CMUT7410 Search Results

Contextual Info: CMUT3410 NPN CMUT7410 PNP w w w. c e n t r a l s e m i . c o m SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for

marking code c43

Abstract: amplifier marking code a marking c43 complementary npn-pnp complementary npn-pnp power transistors Surface mount NPN/PNP complementary transistor CMUT3410 CMUT7410 Marking codes c43 code
Contextual Info: Central CMUT3410 NPN CMUT7410 PNP Semiconductor Corp. SURFACE MOUNT ULTRAmini COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini™ surface mount

c43 *pn

Abstract: marking C43
Contextual Info: CMUT3410 NPN CMUT7410 PNP SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for

marking c43

Abstract: CMUT3410 CMUT7410
Contextual Info: CMUT3410 NPN CMUT7410 PNP SURFACE MOUNT COMPLEMENTARY LOW VCE SAT SILICON TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUT3410, and CMUT7410, are low VCE(SAT) silicon transistors in an ULTRAmini surface mount package designed for

CHIP TRANSISTOR

Abstract: transistor 18x18 CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V
Contextual Info: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization

cp741

Abstract: CMLT7410 CMPT7410 CMST7410 CMUT7410 CP741V small signal transistors
Contextual Info: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.7 x 17.7 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization

a42e

Abstract: IC 7410 sot-89 A63 CZT900K npn 2907A 2222a A77 SOT23 2222ae A92E 3906 npn
Contextual Info: Small Signal Transistors Surface Mount Packages Actual Size SOD-923 SOT-923 SOT-953 SOD-523 SOT-523 SOT-563 SOD-323 SOT-323 SOT-363 SOD-123 SOD-123F SOT-23 SOT-23F SOT-143 SOT-26 SOT-28 SOT-89 SOT-223 SOT-228 SMA SMB SMC SOIC-16 HD DIP TLP Tiny Leadless

CMLT7410

Abstract: CMPT7410 CMST7410 CMUT7410 CP741V
Contextual Info: PROCESS CP741V Small Signal Transistors PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.8 x 3.8 MILS Emitter Bonding Pad Area 3.8 x 3.8 MILS Top Side Metalization