DDR3 CONSTRAINTS Search Results

"DDR3 SDRAM"

Abstract: ddr3 Designs guide DDR3 layout DDR3 layout guidelines DDR3 SDRAM Memory DDR3 timing diagram DDR3 phy Verilog DDR3 memory model ddr3 sdram stratix 4 controller DDR3 phy pin diagram
Contextual Info: Design Guidelines for Implementing DDR3 SDRAM Interfaces in Stratix III Devices Application Note 436 February 2007, v1.0 Introduction DDR3 SDRAM is the latest generation of DDR SDRAM technology, with improved power, higher data bandwidth, and enhanced signal quality by

Contextual Info: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: Aerodynamic DDR3 DIMM Sockets, Low Seating Plane LSP , Low Level Contact Resistance (LLCR), Lead-free, 1.00mm Pitch, 240 circuits The ultimate high-density memory interconnect for multi-processor server chipsets, Aerodynamic DDR3 DIMM sockets maximize air flow as well as space and

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

w3j128m72

Abstract: w3j512m72
Contextual Info: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M72K-XPBX W3J512M72K-XLBX *ADVANCED 4GB – 512M x 72 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

L9D340G64BG2I15

Abstract: DDR3-1066 DDR3-1333 L9D340G64B L9D340G64BG2
Contextual Info: PRELIMINARY INFORMATION L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 22mm, 13 x 21 matrix w/ 271balls

Contextual Info: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM – 1.5V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1,333, 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count

Contextual Info: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count

Contextual Info: W3J256M72G-XLBX W3J256M72G-XPBX ADVANCED* 2GB - 256M x 72 DDR3 SDRAM FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Package: • 375 Plastic Ball Grid Array PBGA , 20.5mm x 23.5mm  40%* Space savings vs. FBGA  Reduced part count

W3J512M32G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

M41K256M32

Contextual Info: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

w3j128m72

Abstract: W3X128M72-XBI mrd 14b W3J128M72G-XPBX WEDC Cross Reference
Contextual Info: W3J128M72G-XLBX W3J128M72G-XPBX 1GB – 128M x 72 DDR3 SDRAM FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  30%* Space savings vs. FBGA  Package:  Reduced part count • 375 Plastic Ball Grid Array PBGA , 20.5mm x 21.5mm

DDR3 pcb layout

Abstract: DDR3 layout DDR3 DIMM 240 pin names DDR3 pcb layout motherboard DDR3 pcb design DDR3 DIMM 240 pin DIMM DDR3 signal assignments DDR3 timing diagram DDR3 DRAM layout DDR3 impedance
Contextual Info: Challenges in implementing DDR3 memory interface on PCB systems: a methodology for interfacing DDR3 SDRAM DIMM to an FPGA Phil Murray, Altera Corporation Feras Al-Hawari, Cadence Design Systems, Inc. CP-01044-1.1 February 2008 Undoubtedly faster, larger and lower power per bit, but just how do you go about

W3J512M40G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32GT-XB2X W3J512M40G T -XB3X *PRELIMINARY 2GB – 512M x 32/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count

DDR3-1066

Abstract: DDR3-1333 L9D320G32BG6 0-575V
Contextual Info: ADVANCE INFORMATION L9D320G32BG6 2.0 Gb, DDR3, 64 M x 32 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 16mm x 12mm, 10 x 13 matrix w/ 129 balls • Matrix ball pitch: 1.00mm

M41K256M32

Contextual Info: W3J512M32K-XBX W3J512M32/36/40K T -XB2X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:  Reduced part count

MT41K256M8DA

Abstract: MT41K256M8DA-125 micron ddr3 DDR3 sdram MT41K256M8 640NS PPAP MANUAL for automotive industry
Contextual Info: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •

MT41K256M8DA

Abstract: MT41K256M8DA-125 MT41K MT41K256M8 mt41k256m8da-125-k 96-Ball MT41K256M8DA125K
Contextual Info: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •

Contextual Info: Preliminary‡ 2Gb: x4, x8, x16 Automotive DDR3 SDRAM Features Automotive DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 banks MT41J256M8 – 32 Meg x 8 x 8 banks MT41J128M16 – 16 Meg x 16 x 8 banks Options1 Features • • • • • • • • • • •

Contextual Info: W3J512M72G-XPBX PRELIMINARY* 4GB-512M x 72 DDR3 SDRAM FEATURES  23% I/O reduction vs. FBGA  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  Address/control terminations included  Package:  Differential clock terminations included • 543 Plastic Ball Grid Array PBGA , 23 x 32mm

b10 45g

Abstract: srt 8n PS-AC150 DDR3-1066 DDR3-1333
Contextual Info: ADVANCE INFORMATION L9D345G72BG5 4.5 Gb, DDR3, 64 M x 72 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: • Vcc=VccQ=1.5V ± 0.075V • 1.5V center-terminated, push/pull I/O • Package: 25mm x 25mm, 16 x 16 matrix w/ 255 balls • Matrix ball pitch: 1.00mm