D3575 Search Results
D3575 Price and Stock
ROHM Semiconductor BD3575YFP-ME2IC REG LIN POS ADJ 500MA TO252-5 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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BD3575YFP-ME2 | Cut Tape | 2,444 | 1 |
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BD3575YFP-ME2 | 11 Weeks | 2,000 |
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BD3575YFP-ME2 | 1,285 |
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Rubycon Corporation 63MU335MD35750CAP FILM 3.3UF 20% 63VDC 2220 |
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63MU335MD35750 | Cut Tape | 1,797 | 1 |
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63MU335MD35750 |
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63MU335MD35750 | 1,665 |
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ROHM Semiconductor BD3575YHFP-MTRIC REG LIN POS ADJ 500MA HRP-5 |
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BD3575YHFP-MTR | Digi-Reel | 1,366 | 1 |
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BD3575YHFP-MTR | 3 | 1 |
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Rubycon Corporation 50MU475MD35750CAP FILM 4.7UF 20% 50VDC 2220 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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50MU475MD35750 | Cut Tape | 1,213 | 1 |
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50MU475MD35750 |
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50MU475MD35750 | Cut Tape | 440 | 0 Weeks, 1 Days | 1 |
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Rubycon Corporation 16MU226MD35750CAP FILM 22UF 20% 16VDC 2220 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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16MU226MD35750 | Cut Tape | 899 | 1 |
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16MU226MD35750 | 460 |
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16MU226MD35750 | Reel | 2,500 | 500 |
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16MU226MD35750 | Cut Tape | 710 | 0 Weeks, 1 Days | 1 |
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16MU226MD35750 | 53 |
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D3575 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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ASTM-D991
Abstract: ASTM -D1665 astm d991 D3575-D ASTM ASTM B1221M eh16a 101-C D991 D3575-B
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D3575-W 104ohm-cm D3575-D D3575-B 101-C ASTM-D991 ASTM -D1665 astm d991 D3575-D ASTM ASTM B1221M eh16a 101-C D991 D3575-B | |
54AC16821
Abstract: 54ACT16821 74AC16821 74ACT16821 D-3575
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OCR Scan |
54AC16821, 54ACT16821 74AC16821, 74ACT16821 20-BIT TI0252â D3575. 300-mil 380-mil 25-mil 54AC16821 74AC16821 D-3575 | |
Contextual Info: MU POLYMER MULTI-LAYER CAPACITORS MU NEW SERIES Capacitors for audio equipment ◆FEATURES ・Best suited for audio equipment. ・Surface-mounted device. ・Lead free reflow soldering is available. ・Flow soldering is available. ・RoHS compliance. ◆CAUTION |
Original |
63MU682â Z12012 63MU103â 63MU153â 63MU223â 63MU333â Z22012 | |
37700Contextual Info: Description: Protektive Pak’s Cushion Grade Static Dissipative Foam is a non-abrasive, closed-cell Polyethylene Foam Compounded for Permanent ESD Control Properties. The ESD protective properties will not degrade; the foam is designed not to flake, slough, or |
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D3575-91 D2575-91 37700 | |
Contextual Info: 薄膜高分子積層コンデンサ ST POLYMER MULTI-LAYER CAPACITORS ST シリーズ SERIES UPGRADE ◆特 長/FEATURES ・面実装品。 Surface-mounted device. ・鉛フリーリフローはんだ付けが可能。 Lead free reflow soldering is available. |
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63ST154â A13216 63ST224â A23216 63ST334â B13225 63ST474â B23225 63ST684â C14532 | |
Tr431
Abstract: 1N1525 cs1256hg BSF17 dd04 18DB6A B1274 transistor 1N34A MP LT236 SN76
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OCR Scan |
25T12 Z1012 Z1014 Z1018 AA138 AA140 AA142 AA200 AA21Q AA300 Tr431 1N1525 cs1256hg BSF17 dd04 18DB6A B1274 transistor 1N34A MP LT236 SN76 | |
54AC16821
Abstract: 54ACT16821 74AC16821 74ACT16821 31D9
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OCR Scan |
20-BIT 54AC16821, 54ACT16821 74AC16821, 74ACT16821 TI0252â 300-mii 380-mil 25-mll 500-mA 54AC16821 54ACT16821 74AC16821 31D9 | |
D-3575
Abstract: FED-STD-101 10E8 1021BA D3575-91 D3575
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Original |
D3575-91 DS111-1993 1021BA D2575-91 D-3575 FED-STD-101 10E8 1021BA D3575 | |
Contextual Info: ST POLYMER MULTI-LAYER CAPACITORS ST SERIES ◆FEATURES ・Surface-mounted device. ・Lead free reflow soldering is available. ・RoHS compliance. ◆CAUTION ST series shall be used in only reflow method. Do not use in flow, dipping, and VPS soldering method. |
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63ST473â A13216 63ST683â 63ST104â 63ST154â 63ST224â A23216 | |
12665Contextual Info: Description: Desco’s Statfree Cushion Grade Static Dissipative Foam is a non-abrasive, closed-cell Polyethylene Foam Compounded for Permanent ESD Control Properties. The ESD protective properties will not degrade; the foam is designed not to flake, slough, or contaminate products. The foam will electrically couple |
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Considerations75-91 D2575-91 12665 | |
37680Contextual Info: Description: This foam is suitable for protection of static sensitive devices and assemblies, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes. Features: • Conductive crosslink polyethylene foam, RTT < 10E4 ohms |
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D991-85 0218A Re0218A D3575-84 37680 | |
Contextual Info: ST POLYMER MULTI-LAYER CAPACITORS ST UPGRADE SERIES ◆FEATURES ・Surface-mounted device. ・Lead free reflow soldering is available. ・RoHS compliance. ◆CAUTION ST series shall be used in only reflow method. Do not use in flow, dipping, and VPS soldering method. |
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Toler223â Z12012 63ST333â Z22012 63ST473â A13216 63ST683â 63ST104â | |
63ST154A13216Contextual Info: 薄膜高分子積層コンデンサ ST POLYMER MULTI-LAYER CAPACITORS ST シリーズ SERIES UPGRADE ◆特 長/FEATURES ・面実装品。 Surface-mounted device. ・鉛フリーリフローはんだ付けが可能。 Lead free reflow soldering is available. |
Original |
0122F 63ST103A13216 63ST153A13216 63ST223A13216 63ST333A13216 63ST473A13216 63ST683A13216 63ST104A13216 63ST154A13216 | |
Contextual Info: POLYMER MULTI-LAYER CAPACITORS ST ST UPGRADE SERIES ◆FEATURES ・Surface-mounted device. ・Lead free reflow soldering is available. ・RoHS compliance. ◆CAUTION ST series shall be used in only reflow method. Do not use in flow, dipping, and VPS soldering method. |
Original |
0122F 63ST103A13216 63ST153A13216 63ST223A13216 63ST333A13216 63ST473A13216 63ST683A13216 63ST104A13216 63ST154A13216 63ST224A23216 | |
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37640Contextual Info: Description: This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes. Features: |
Original |
D3575-84 D2575-84 37640 |