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Eaton Bussmann CS-SP-3-200-333MV 200A CT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CS-SP-3-200-333MV	Bulk			1	1 $224.05 10 $224.05 100 $224.05 1000 $224.05 10000 $224.05	Buy Now
RS	CS-SP-3-200-333MV	Bulk		4 Weeks	1	1 $266.13 10 $244.84 100 $244.84 1000 $244.84 10000 $244.84	Get Quote
Sager	CS-SP-3-200-333MV				1	1 $200.78 10 $186.53 100 $180.70 1000 $180.70 10000 $180.70	Buy Now
Eaton Corporation CS-SP-3-200-333MV Current Transformer Split Core 333mV 200A - Bulk (Alt: CS-SP-3-200-333MV)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	CS-SP-3-200-333MV	Bulk		6 Weeks	1	1 $182.16 10 $173.48 100 $170.57 1000 $170.57 10000 $170.57	Buy Now
Mouser Electronics	CS-SP-3-200-333MV					1 $291.43 10 $291.43 100 $291.43 1000 $291.43 10000 $291.43	Get Quote
Eaton Corporation CS-SP-3-030-333MV Current Sensors - Industrial SPLT CR CS 30:333MV, 1.0%, 0.75"X0.93"
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	CS-SP-3-030-333MV					1 $212.67 10 $166.78 100 $150.22 1000 $150.22 10000 $150.22	Get Quote
Eaton Corporation CS-SP-3-060-333MV Current Sensors - Industrial SPLT CR CS 60:333MV, 0.75%, 0.75"X0.93"
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	CS-SP-3-060-333MV					1 $212.67 10 $166.78 100 $150.22 1000 $150.22 10000 $150.22	Get Quote
Eaton Corporation CS-SP-3-100-333MV Current Sensors - Industrial SPLT CR CS 100:333MV, 0.50%, 0.75"X0.93"
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	CS-SP-3-100-333MV					1 $212.67 10 $166.78 100 $150.22 1000 $150.22 10000 $150.22	Get Quote

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CSSP3 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
FR4 substrat Abstract: CSSP1 fr4+substrate+1.6mm Contextual Info: Direct Link 1096 Products & Technologies Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei	Original		PDF
china mobile phone circuit diagram Abstract: gsm signal amplifier circuit diagram GSM module circuit diagram circuit diagram transceiver signal gsm GSM transceiver WCDMA duplexer D2027 mobile phone schematic diagram gsm switch epcos gsm module datasheet Contextual Info: Direct Link 1092 Applications & Cases RF modules for multimode multi-band mobile phones October 2007 Front-end solutions for world phones RF filter modules for GSM/WCDMA mobile phones must be highly integrated for worldwide use in all frequency bands. EPCOS supplies	Original		PDF
FR4 substrat Abstract: fr4+substrate+1.6mm Contextual Info: Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei	Original		PDF
epcos ltcc Contextual Info: Direct Link 0917 Applications & Cases SAW-Komponenten April 2004 Klein und fein Surface-Acoustic-Wave-Komponenten sind dank ihrer hervorragenden Filtereigenschaften Schlüsselbauelemente der gesamten drahtlosen Kommunikation. Die Miniaturisierung, die sie im Laufe der	Original		PDF
UMTS frontend Abstract: GPS saw-filter B7837 B9501 d1015 Contextual Info: Direct Link 0933 Applications & Cases SAW-Komponenten Januar 2005 Gut verpackte Funktionen Die heutigen Mobiltelefone sind klein, leicht und multifunktional. Mit der dritten Generation des Mobilfunks entwickelt sich das herkömmliche Handy zu einem schnurlosen Multimedia-Terminal. High-End-Geräte werden	Original	D1015 UMTS frontend GPS saw-filter B7837 B9501	PDF
