CERAMIC PIN GRID ARRAY PACKAGE LEAD FINISH Search Results

p68d

Abstract: led matrix circuits CMGA3-P68 G68 Package CMGA3-P68D
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Pin Grid Array Packages CPGA S1 G68.B MIL-STD-1835 CMGA3-P68D (P-AC) –A– D 68 LEAD CERAMIC PIN GRID ARRAY PACKAGE INCHES D1 –B– S E1 E MIN MAX MIN MAX A 0.215 0.345 5.46 8.76 - 0.070 0.145 1.78 3.68

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

diode databook package outline

Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –

KD 2107

Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

ceramic pin grid array package plating

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet May, 2005 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

ceramic pin grid array package lead finish gold

Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip
Contextual Info: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The

64 pin CERAMIC QUAD FLATPACK

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

CERAMIC QUAD FLATPACK CQFP 96

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

outline of the heat slug for JEDEC

Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

CDR33 Reliability data

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet December, 2004 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet November, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

transistor smd za

Abstract: smd transistor HX smd transistor HX 45 transistor smd xc transistor smd xb smd diode code T7 INTERSIL CROSS REFERENCE clocks ceramic pin grid array CPGA solder wire HMP CA3260
Contextual Info: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

transistor smd za

Abstract: smd transistor HX SMD transistor Mu CD4000 cross REFERENCE TEPQFN CERAMIC LEADLESS CHIP CARRIER transistor smd za 28 SMD TRANSISTOR 1B t S14 SMD CA3260
Contextual Info: Ordering Nomenclature 19 2009 P RODUCT S ELECTION GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

smd transistor HX

Abstract: TRANSISTOR SMD MARKING CODE TK TRANSISTOR SMD MARKING CODE MP smd transistor HX 45 cdp68hc68 hc221 TRANSISTOR SMD MARKING CODE WM intersil standard part marking HIP SMD TRANSISTOR MARKING by 4p TRANSISTOR SMD MARKING CODES
Contextual Info: Ordering Nomenclature Guides 2 2-3 Elantec TYPES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 5962 SMD/DSCC - QML TYPES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

208-Pin CQFP

Abstract: CLGA smd M16
Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Data Sheet August 22, 2006 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: entek Cu-56 CCGA Kester 953 Flux PEAK TRAY bga IBM ccga 23n50 Cu-56 APD-SBSC-101 T- 200x thinner
Contextual Info: Ceramic Column Grid Array Assembly and Rework User’s Guide July 25, 2002  Copyright International Business Machines Corporation 2002. Copyright and Disclaimer All Rights Reserved Printed in the United States of America July 25, 2002. The following are trademarks of International Business Machines Corporation in the United States, or other countries, or

sot 23 code 27A

Abstract: cd4000 cmos TEPQFN CERAMIC LEADLESS CHIP CARRIER CLCC intersil cdp65C51 22-16 diode smd
Contextual Info: Ordering Nomenclature 22 2005 P RODUCT S ELECTION GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .