CMKT3904 Search Results

transistor k46

Abstract: 3904 TRANSISTOR PNP transistor pnp 3906 k46 transistor 3906 TRANSISTOR npn K46 Package marking k04 3906 PNP PNP TRANSISTOR SOT363 CMKT3904
Contextual Info: CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP SURFACE MOUNT DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS SOT-363 CASE FEATURES: • ULTRAmini space saving package • Two NPN 3904 or Two PNP (3906) Transistors in a single package MAXIMUM RATINGS: (TA=25°C)

k40 transistor

Abstract: CMKT3904 CMKT3906 CMKT3946
Contextual Info: CMKT3904 NPN CMKT3906 PNP CMKT3946 NPN/PNP ULTRAmini DUAL SMALL SIGNAL SWITCHING TRANSISTOR Central TM Semiconductor Corp. FEATURES: • • SPACE SAVING ULTRAmini™ FAMILY • COMPLEMENTARY, ONE NPN AND ONE PNP TRANSISTOR IN A SINGLE PACKAGE TWO NPN OR TWO PNP TRANSISTORS IN

3906 TRANSISTOR

Abstract: transistor pnp 3906 small signal transistor marking codes
Contextual Info: Central CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP Semiconductor Corp. SURFACE MOUNT ULTRAmini™ DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS FEATURES: • ULTRAmini™ SPACE SAVING PACKAGE • TWO NPN 3904 or TWO PNP (3906) TRANSISTORS IN A SINGLE PACKAGE

marking k04

Abstract: CMKT3906 transistor k46 sot363 k46
Contextual Info: CMKT3904 NPN CMKT3906 PNP CMKT3946 NPN/PNP ULTRAmini DUAL SMALL SIGNAL SWITCHING TRANSISTOR Central TM Semiconductor Corp. FEATURES: • • SPACE SAVING ULTRAmini™ FAMILY • COMPLEMENTARY, ONE NPN AND ONE PNP TRANSISTOR IN A SINGLE PACKAGE TWO NPN OR TWO PNP TRANSISTORS IN

3904 TRANSISTOR PNP

Abstract: 3904 dual 3906 PNP transistor k46 small signal transistor marking codes marking k04 "two TRANSISTORs" sot-363 pnp npn 3904 transistor pnp 3906 3906 npn
Contextual Info: Central CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP SURFACE MOUNT ULTRAminiTM DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS SOT-363 CASE FEATURES: • ULTRAminiTM space saving package • Two NPN 3904 or Two PNP (3906) Transistors in a single package

Contextual Info: CMKT3904 NPN/NPN CMKT3906 PNP/PNP w w w. c e n t r a l s e m i . c o m SURFACE MOUNT SILICON DUAL SMALL SIGNAL SWITCHING TRANSISTORS DESCRIPTION: The CENTRAL SEMICONDUCTOR CMKT3904 two single NPN and CMKT3906 (two single PNP) are silicon transistors in a space saving SOT-363 package, designed

CMKT3906

Abstract: marking k04
Contextual Info: Central CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP SURFACE MOUNT ULTRAmini DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS TM Semiconductor Corp. FEATURES: • ULTRAmini™ SPACE SAVING PACKAGE • TWO NPN 3904 or TWO PNP (3906) TRANSISTORS IN A SINGLE PACKAGE

3904 TRANSISTOR PNP

Abstract: transistor k46 k46 transistor k46 sot363 marking 3906 TRANSISTOR npn K46 Package marking k04 3904 transistor sot363 marking codes 20 small signal transistor marking codes
Contextual Info: CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP SURFACE MOUNT DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS SOT-363 CASE FEATURES: • ULTRAmini space saving package • Two NPN 3904 or Two PNP (3906) Transistors in a single package MAXIMUM RATINGS: (TA=25°C)

transistor pnp 3906

Abstract: CMKT3906 be marking pnp
Contextual Info: Central" CMKT3904 NPN/NPN CMKT3906 PNP/PNP CMKT3946 NPN/PNP Semiconductor Corp. SURFACE MOUNT ULTRAmini" DUAL SMALL SIGNAL SILICON SWITCHING TRANSISTORS FEATURES: • ULTRAmini SPACE SAVING PACKAGE • TWO NPN 3904 or TWO PNP (3906) TRANSISTORS IN A SINGLE PACKAGE

2N3904 die

Abstract: 2N3904 transistor data sheet free download transistor 2n3904 CXT3904 CZT3904 2N3904 2N3904 CENTRAL chip die npn transistor data sheet of NPN transistor 2N3904 equivalent al 2n3904
Contextual Info: PROCESS CP392V Central Smal Signal Transistor TM Semiconductor Corp. NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 3.7 x 3.7 MILS

2N3904 die

Abstract: CXT3904 2N3904 2n3904 npn transistor CMKT3904 CZT3904 2N3904 equivalent 2n3904 npn 2N3904 NPN transistor datasheet 2N3904 geometry
Contextual Info: PROCESS CP192V Small Signal Transistors NPN - Amp Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 17 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.0 X 3.0 MILS Emitter Bonding Pad Area 3.0 X 3.0 MILS Top Side Metalization

