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    Eaton Corporation CS-SP-3-200-333MV

    - Bulk (Alt: CS-SP-3-200-333MV)
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    Avnet Americas CS-SP-3-200-333MV Bulk 9 Weeks 1
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    Eaton Cutler-Hammer CS-SP-3-100-333MV

    SPLIT CORE CS 100A / 333MV, 0.50% ACCURACY, 0.75" X 0.93
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    Eaton Cutler-Hammer CS-SP-3-030-333MV

    SPLIT CORE CS 30A / 333MV, 1.0% ACCURACY, 0.75" X 0.93
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    Eaton Cutler-Hammer CS-SP-3-060-333MV

    SPLIT CORE CS 60A / 333MV, 0.75% ACCURACY, 0.75" X 0.93
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    Eaton Bussmann CS-SP-3-200-333MV

    SPLIT CORE CS 200A / 333MV, 0.5% ACCURAC
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    Sager CS-SP-3-200-333MV 1
    • 1 $200.78
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    CSSP3 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    FR4 substrat

    Abstract: CSSP1 fr4+substrate+1.6mm
    Contextual Info: Direct Link 1096 Products & Technologies Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei


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    fr4 substratcssp1fr4+substrate+1.6mm PDF

    china mobile phone circuit diagram

    Abstract: gsm signal amplifier circuit diagram GSM module circuit diagram circuit diagram transceiver signal gsm GSM transceiver WCDMA duplexer D2027 mobile phone schematic diagram gsm switch epcos gsm module datasheet
    Contextual Info: Direct Link 1092 Applications & Cases RF modules for multimode multi-band mobile phones October 2007 Front-end solutions for world phones RF filter modules for GSM/WCDMA mobile phones must be highly integrated for worldwide use in all frequency bands. EPCOS supplies


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    china mobile phone circuit diagramgsm signal amplifier circuit diagramgsm module circuit diagramcircuit diagram transceiver signal gsm+6gsm transceiverwcdma duplexerd2027mobile phone schematic diagramgsm switch epcosgsm module datasheet PDF

    FR4 substrat

    Abstract: fr4+substrate+1.6mm
    Contextual Info: Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei


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    fr4 substratfr4+substrate+1.6mm PDF

    epcos ltcc

    Contextual Info: Direct Link 0917 Applications & Cases SAW-Komponenten April 2004 Klein und fein Surface-Acoustic-Wave-Komponenten sind dank ihrer hervorragenden Filtereigenschaften Schlüsselbauelemente der gesamten drahtlosen Kommunikation. Die Miniaturisierung, die sie im Laufe der


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    epcos ltcc PDF

    UMTS frontend

    Abstract: GPS saw-filter B7837 B9501 d1015
    Contextual Info: Direct Link 0933 Applications & Cases SAW-Komponenten Januar 2005 Gut verpackte Funktionen Die heutigen Mobiltelefone sind klein, leicht und multifunktional. Mit der dritten Generation des Mobilfunks entwickelt sich das herkömmliche Handy zu einem schnurlosen Multimedia-Terminal. High-End-Geräte werden


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    d1015umts frontendgps saw-filterb7837+1b9501 PDF

    piezoelectric film for power generation

    Abstract: HTCC cavity duplexer EPCOS SAW Filters
    Contextual Info: Direct Link 0917 Applications & Cases SAW components April 2004 Tiny and sophisticated Outstanding filter properties make surface acoustic wave components indispensable throughout wireless communications. The miniaturization that they have undergone in recent years has only been made possible


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    piezoelectric film for power generationhtcccavity duplexerepcos saw filters PDF

    A00B

    Abstract: designing with the MC68008 Z80B AM8088 8-Bit Microprocessors CS8259 am8259 reset circuit in MC68008 AM8018 MK68590
    Contextual Info: Advanced Micro Devices Interfacing the Am79C90 C-LANCE to 8-Bit Microprocessors Application Note TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1


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    am79c90hlda7990cs7990a00b+9designing with the mc68008z80bam80888-bit microprocessorscs8259am8259reset circuit in mc68008am8018mk68590 PDF

    MC88100

    Abstract: MC88200 ctp21 CTP01 MC88204
    Contextual Info: 4. 1 U * ÌÌ MOTOROLA Order this document by MC88204/D • SEMICONDUCTOR TECHNICAL DATA Technical Sum m ary 64K-Byte Cache/Memory Management Unit CMMU The MC88204 CMMU is a high-performance, HCMOS VLSI device providing zero-wait-state memory management and data caching. The m emory management unit (MMU) efficiently


    OCR Scan
    mc88204/d64k-bytemc8820456-entry+6mk145bpa26875mc88100mc88200ctp21ctp01 PDF

    piezoelectric film for power generation

    Abstract: two cavity resonator cavity duplexer epcos ltcc nickel corrosion electroplating
    Contextual Info: Direct Link 1096 Products & Technologies Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate


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    piezoelectric film for power generationtwo cavity resonatorcavity duplexerepcos ltcc+1nickel corrosion electroplating PDF

    Qualcomm RTR6285

    Abstract: RTR6285 Qualcomm RF LTE chipsets QUALCOMM LTE B8757 LV92A Qualcomm RTR6285 TD-scdma qualcomm chipsets b945 B9444
    Contextual Info: SAW DEVICE SELECTION TABLE for Application in Mobile Communication Cellular Phone, Cordless Phone, GPS, WLAN, Bluetooth Content Page RF Filters for Cellular Phones Xin1 RF Filters for Cellular Phones Duplexers for Cellular Phones IF Filters for GSM Cellular Phones


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    qcc12cqcc10b250ohm200ohm+1150ohmqualcomm rtr6285rtr6285qualcomm rf lte chipsetsqualcomm lteb8757lv92aqualcomm rtr6285 td-scdmaqualcomm chipsetsb945b9444 PDF

    FR4 substrate height and thickness

    Abstract: FR4 substrate HTCC Pressure lithium tantalate LTCC Substrate Duplexers epcos SAW ltcc CSSP3 nickel corrosion electroplating
    Contextual Info: Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate


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    fr4 substrate height and thicknessfr4 substratehtccpressure lithium tantalate+5ltcc substrateduplexersepcos saw ltcccssp3nickel corrosion electroplating PDF

    active and passive electronic components

    Abstract: gsm crosstalk epcos ltcc EPCOS SAW Filters B7837 B9501 LTCC D1015 UMTS transceiver ltcc chip
    Contextual Info: Direct Link 0933 Applications & Cases SAW components January 2005 Functionality package Compact, light and multifunctional, third-generation mobile phones are veritable wireless multimedia terminals. Today's high-end handsets integrate not only a PDA, digital camera and Bluetooth interface, but


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    d1015active and passive electronic componentsgsm crosstalkepcos ltcc+6epcos saw filtersb7837b9501ltccumts transceiverltcc chip PDF

    UMTS frontend

    Abstract: Gunter D2027 GSM LNA BAND III EPCOS GSM Transceiver transceiver gsm wcdma frontend WCDMA TRANSCEIVER GSM-1900
    Contextual Info: Direct Link 1092 Applications & Cases HF-Module für Multimode-Multiband-Mobiltelefone Oktober 2007 Frontend-Lösungen für Alleskönner HF-Filter-Baugruppen für GSM/WCDMA-Mobiltelefone müssen für den weltweiten Einsatz hochintegriert sein, um alle Frequenzbänder bedienen zu


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    umts frontendgunterd2027gsm lna+6band iii epcosgsm transceivertransceiver gsmwcdma frontendwcdma transceivergsm-1900 PDF