CPGA144
Abstract: SOT26 sot260
Contextual Info: PDF: 2002 Nov 04 Philips Semiconductors Package outline SOT260-2 CPGA144: ceramic pin grid array package; 144 pins; body 40 x 40 x 2.3 mm D D1 pin 1 index mark location A2 E1 E A1 L detail X b e R e P N M L K J H G F index pin E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
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CX3001
Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
Contextual Info: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and
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cx3000cx3002cx3141cx3041+8cx3001chip express2308 romchipxpqfp altera 160mentor graphics pads layoutambit circuitcx300
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MT 5388 BGA
Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
Contextual Info: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
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12-03/ds/dl/bay/10kcorp-psg-00123mt 5388 bgabroadcom 7019+8bts 6000 ericssonalcatel 1511 muxmobile switching center mscericsson bts 60002x4 ttl demultiplexercisco 2801ericsson bts technical specificationalcatel 1511
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CERAMIC CHIP CARRIER LCC 68 socket
Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a
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ceramic chip carrier lcc 68 socketintel 24 pin ceramic dual-in-line packagelccs 68 socketic 7912+664 ceramic quad flatpackceramic pin grid array cpga lead frameceramic leadless chip carrier lcc 32 socketpcb footprint cqfp 132single edge contact (s.e.c.) cartridge7912 pin configuration
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hp 4552
Abstract: O2-A2 CQFP100 PSOP24-MP0816 CLT84 gh 312 clt82xxx CQFP44 diode gp 421 PS-3306 Series
Contextual Info: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in
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cla80000ds3820cla80k210ps+10hp 4552o2-a2cqfp100psop24-mp0816clt84gh 312clt82xxxcqfp44diode gp 421ps-3306 series
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CQFP44
Abstract: hp 4552 CLA80000 Series MQFP52 clt82xxx O2-A2 CQFP100 gh 312 PS-3306 Series cqfp120
Contextual Info: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in
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BMA16X16
Contextual Info: SI GE C P L E S S E Y MARCH 1997 S E M I C O N D U C T O R S CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. Improvements in design combined with
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cla80000cla80kpga100-aca-3434pga120-aca-3434+6pga144-aca-4040pga180-aca-4040pga181-aca-4040pga257-aca-5151bma16x16
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VMEbus interface handbook
Abstract: transistors BC 543 Cypress VMEbus Interface Handbook diode 68A VAC068 VIC068A LA18 14 pin ld18 transistor BC 147 FCT245
Contextual Info: fax id: 5600 1V AC0 68A VAC068A VMEbus Address Controller Features — Supports unaligned transfers • Optional companion part to VIC068A • Implements master/slave VMEbus interface in conjunction with the VIC068A • Complete VMEbus and I/O DMA capability for a 32-bit
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vac068avic068a32-bit64-kbyte+9vmebus interface handbooktransistors bc 543cypress vmebus interface handbookdiode 68avac068la18 14 pinld18transistor bc 147fct245
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VMEbus Handbook
Abstract: VMEbus interface handbook FCT245 VAC068 VAC068A VIC068A VME ACFAIL LD3011 LA-10 LD31
Contextual Info: VAC068A VMEbus Address Controller — Supports unaligned transfers Features • Optional companion part to VIC068A • Implements master/slave VMEbus interface in conjunction with the VIC068A • Complete VMEbus and I/O DMA capability for a 32-bit CPU • Complete local and VMEbus memory map decoding
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vac068avic068a32-bit64-kbyte+9160-leadvmebus handbookvmebus interface handbookfct245vac068vme acfailld3011la-10ld31
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7303b
Abstract: LGA 1150 ED-7300 ED-7303B
