NT5TU128M8DE
Abstract: NT5TU64M16DG nt5tu64m16dg-Bd NT5TU128M8DE-BD NT5TU256M4DE nt5tu64m NT5TU64M16 NT5TU64M16DG-3C NT5TU64M16DG-3CI NT5TU64M16DG-BE
Contextual Info: NT5TU256M4DE / NT5TU128M8DE / NT5TU64M16DG NT5TB256M4DE / NT5TB128M8DE / NT5TB64M16DG 1Gb DDR2 SDRAM Feature CAS Latency Frequency -37B/-37BI -3C/-3CI -AD/-ADI -AC/-ACI/-ACL -BE -BD DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 DDR2-1066 4-4-4 5-5-5 6-6-6
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nt5tu256m4dent5tu128m8dent5tu64m16dgnt5tb256m4de+13nt5tb128m8dent5tb64m16dg-37b/-37biddr2-533ddr2-667ddr2-800nt5tu64m16dg-bdnt5tu128m8de-bdnt5tu64mnt5tu64m16nt5tu64m16dg-3cnt5tu64m16dg-3cint5tu64m16dg-be
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IMX6DQ6SDLSRM
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.3, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion
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MB91F467EA
Contextual Info: MB91460E-DS705-00002-1v3-E.fm Page 1 Wednesday, September 29, 2010 9:47 AM FUJITSU SEMICONDUCTOR DATA SHEET DS705-00002-1v3-E 32-bit Microcontroller CMOS FR60 MB91460E Series MB91F467EA • DESCRIPTION MB91460E series is a line of general-purpose 32-bit RISC microcontrollers designed for embedded control
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IMX6DQ6SDLSRM
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.3, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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MMCX decoupling TOOL
Abstract: 6691 USB connector
Contextual Info: AM3517/05 ARM Microprocessor www.ti.com SPRS550 – OCTOBER 2009 1 AM3517/05 ARM Microprocessor 1.1 Features AM3517/05 ARM Microprocessor: – Software Compatible with OMAPTM 3 Processors* – MPU Subsystem • 500-MHz ARM Cortex-A8 Core • NEON SIMD Coprocessor and Vector
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am3517/05sprs550500-mhz16-bit+3491-pinmmcx decoupling tool6691 usb connector
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XC3S700A-FG484
Abstract: XC3S700AFG484 MT47H32M16BN-3 MT47H32M16 LCD with picoblaze MT47H32M16BN MT47H32M16XX-5E T-2420 T2420 Thermonics T 2420
Contextual Info: Application Note: Spartan-3A FPGA Family Implementing DDR2-400 Memory Interfaces in Spartan-3A FPGAs R Author: Eric Crabill XAPP458 v1.0.1 July 9, 2009 Summary High-performance consumer products and their requirement for low-cost, high-bandwidth memory create demand for high-performance DDR2 memory interfaces. Xilinx offers a
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ddr2-400xapp458xc3s700a-fg484xc3s700afg484+8mt47h32m16bn-3mt47h32m16lcd with picoblazemt47h32m16bnmt47h32m16xx-5et-2420t2420thermonics t 2420
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sony cmos sensor imx 117
Abstract: sony IMX 117 imx 117 sensor sony cmos sensor imx 174 sony IMX 135 sony CMOS sensor imx 135 225/sony cmos sensor imx IMX 206 imx 117
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 3, 03/2014 MCIMX6QxAxxxxC MCIMX6QxAxxxxD MCIMX6DxAxxxxC MCIMX6DxAxxxxD i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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sony cmos sensor imx 117sony imx 117imx 117 sensorsony cmos sensor imx 174+5sony imx 135sony cmos sensor imx 135225/sony cmos sensor imximx 206imx 117
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Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony cmos sensor imx 175
Abstract: sony IMX 132 CMOS Sony IMX 183 sony IMX 145 image sensor DDR21 imx cmos sony sony IMX 140 sensor sony cmos sensor imx 071
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 8, 04/2010 MCIMX35 i.MX35 Applications Processors for Industrial and Consumer Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Revisions 2.0 and 2.1 Ordering Information See Table 1 on page 3 for ordering information.
