BVCEO > -45V   IC = -100mA high Collector Current   PD = 435mW Power Dissipation  0.48mm package footprint, 16 times smaller than SOT23  Moisture Sensitivity: Level 1 per J-STD-020

7B SMD

Contextual Info: Surface Mount SMD Packaging Reel and Carrier Tape Specifications MINIMUM PACKING QUANTITY DFN Series (Notes 4) DFN0806 DFN0808 Bulk Type Quantity NA NA NA DFN1006 NA DFN1010 NA DFN1409, DFN1410 DFN/QFN3030 (Note 5) DFN4030-12 DFN4030-12 Type B, C, D NA NA

Contextual Info: BC847BFA 45V NPN SMALL SIGNAL TRANSISTOR IN DFN0806 Features Mechanical Data • BVCEO > 45V   IC = 100mA high Collector Current   PD = 435mW Power Dissipation  0.48mm package footprint, 16 times smaller than SOT23  Moisture Sensitivity: Level 1 per J-STD-020

Contextual Info: MMBT3904FA 40V NPN SMALL SIGNAL TRANSISTOR IN DFN0806 Features Mechanical Data • BVCEO > 40V   IC = 200mA high Collector Current      PD = 435mW Power Dissipation 2 0.48mm package footprint, 16 times smaller than SOT23 0.4mm height package minimizing off-board profile

PQMD12

Contextual Info: Small & Powerful NXP MOSFETs and bipolar transistors in DFN1010 First 3 A transistors in a 1.1 mm² leadless plastic package This new product series, housed in tiny leadless packages and ideal for use in tightfootprint power management and load switches, includes small yet powerful high-Ptot

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Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
Contextual Info: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint

AA112A

Abstract: IPC-7351A
Contextual Info: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10

Contextual Info: DMP22D4UFA 20V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary NEW PRODUCT V BR DSS -20V Features and Benefits RDS(ON) max ID max TA = 25°C 1.9Ω @ VGS = -4.5V -330mA 2.4Ω @ VGS = -2.5V -300mA 3.4Ω @ VGS = -1.8V -250mA 5Ω @ VGS = -1.5V -200mA •

Contextual Info: DMP22D4UFA 20V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary N EW PRODU CT V BR DSS -20V Features and Benefits RDS(ON) max ID max TA = 25°C 1.9Ω @ VGS = -4.5V -330mA 2.4Ω @ VGS = -2.5V -300mA 3.4Ω @ VGS = -1.8V -250mA 5Ω @ VGS = -1.5V -200mA •