piezoelectric film for power generation Abstract: HTCC cavity duplexer EPCOS SAW Filters Contextual Info: Direct Link 0917 Applications & Cases SAW components April 2004 Tiny and sophisticated Outstanding filter properties make surface acoustic wave components indispensable throughout wireless communications. The miniaturization that they have undergone in recent years has only been made possible	Original		PDF
A00B Abstract: designing with the MC68008 Z80B AM8088 8-Bit Microprocessors CS8259 am8259 reset circuit in MC68008 AM8018 MK68590 Contextual Info: Advanced Micro Devices Interfacing the Am79C90 C-LANCE to 8-Bit Microprocessors Application Note TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1	Original	Am79C90 HLDA7990 CS7990 A00B designing with the MC68008 Z80B AM8088 8-Bit Microprocessors CS8259 am8259 reset circuit in MC68008 AM8018 MK68590	PDF
MC88100 Abstract: MC88200 ctp21 CTP01 MC88204 Contextual Info: 4. 1 U * ÌÌ MOTOROLA Order this document by MC88204/D • SEMICONDUCTOR TECHNICAL DATA Technical Sum m ary 64K-Byte Cache/Memory Management Unit CMMU The MC88204 CMMU is a high-performance, HCMOS VLSI device providing zero-wait-state memory management and data caching. The m emory management unit (MMU) efficiently	OCR Scan	MC88204/D 64K-Byte MC88204 56-entry, MK145BP A26875 MC88100 MC88200 ctp21 CTP01	PDF
piezoelectric film for power generation Abstract: two cavity resonator cavity duplexer epcos ltcc nickel corrosion electroplating Contextual Info: Direct Link 1096 Products & Technologies Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate	Original		PDF
Qualcomm RTR6285 Abstract: RTR6285 Qualcomm RF LTE chipsets QUALCOMM LTE B8757 LV92A Qualcomm RTR6285 TD-scdma qualcomm chipsets b945 B9444 Contextual Info: SAW DEVICE SELECTION TABLE for Application in Mobile Communication Cellular Phone, Cordless Phone, GPS, WLAN, Bluetooth Content Page RF Filters for Cellular Phones Xin1 RF Filters for Cellular Phones Duplexers for Cellular Phones IF Filters for GSM Cellular Phones	Original	QCC12C QCC10B 250Ohm 200Ohm 50Ohm Qualcomm RTR6285 RTR6285 Qualcomm RF LTE chipsets QUALCOMM LTE B8757 LV92A Qualcomm RTR6285 TD-scdma qualcomm chipsets b945 B9444	PDF
FR4 substrate height and thickness Abstract: FR4 substrate HTCC Pressure lithium tantalate LTCC Substrate Duplexers epcos SAW ltcc CSSP3 nickel corrosion electroplating Contextual Info: Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate	Original		PDF
active and passive electronic components Abstract: gsm crosstalk epcos ltcc EPCOS SAW Filters B7837 B9501 LTCC D1015 UMTS transceiver ltcc chip Contextual Info: Direct Link 0933 Applications & Cases SAW components January 2005 Functionality package Compact, light and multifunctional, third-generation mobile phones are veritable wireless multimedia terminals. Today's high-end handsets integrate not only a PDA, digital camera and Bluetooth interface, but	Original	D1015 active and passive electronic components gsm crosstalk epcos ltcc EPCOS SAW Filters B7837 B9501 LTCC UMTS transceiver ltcc chip	PDF
UMTS frontend Abstract: Gunter D2027 GSM LNA BAND III EPCOS GSM Transceiver transceiver gsm wcdma frontend WCDMA TRANSCEIVER GSM-1900 Contextual Info: Direct Link 1092 Applications & Cases HF-Module für Multimode-Multiband-Mobiltelefone Oktober 2007 Frontend-Lösungen für Alleskönner HF-Filter-Baugruppen für GSM/WCDMA-Mobiltelefone müssen für den weltweiten Einsatz hochintegriert sein, um alle Frequenzbänder bedienen zu	Original		PDF