CMPZ4124

Abstract: CMZ5930B CMZ5945B CMZ5947B Transistor 1602c BC327/transistor bc547 bk 045 CMPZ4618 CMPZ4614 CMZ5948B CMZ5936B
Contextual Info: Small Signal Transistors U.S Specifications Preferred Series SOT-23 Case, 350mW (Continued on next page) b v Ce o b v ebo •SVcES 'CBO VCB *'CEV ® VCE (V) (V) (V) (V) (nA) j MIN M.N MIN MAX 1 hFE @ IC ® VCE (mA) MIN 1 General Purpose Amplifiers/Switches

BAT 13003 D

Abstract: SMBJ5.OCA bat 13003 em 434 CMHD3595 CMR1U-02M CMSD4448 CMPS5064 CMPSH-3SE CMSH3-40
Contextual Info: index/Cross Reference Industry Part Number Central Part Number CMXD4448 1MN10 10BQ015 CMSH1-20ML CMR1U-02M 10MF2 10MQ040 CMSH1-40M 10MQ060 CMSH1-60M 1N6478 CMR1-02M 1N6479 CMR1-02M 1N6481 CMR1-04M 1N6482 CMR1-06M 1N6483 CMR1-10M CMR1-10M 1N6484 1S2835 CMPD2836

2N3904

Abstract: CZT3904 CXT3904 2N3904 die 2N3904 equivalent 2n3904 npn 2N3904 NPN transistor datasheet 2N3904 transistor data sheet free download chip die npn transistor CMLT3904E
Contextual Info: PROCESS CP192V Small Signal Transistors NPN - Amp Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13 x 17 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.0 X 3.0 MILS Emitter Bonding Pad Area 3.0 X 3.0 MILS Top Side Metalization

2N3904

Abstract: CZT3904 2n3904 datasheet 2N3904 NPN Transistor CXT3904 2N3904 die CP392V equivalent al 2n3904 transistor NPN 2N3904 CMPT3904
Contextual Info: PROCESS CP392V Smal Signal Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 3.7 x 3.7 MILS Top Side Metalization

a42e

Abstract: IC 7410 sot-89 A63 CZT900K npn 2907A 2222a A77 SOT23 2222ae A92E 3906 npn
Contextual Info: Small Signal Transistors Surface Mount Packages Actual Size SOD-923 SOT-923 SOT-953 SOD-523 SOT-523 SOT-563 SOD-323 SOT-323 SOT-363 SOD-123 SOD-123F SOT-23 SOT-23F SOT-143 SOT-26 SOT-28 SOT-89 SOT-223 SOT-228 SMA SMB SMC SOIC-16 HD DIP TLP Tiny Leadless

part MARKING k48

Abstract: marking bc p28 CMSD4448 W4W MARKING CM0Z15L CMZ5936B CM0Z11V CMZ5945B marking 6ca marking code ca2
Contextual Info: Marking Codes Continued Marking Code Part Number Marking Code 04 04D 04A 04C 04S 040 1A 1A8 1AC 1B 1B8 1C8 1D8 1E 1E8 1F 1F8 1FF 1G 1G8 1H8 1J 1J8 1K 1K8 1L 1L8 1M8 1P 1PC 1QC 1F)C 2AC 2B 2C 2CA 2F 2FC 2G 2PC 2QC 2P 3A 3B 3E 3F 3G 3J 3K 3L 3P 4A 4B 4C 4E

BF244 datasheet

Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
Contextual Info: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216

transistor 3904

Abstract: transistor 2222a transistor 2222a sot 89 sot 23 transistor 70.2 2907a TRANSISTOR PNP pnp transistor 800v 2907A PNP bipolar transistors transistor 5 Amp 700 volt transistor A92 SOT 89 3906 npn
Contextual Info: N e w T o T h e 2 3 E D t T i a N - . . c o M Small Signal Transistors High Current NPN and PNP Transistors in an SOT-23 package. These new small signal transistors provide an increased current capability and high hpE- CMPT491E CMPT591E - 1 Amp Low VCE SAT NPN High Current Transistor See page 338.

CMR1U-02M

Abstract: CMSD4448 CMSH3-40 CMPZ4124 CMSH3-100 CXTA27 TR em 328 SO3903 BST60 CMPZ4614
Contextual Info: index/Cross Reference Industry Part Number Central Part Number 1MN10 CMXD4448 10BQ015 CMSH1-20ML 10MF2 CMR1U-02M 10MQ040 CMSH1-40M 10MQ060 CMSH1-60M 1N6478 CMR1-02M 1N6479 CMR1-02M 1N6481 CMR1-04M 1N6482 CMR1-06M 1N6483 CMR1-10M 1N6484 CMR1-10M 1S2835 CMPD2836

2N3904

Abstract: 2n3904 npn transistor CXT3904 CZT3904 CMPT3904 2n3904 datasheet 2N3904 die 2N3904 equivalent CMKT3904 equivalent al 2n3904
Contextual Info: PROCESS CP392 Small Signal Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.0 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 3.7 x 3.7 MILS Top Side Metalization