Contextual Info: JEITA package codes are uniformly given to our IC packages according to the JEITA standard EIAJ ED-7303B. The construction of JEITA package code is explained below. JEITA Package Code excerpt from the JEITA standard EIAJ ED-7303B 1. Construction of package code
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ed-7303biso-r370-sop28-qfp80+37303blga 1150ed-7300
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Power Supply PS-613 uk
Abstract: CQFP44 GP141 DS3820 mux2*1 hp 4552 PSOP28-MP0818 cla85xxx PS-3306 Series Mitel Semiconductor process flow
Contextual Info: CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS3820-2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Mitel Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in
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cla80000ds3820-2cla80k210ps+10power supply ps-613 ukcqfp44gp141ds3820mux2*1hp 4552psop28-mp0818cla85xxxps-3306 seriesmitel semiconductor process flow
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VIC068A
Abstract: VAC068 VAC068A FCT245 106240 ld18 LD31 LBR 84 VMEbus interface handbook
Contextual Info: VAC068A VMEbus Address Controller Features — Supports unaligned transfers • Optional companion part to VIC068A • Implements master/slave VMEbus interface in conjunction with the VIC068A • Complete VMEbus and I/O DMA capability for a 32-bit CPU • Complete local and VMEbus memory map decoding
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vac068avic068a32-bit64-kbyte+7vac068fct245106240ld18ld31lbr 84vmebus interface handbook
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VME ACFAIL
Abstract: FCT245 VIC068A CERAMIC PIN GRID ARRAY 120 pins VIC068A user guide VAC068 VAC068A LD18 LA18 code LD31
Contextual Info: VAC068A VMEbus Address Controller D Features D D Dual UART channels on board Ċ DoubleĆbuffered on transmit, quintĆbuffered on receive Optional companion part to VIC068A Implements master/slave VMEbus interface in conjunction with the VIC068A Ċ Baud rate programmable
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vac068avic068a32bitvme acfail+7fct245ceramic pin grid array 120 pinsvic068a user guidevac068ld18la18 codeld31
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tray matrix bga
Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
Contextual Info: u Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Revision Status Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A 3/1/03 1-1 u Chapter 1 Codes and Carrier Options REVISION STATUS
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tray matrix bgatray datasheet bgabga package trayjedec tray standard for plcc+4ceramic pin grid array cpga amdplcc jedec trayv boxcodes
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AAAM
Abstract: ceramic pin grid array package MS-017 10CT CERAMIC PIN GRID ARRAY 144 pins AK 1040
Contextual Info: A .145 100 A .008 1 .100 SECTIDN A -A ALL SPACES A .0215 .0165 ^ f — A — A .150 .090 L lì .030 .010 A <0 B c c / iX .125 .070 Al — 1 —A A A Q \ •A- D A ®®®®©©©©©© ®®®©©©©©®® ®®©© ® ® ©© ©©© © © ® SEATING PLANE
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ms-017aaamceramic pin grid array package10ct+2ceramic pin grid array 144 pinsak 1040
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54SX72
Abstract: CERAMIC PIN GRID ARRAY 144 pins blown fuse A2-A20 A54SX16A
Contextual Info: A d van ced v.1 54SXA Family FPGAs Specifications Output Tristate at Powerup • 8,000 to 72,000 Available Logic Gates • 100% Resource Utilization with 100% Pin Locking • Up to 360 User-Programmable I/O Pins • 4,024 Flip-Flops • 2.5V, 3.3V, and 5.0V Mixed Voltage Operation with
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54sxaa54sx32a54sx72ceramic pin grid array 144 pins+3blown fusea2-a20a54sx16a
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CERAMIC PIN GRID ARRAY 120 pins
Abstract: MATRA MHS pga 180 gu -SH-112D 144 PGA 160-Pin PGA 8f diode CERAMIC PIN GRID ARRAY 144 pins code matra
Contextual Info: Packages Ceramic Pin Grid Array PGA package outlines 68 pins PGA Code : 8M Date : 15–12–95 84 pins PGA Code : 8R MATRA MHS Date : 21–12–95 1 Packages 100 pins PGA Code : GT Date : 15–12–95 120 pins PGA Code : GU 2 Date : 10–02–95 MATRA MHS
