COMPOUNDS Search Results

SN1004

Abstract: SDR0906 polyester resin enamelled copper wire SN100
Contextual Info: MATERIAL DATA SHEET Material SDR0906 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.726 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

SDR1030

Contextual Info: MATERIAL DATA SHEET Material SDR1030 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.679 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

Sn97-Cu3

Abstract: SDR1806 Sn97Cu3
Contextual Info: MATERIAL DATA SHEET Material SDR1806 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Solder Material group Ferrite Ni-Zn Series Material Weight g 2.3 Iron & Compounds N/A Remainder 100 Zinc & Compounds N/A

Contextual Info: SST-Ribbon Gel-Free Cables Features and Benefits Completely gel-free design No messy filling or flooding compounds eliminate time and labor associated with cleaning ribbons, thereby keeping work and splicing areas cleaner and simplifying splice preparation

TSOP 48 bonding

Abstract: AMI Semiconductor ROM
Contextual Info: AMI A M I MEM l C O N D U C T O R % Packaging Capabilities TSOP Description Surface Mount The Thin Small Outline Package TSOP is a thin ends only package. This package is constructed using the latest low stress molding compounds and bonding technology to provide a package with total body thickness of less then 1.90 mm.

JIS D 5403

Abstract: TMCX118100 sj 2038 appleton clamp 7665s scotchcast 92 7665-S-8 8462 "cross reference" TMCX8875 TMCX402400
Contextual Info: Splice Rejacketing 387 Splice Repair 390 3 M Safety Sock Grounding Kits, Shielded and Jacketed URD Cable 391 Sealing and Grounding 393 3/C Cable Breakout Boots and 3/C Phase Rejacketing System 395 Insulating and Sealing Compounds 408 Mounting Brackets 410

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

B82603

Abstract: max3035 B82603-S0133-M1
Contextual Info: EPCOS Product Family Name Date Version Chokes for high Current B82603-S0xxx-M1 Ring core choke 12.12.2005 1.00 CAS if applicable Construction Element Material group Materials Active Part Metals Copper wire enameled 7440-50-8 Compounds Iron powder 7439-89-6

Weighing scale circuit

Abstract: biomedical datasheet food storage tanks
Contextual Info: Model 65086 Vishay Sensortronics Sanimount Weigh Module FEATURES • Capacity ranges of 1000 to 25000 pounds • Stainless steel construction throughout • All cavities sealed with FDA approved compounds • Mounts directly to floor or structural support

photodiode ge

Abstract: TSAL6200 TSFF5410 TSHA550 TSHF5410 TSUS540 detect radiation
Contextual Info: Physics and Technology Vishay Semiconductors Physics and Technology EMITTERS Materials Infrared emitting diodes IREDs can be produced from a range of different III-V compounds. Unlike the elemental semiconductor silicon, compound III-V semiconductors consist of two or more different elements of group three (e.g.,

abb fid

Abstract: flame detector burner PGC2009 FID detector CE-EX pressure reducing valve air transistor NEC D 586 AIR FLOW DETECTOR applications ABB 12 30 01 ATEX flame detector
Contextual Info: General Specifications PGC2009 E2 Fast Temperature Programmed Process Gas Chromatographs Application Usage The PGC2009 E2 Fast Temperature Programmed Gas Chromatograph GC uses component separation to analyze liquid samples and performs specialty analysis for separation of wide boiling point range compounds. The analyzer

Physics and Technology

Abstract: physics pn junction diode structure
Contextual Info: Physics and Technology www.vishay.com Vishay Semiconductors Physics and Technology EMITTERS Materials Infrared emitting diodes IREDs can be produced from a range of different III-V compounds. Unlike the elemental semiconductor silicon, compound III-V semiconductors

Assmann Electronics v6515

Abstract: Thermagon kluber grease t-pli 210 v6515 kluber T-PLI 200 thermagon FSF52 Thermagon thermal grease T-PLI 210 thermagon
Contextual Info: Application Note from Europe for the World European PowerSemiconductor and Electronics Company Comparison of thermal compounds and heat conducting foils The following information is the result of a comparative investigation of different heat conductive materials in the eupec laboratory. The examined types only represent a small

RS 199-1468

Abstract: RS 195-978 199-1468 UL-492 optically clear adhesive curing
Contextual Info: Data Pack G Issued March 1998 262-0426 Potting compounds Data Sheet A range of potting compounds for encapsulation of electronic components and sub-assemblies, for use in laboratories or in manufacturing. Each potting compound is supplied in two parts resin and hardener/catalyst which require mixing and

Contextual Info: Why Choose Rubber? Advantages Thermoset Rubber delivers superior performance. Thermoset compounds have been vulcanized by heat and will not soften or distort from its formed shape when exposed to excessive heat or open flame. On the contrary, thermoplastics will deform under

gordos relays

Abstract: gordos relay gordos relay 4705 gordos 4705
Contextual Info: a Crouzet REED RELAYS 47 SERIES MINI-SIP DRY REED RELAY 74 SERIES SIP DRY REED RELAY FEATURES: • These Gordos Relays are molded in semiconductor-grade molding compounds that meet Underwriters Laboratories 94V-0 flammability rating. ■ Compatible with automatic insertion

Contextual Info: Data sheet E 9/3.707 - VISHAY SIL 5 - 6-8 9-10 11598 cermet resistor networks SIL circuits are networks of resistors using a screen printing process of cermet compounds on alumina substrates. The tinned connecting pins are parallel to the substrate plane. A confor­

In-Sil-8

Abstract: 619-1001 161000F00000 188958F00000 101600F00000 100500F00000
Contextual Info: A a v i d Thermalloy Heat Sinks, Conductive Adhesive and Compounds, and IN-SIL-8 Pads ª All material is aluminum alloy with a black, anodized finish unless otherwise noted. Slip-On for TO-92 4 Foot Length Extrusion Cut, Deburred and Washed Not Anodized

cho-bond 1086

Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Contextual Info: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s

SDR7045

Contextual Info: MATERIAL DATA SHEET Material SDR7045 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.276 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

SRR0618

Abstract: polyester resin enamelled copper wire
Contextual Info: MATERIAL DATA SHEET Material SRR0618 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.05 Average mass (%) Sum (%) Iron & Compounds N/A Remainder 100

SRR7032

Contextual Info: MATERIAL DATA SHEET Material SRR7032 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.324 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

SRR7045

Contextual Info: MATERIAL DATA SHEET Material SRR7045 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.373 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

VOC sensor

Abstract: QPA84 automatic room power controller acetone gas sensor STAEFA "VOC Sensor" Siemens room temperature sensor landis and staefa 1571S02 1571S
Contextual Info: 1 Indoor Air Quality Controller 571 QPA84 With integrated VOC 1 ) sensor, operating voltage AC 230 V, two-position output non-potential-free relay contact) 1) VOC = Volatile Organic Compounds Use In ventilation plant to optimize the indoor air quality and the consumption of energy by