DATE FOR IC COMPONENT Search Results

Cross Reference and Multilayer Ceramic Chip Capacitor Part Numbering

Abstract: EIA RS-198 taiyo yuden date code RS-198D
Contextual Info: Specifications Document No. Date : 24.FEB.2010 M ultilayer Ceram ic Chip C apacitor NICKEL BASED ELECTRO DES M LC EE100B 5 ^ em Multilayer Ceramic Capacitor Class n CC0805 1. Scope This specification covers multilayer chip type ceramic capacitor (Pb-Free) for use (for reflow soldering)

2ED020I12-F1

Abstract: 2ED020I12-F 2ed020i12 EUPEC TD 56 N 08 2ED020I12-F2 2ED020I12 IGBT driver circuit diagram eupec igbt general purpose DUAL LOW SIDE DRIVER 2ED020I12 IGBT SCHEMATIC igbt modules Michael Hornkamp
Contextual Info: Datasheet and Application Prepared by: Andreas Volke Approved by: Michael Hornkamp S/N: 010-04 Date of publication: 2003-12-05 Status: Target Data EiceDRIVER 2ED020I12-F Dual IGBT Driver IC for eupec Low and Medium Power IGBT Modules eupec GmbH Max-Planck-Straße 5

DS1285

Abstract: ds1285q
Contextual Info: DALLAS DS1285, DS1285Q Real Time Clock s e m ic o n d u c t o r FEATURES PIN ASSIGNMENT • Drop-in replacement for IBM AT computer clock/ca­ lendar • Pin configuration closely matches MC146818A • Counts seconds, minutes, hours, days, day of the week, date, month, and year with leap year compen­

GP3842

Contextual Info: ISSUED DATE :2003/05/20 REVISED DATE :2004/09/30B GP3842 HIGH PERFORMANCE CURRENT MODE CONTROLERS Description The GP3842 is high performance fixed frequency current mode controllers. This is specifically designed for Off-Line and DC TO DC converter applications offering the designer a cost-effective solution with minimal external components.

Weller WECP-20 Schematic

Contextual Info: TH E IN FO RM A TIO N CONTAINED H E R EIN IS CONSIDERED ’’PR O PR IET A RY ” T O BEL FUSE IN C. AND SHALL NOT BE CO PIED , R EPRO DUCED O R DISCLOSED W ITH O U T THE W R ITTEN A PPRO VAL O F B EL FUSE INC. / I COMPONENTSfor a CO NNECTED P LA N E T^/

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DMA506E1 Silicon PNP epitaxial planar type For general amplification DMA206E1 in SMini6 type package • Package  Features  High transition frequency fT  Contributes to miniaturization of sets, reduction of component count.

DMC56404

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DMC56404 Silicon NPN epitaxial planar type For digital circuits DMC26404 in SMini6 type package • Features  Package  Low collector-emitter saturation voltage VCE(sat)  Contributes to miniaturization of sets, reduction of component count.

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DMC9610E Silicon NPN epitaxial planar type For digital circuits DMC5610E in SSMini5 type package • Features  Package  Low collector-emitter saturation voltage VCE(sat)  Contributes to miniaturization of sets, reduction of component count.

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DRC5A44E Silicon NPN epitaxial planar type For digital circuits Complementary to DRA5A44E • Features  Package  Low collector-emitter saturation voltage VCE(sat)  Contributes to miniaturization of sets, reduction of component count.

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DRA5A44E Silicon PNP epitaxial planar type For digital circuits Complementary to DRC5A44E • Features  Package  Low collector-emitter saturation voltage VCE(sat)  Contributes to miniaturization of sets, reduction of component count.

SZNUP4301MR6T1G

Contextual Info: NUP4301MR6T1G, SZNUP4301MR6T1G Low Capacitance Diode Array for ESD Protection in Four Data Lines http://onsemi.com SZ/NUP4301MR6T1G is a micro−integrated device designed to provide protection for sensitive components from possible harmful electrical transients; for example, ESD electrostatic discharge .

Contextual Info: This product complies with the RoHS Directive EU 2002/95/EC . DMG963HC Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For digital circuits • Features  Package  Low collector-emitter saturation voltage VCE(sat)  Contributes to miniaturization of sets, reduction of component count.