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mcimx35sr2cecmcimx353cvm5bmcimx353dvm5bmcimx357cvm5b+13mcimx357dvm5bmcimx35mx353mx357arm1136jf-ssony cmos sensor imx 175sony imx 132 cmossony imx 183sony imx 145 image sensorddr21imx cmos sonysony imx 140 sensorsony cmos sensor imx 071
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samsung EMMC user guide
Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information
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imx53aecmcimx53xamx53xa1080i/p+10samsung emmc user guidejedec lpddr2samsung lpddr2 mobile ramsamsung emmc 4.5mx53ugn78camba axi dma controller designer user guidelpddr2 layoutsony vtr m15 diagramddr3 jedec
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sony cmos sensor imx 174
Abstract: Sony "IMX 175" CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.1, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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lfxp2-40e
Abstract: LVCMOS25 LD48 LFXP2-17E-5FTN256C HB1004 ispLEVER project Navigator route place LFXP2-5E-5QN IPUG35 LFXP2-8E
Contextual Info: LatticeXP2 Family Handbook HB1004 Version 02.9, May 2011 LatticeXP2 Family Handbook Table of Contents May 2011 Section I. LatticeXP2 Family Data Sheet Introduction Features . 1-1
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hb1004tn1144tn1220tn1143+8lfxp2-40elvcmos25ld48lfxp2-17e-5ftn256cisplever project navigator route placelfxp2-5e-5qnipug35lfxp2-8e
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Samsung eMMC 4.41
Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information
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HYS72T128000GR
Abstract: HYS72T128020GR HYS72T64000GR MO-237 PC2-3200R "sd card" 2GB
Contextual Info: D at a S h ee t, V 0 .8 2 , O c t. 2 00 3 H YS72 T 640 00 GR 5 12 M B y t e H YS72 T 128 00 0GR ( 1 G B y t e ) H YS72 T 128 02 0GR ( 1 G B y t e ) H YS72 T 256 02 2GR ( 2 G B y t e ) DDR 2 Reg istered D IMM Modu les M em or y P r od uc t s N e v e r s t o p
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hys72t64000grhys72t128020grhys72t128000grhys72t256022gr+7240-pinpc2-3200r/-4300r/-5300r1024mbmo-237sd card" 2gb
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sony cmos sensor imx 175
Abstract: sony CMOS sensor imx 135 MCIMX357 MCIMX353 SS44 marking Sony imx 145 free ba 4918 sony IMX 132 MCIMX355 MCIMX35SR2CEC
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11
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arco ss32 capacitor
Abstract: timer after time-ON MCIMX251 121 MAPBGA 8 mm x 8 mm ARM9 400mhz dallas ds2502 LCD for mobile phone CMOS Camera Module CSI pbijtov18 434 8pins
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data i.MX25 Applications Processor for Automotive Products Document Number: IMX25AEC Rev. 9, 06/2012 MCIMX25 Silicon Version 1.2 Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch 1 Introduction
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imx25aecmcimx25arco ss32 capacitortimer after time-on+8mcimx251121 mapbga 8 mm x 8 mmarm9 400mhzdallas ds2502lcd for mobile phonecmos camera module csipbijtov18434 8pins
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MB91F467MA
Abstract: medialb MB91F467M 0002B
Contextual Info: FUJITSU MICROELECTRONICS DATA SHEET DS07-16613-1E 32-bit Microcontroller CMOS FR60 MB91460M Series MB91F467MA • DESCRIPTION MB91460M series is a line of general-purpose 32-bit RISC microcontrollers designed for embedded control applications which require high-speed real-time processing, such as consumer devices and on-board vehicle
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MB91F467PA
Abstract: BGA896 MB91F467P MB91460P PPG30 MB91F465PA
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-16615-2E 32-bit Microcontroller CMOS FR60 MB91460P Series MB91F465PA, MB91F467PA • DESCRIPTION MB91460P series is a line of general-purpose 32-bit RISC microcontrollers designed for embedded control applications which require high-speed real-time processing, such as consumer devices and on-board vehicle
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sony cmos sensor imx 117
Abstract: sony cmos sensor imx 185 free ba 4918 Sony imx 145 sony CMOS sensor imx 135 TDA 0200 IMX351
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 9, 08/2010 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information.
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MB91F467CB
Abstract: MB91F463 MB91F465CA MB91F467C GP027 diode MB91F463C MB91F460 low noise, 795 nm, 7 mw MB91F467CBPMC MB91F465C
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-16610-2E 32-bit Microcontroller CMOS FR60 MB91460C Series MB91F463CA*1, F465CA, F467CA, F467CB • DESCRIPTION MB91460C series is a line of general-purpose 32-bit RISC microcontrollers designed for embedded control applications which require high-speed real-time processing, such as consumer devices and on-board vehicle
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ds07-16610-2e32-bitmb91460cmb91f463ca+13f465caf467caf467cbmb91f467cbmb91f463mb91f465camb91f467cgp027 diodemb91f463cmb91f460low noise, 795 nm, 7 mwmb91f467cbpmcmb91f465c
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sony cmos sensor imx 176
Abstract: Sony IMX 145 CMOS sony CMOS sensor imx 135 Sony imx 134 cmos sensor Sony IMX 183 c.d.m. technology us2 sony IMX 132 CMOS ARM1136JF-S usb pin configuration sony CMOS sensor imx 136 49135-1
Contextual Info: Document Number: MCIMX35SR2AEC Rev. 8, 04/2010 MCIMX35 i.MX35 Applications Processors for Automotive Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Revisions 2.0 and 2.1 Ordering Information See Table 1 on page 3 for ordering information.
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MCIMX257DVM4
Abstract: MAPBGA-347 IMX253
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX25CEC Rev. 4, 06/2010 i.MX25 Applications Processor for Consumer and Industrial Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Case 2107 12 x 12 mm, 0.5 mm Pitch
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DDR3 phy 100 pin diagram
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 1, 3/2011 MCIMX53xD This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX53xD Applications
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