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ceramic pin grid array 120 pinsmatra mhspga 180gu -sh-112d+6144 pga160-pin pga8f diodeceramic pin grid array 144 pinscodematra
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Side Brazed Ceramic Dual-In-Line Packages
Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year
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side brazed ceramic dual-in-line packagesintel packaging databookside brazed ceramic dual-in-line packages 28outline of the heat slug for jedec+664 ceramic leadless chip carrier lcc68 pin plcc socket view bottombga and qfp packagebga package tray 64tray tsop 1220gate count
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CY7C386A-1AC
Abstract: CY7C386A-0AC 7C385A CY7C385A-2AC
Contextual Info: CY7C385A CY7C386A Very High Speed 4K 12K Gate CMOS FPGA Features D Very high speed D D D D D Ċ Loadable counter frequencies greater than 150 MHz Ċ ChipĆtoĆchip operating frequencies up to 110 MHz Ċ Input + logic cell + output delays under 6 ns Unparalleled FPGA performance for
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cy7c385acy7c386a84pin100pin+7144pin160pin16bitcy7c386a-1accy7c386a-0ac7c385acy7c385a-2ac
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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land pattern for tsop 2 86 pinland pattern for tsop 2 54 pinland pattern for tsop 56 pinoki naming+6qfp 64 0.4 mm pitch land patterntsop 54 land patternic packagestsop 66 pin package thermal resistancesoj 44 pcb landed730
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MC68030FE33
Abstract: Bus Buffers MC68030 MC68030FE20 MC68030RC25 Motorola MC68030 MC68030FE25 MC68030RC20 MC68030RC33 motorola L6
Contextual Info: SECTION 14 ORDERING INFORMATION AND MECHANICAL DATA This section contains the pin assignments and package dimensions of the MC68030. In addition, detailed information is provided to be used as a guide when ordering. 14.1 STANDARD MC68030 ORDERING INFORMATION
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mc68030mc68030rc20mc68030rc25mc68030rc33+6mc68030fe20mc68030fe25mc68030fe33bus buffersmotorola mc68030motorola l6
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MC68340RP16
Abstract: MC68340 MC68340CFE16 MC68340CFE8V MC68340CRP16 MC68340FE16 MC68340FE16V MC68340FE25 MC68340FE8V MC68340RP25
Contextual Info: SECTION 12 ORDERING INFORMATION AND MECHANICAL DATA This section contains ordering information, pin assignments and package dimensions of the MC68340. 12.1 STANDARD MC68340 ORDERING INFORMATION Supply Voltage Package Type Frequency MHz Temperature Order Number
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mc68340mc68340fe16mc68340cfe16mc68340fe25+6mc68340rp16mc68340crp16mc68340rp25mc68340fe8vmc68340cfe8vmc68340fe16v
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microprocessors interface 8086 to 8251
Abstract: USART 8251 interfacing with 8051 microcontroller to design a full 18*16 barrel shifter design USART 8251 18*16 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design
Contextual Info: CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This
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cla90000ds4375microprocessors interface 8086 to 8251usart 8251 interfacing with 8051 microcontroller+8to design a full 18*16 barrel shifter designusart 825118*16 barrel shifter designmicroprocessors architecture of 8251usart 8251 expanded block diagramcqfp100p2qfp100-gh-1420full 18*16 barrel shifter design
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P2QFP100-GH-1420
Abstract: O2-A2 CQFP44 USART 8251 interfacing with 8051 microcontroller CQFP100 microprocessors interface 8086 to 8251 full 18*16 barrel shifter design P4QFP100-GH-1420 CLA90000 transistors for oscillators
Contextual Info: CLA90000 Series High Density CMOS Gate Arrays DS5500 ISSUE 2.0 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Zarlink Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This
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cla90000ds5500p2qfp100-gh-1420o2-a2+7cqfp44usart 8251 interfacing with 8051 microcontrollercqfp100microprocessors interface 8086 to 8251full 18*16 barrel shifter designp4qfp100-gh-1420transistors for oscillators
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