CERQUAD EIAJ Search Results

CERQUAD

Abstract: CERQUAD EIAJ W144B WA80A WA80AQ
Contextual Info: Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80A 2000 National Semiconductor Corporation MS101114 www.national.com Cerquad, EIAJ August 1999 Cerquad, EIAJ 80 Lead Cerquad, EIAJ NS Package Number WA80AQ www.national.com 2 Cerquad, EIAJ 144 Lead Cerquad, EIAJ

W120A

Contextual Info: 120 Lead Cerquad EIAJ NS Package Number W120A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

W144A

Contextual Info: 144 Lead Cerquad EIAJ NS Package Number W144A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

W208A

Abstract: CERQUAD EIAJ
Contextual Info: 208 Lead Cerquad EIAJ NS Package Number W208A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

WA80AQ

Contextual Info: 80 Lead Cerquad EIAJ EPROM NS Package Number WA80AQ All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

WA80A

Contextual Info: 80 Lead Cerquad EIAJ NS Package Number WA80A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

W144B

Contextual Info: 144 Lead Cerquad EIAJ NS Package Number W144B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

W160A

Contextual Info: 160 Lead Cerquad EIAJ NS Package Number W160A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

Contextual Info: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul­ tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.

QFP240-G-3232-0

Contextual Info: 240K6X-A Glass seal 240pin 32✕32mm CERQUAD EIAJ Package Code QFP240-G-3232-0.50 Weight g MD e JEDEC Code – 181 1 b2 240 ME HD D 180 I2 Symbol HE E Recommended Mount Pad 121 60 61 120 F L1 A b y A1 c A2 e A A1 A2 b c D E e HD HE L L1 y L Detail F b2 I2

TO metal package aluminum kovar

Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Contextual Info: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

2TC66

Abstract: HPC16004 HPC16064
Contextual Info: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16004-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance

HPC16004

Abstract: HPC16064 core i7 alu HPC003
Contextual Info: MILITARY DATA SHEET Original Creation Date: 08/25/94 Last Update Date: 08/25/94 Last Major Revision Date: 08/25/94 MNHPC16064-20-X REV 0A0 16 BIT HIGH PERFORMANCE MICROCONTROLLER General Description The HPC16064 and HPC16004 are members of the HPC family of High Performance

hssop

Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES

TSOP 32 thermal resistance

Abstract: FBGA 320 OF IC 318 OF IC 317 BGA and QFP Package mounting TSOP 62 Package QFP PACKAGE thermal resistance mitsubishi package IC equivalent list FBGA PACKAGE thermal resistance
Contextual Info: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL Preceding Page MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION

transistor BC 458

Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and

transistor BC 458

Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and

Intel 1702 eprom

Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
Contextual Info: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

27128 eprom

Abstract: MC68HC05L4 000D 001B HC05 MC68HC705L4 Nippon capacitors
Contextual Info: MC68HC05L4/D MC68HC05L4 HC05 TECHNICAL DATA MC68HC05L4 MC68HC705L4 TECHNICAL DATA !MOTOROLA !MOTOROLA 1 MC68HC05L4 MC68HC705L4 2 3 High-density Complementary Metal Oxide Semiconductor HCMOS Microcomputer Unit 4 5 6 7 All Trade Marks recognised. This document contains information on a new product. Specifications and information herein are

TEMIC ecl

Abstract: microcontroller radiation tolerance microcontroller radiation hard CLCC 84 CMOS NAND2
Contextual Info: Temic Full Custom: MF Semiconductors 0.8-fxm BiCMOS Gate Array Description MF is a high speed gate array combining 10-GHz n-p-n and integration close to that of CMOS LSIs, keeping low bipolar transistors, with CMOS 0.8-nm, two metal layer power competitiveness.

atmel 93C46

Abstract: 93c46 atmel 93C46 national 93C46 national semiconductor 24c04 Atmel 93c46 I2C atmel 24c04 ATMEL 24c32 atmel 24c02 24c04a atmel
Contextual Info: SERIAL EEPROM Serial EEPROM Cross Reference Guide The purpose of this document is to provide a quick way to determine the closest Microchip equivalent to Serial EEPROMs produced by other manufacturers. The cross reference section is broken down by manufacturer and lists all parts from that manufacturer, and the

MCP4001

Abstract: MCP4002 MCP4004 MCP4008 DV164001 DVA16XP180 tssop 93c76 EM167200 84l transistor PIC16C77A
Contextual Info: PRODUCT LINE CARD FOURTH QUARTER 1999 uring Feat nalog/ A New erface Int ucts Prod CURRENT MICROCHIP PRODUCT LINE PICmicro 8-BIT MICROCONTROLLER FAMILY PRODUCTS Program Memory OTP/FLASH Words Analog E PROM Data 8-Bit Com Memory RAM ADC paraBytes Bytes Channels tors