C11531E

Contextual Info: DATA SHEET COMPOUND TRANSISTOR BP1 SERIES on-chip resistor PNP silicon epitaxial transistor For mid-speed switching The BP1 Series is an N type small signal transistor and enables the reduction of component counts and downsizing of sets due to on-chip resistors. This transistor is especially ideal for use in household electronic appliances and OA

Contextual Info: DATA SHEET COMPOUND TRANSISTOR BB1 SERIES on-chip resistor NPN silicon epitaxial transistor For mid-speed switching The BB1 Series is an N type small signal transistor and enables the reduction of component counts and downsizing of sets due to on-chip resistors. This transistor is especially ideal for use in household electronic

tk19 infrared

Abstract: TK19 IR receiver ir tk19 Telefunken tk19 tk19 CNY65 CNY65A tk19 001 CNY66 Optocoupler 601
Contextual Info: CNY64/ CNY65/ CNY66 Vishay Telefunken Optocoupler with Phototransistor Output Description The CNY64/ CNY65/ CNY66 consist of a phototransistor optically coupled to a gallium arsenide infrared-emitting diode in a 4-lead plastic package. The single components are mounted in opposite oneanother, providing a distance between input and

Q67037-A1034P

Abstract: TUA6100
Contextual Info: Product Brief TUA 6100 Direct Conversion IC for Digital QPSK Satellite Signals TUA 6100 The TUA 6100 direct down conversion IC in BICMOS technology combines bipolar analogue functions with a CMOS-PLL on one chip. This integration reduces external discrete components

tk19 infrared

Abstract: tk19 Telefunken tk19 ir tk19 VISHAY tk19 tk19 200 CNY65 ir-diode tk19 001
Contextual Info: CNY65Exi Vishay Telefunken Optocoupler with Phototransistor Output Description The CNY65Exi consists of a phototransistor optically coupled to a gallium arsenide infrared-emitting diode in a 4-lead plastic package. The single components are mounted in opposite oneanother, providing a distance between input and

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT N/A COMPONENT N /A . N /A . RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. MATERIAL DF REVISIONS D IS T x o LTR FINISH PCB SH ELL HOUSING BRASS PER A S TM - B —1 6 — PTEE ELUORCARBON

Contextual Info: SP6134 Dual Supply Synchronous Buck Controller FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ VCC 1 3V to 15V Step Down Achieved Using Dual Input Small 10-Pin MSOP Package 2A to 15A Ouput Capability Highly Integrated Design, Minimal Components UVLO Detects Both VCC and VIN

Contextual Info: SP6132 Preliminary Dual Supply Synchronous Buck Controller FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 3V to 12V Step Down Achieved Using Dual Input 2A to 15A Ouput Capability Highly Integrated Design, Minimal Components UVLO Detects Both VCC and VIN

SP6134

Abstract: DO5010P-332HC FDS6676S MBR0530 SP6132 SP6134CU TDK EMI filter 30a
Contextual Info: SP6134 Dual Supply Synchronous Buck Controller FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ VCC 1 3V to 15V Step Down Achieved Using Dual Input Small 10-Pin MSOP Package 2A to 15A Ouput Capability Highly Integrated Design, Minimal Components

pwm 300kHz 30A 1.1V

Abstract: DO5010P-152HC DO5010P-332HC FDS7088N3 MBR0530 RLF12560T-2R7N110 SP6132 SP6132CU mosfet specification
Contextual Info: SP6132 Wide Input, 300KHz Synchronous PWM Controller FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 3V to 12V Step Down Achieved Using Dual Input 2A to 15A Ouput Capability Highly Integrated Design, Minimal Components UVLO Detects Both VCC and VIN

sot363 marking code 385

Abstract: 564 sot363 NSTB60ADW1T1 SMD310
Contextual Info: NSTB60ADW1T1 PNP General Purpose and NPN Bias Resistor Transistor Combination • • • • • Simplifies Circuit Design Reduces Board Space Reduces Component Count Available in 8 mm, 7 inch/3000 Unit Tape and Reel ESD Rating – Human Body Model: Class 1B

MATERIAL SAFETY DENATURED ALCOHOL

Abstract: TC-2707
Contextual Info: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.