C548 M1 E Search Results

Seminar

Abstract: C64x C64X CPU description TMS320C55X C62xTM c6000benchmarks C6000 asm TMS320C55xTM viterbi convolution Natural Microsystems
Contextual Info: Agenda Management Presentation 20 minutes Tom Engibous, TI President, Chairman and CEO Mike Hames, VP and Manager WW DSP Q&A with Tom and Mike (40 minutes) Technology Presentation (60 minutes) Ray Simar: Two New Cores Bob Frankel: Real-Time Software Technology

c243 r47

Abstract: R-1781 1R330 V14 TSSOP14 C548 m1 e
Contextual Info: 5 6 ZV_Y[0.7] ZV_UV[0.7] JP_NET JP_NET20 GND 2 L11 GND 1 2 C508 0.1U 0603B C28 0.01U 0603B JP_NET JP_NET20 P/PA_GND 2 C21 0.1U 0603B 1 C248 10U 1206 C30 0.01U 0603B JP_NET JP_NET20 8 7 D 9 ENABKL_VGA# U15D 74AHC14_V TSSOP14 C1 V_AVDD V_A2VDD P/PAVDD D2 P1

E20 L27

Abstract: c557 R596 GPO16
Contextual Info: 3 4 5 gpi21 gpi20 gpi19 gpi18 gpi17 gpi16 gpi15 gpi14 gpi13 gpi1 C582 C573 C581 0.1U 0603B 0.1U 0603B 0.1U 0603B 0.1U 0603B L27 VCC_USB C562 1U 0603B C564 C568 C550 C557 0.1U 0603B 0.1U 0603B 0.1U 0603B 0.1U 0603B GND GND GND * FOR VCC_SUS * NEAR PIIX4 B

RFU20

Abstract: c639 ph ST C733 RFU10 LB506 ics c10 100u 1p8 c606 quanta rt1 ST C744 quanta FG
Contextual Info: 5 4 3 2 1 U9A CN1A 3V3RUN MBGA820-NVIDIA-G3 COMMON NONPHY-X16 1.5A PEX1V2 FG-13X91-20-230P 1/14 PCI_EXPRESS COMMON C2 .1U/B C3 .1U/B 1/2 226 228 230 PCI-Express, Power PEX_IOVDD_0 PEX_IOVDD_1 PEX_IOVDD_2 PEX_IOVDD_3 PEX_IOVDD_4 PEX_IOVDD_5 3V3RUN 3V3RUN 3V3RUN

AMD Athlon 64 X2 5000

Abstract: MPT N095 40-A05100-D000 D5036 D552 IC digital clock lcd inverter for notebook CS3711 aA88 U505D ad07 mainboard
Contextual Info: A B C D E POWER PLANE LISTING : PWR +3.3V +5V +12V KBVCC NOM +2.5V +3.3VS +5VS ON ON ON ON ON ON ON ON ON ON ON ON POS ON ON ON ON ON ON ON ON ON ON ON ON 2.5V/VCCA_PLL STR ON OFF OFF OFF OFF ON ON ON ON ON OFF ON Thermal sensor OFF OFF OFF OFF OFF OFF OFF

smd w08 SOT23

Abstract: 32N03 MS-10422 L02 SOP8 SMD-3528 SOT23-6 T20 T04 p6 smd smd g1.l smd m3c micro-star
Contextual Info: 5 4 3 2 1 D D 10422: MXM-II, G3, 128/256MB, 128-bit, 8/16Mx32 DDR-3 LVDS,DVI_A, DVI_B,TV_OUT,VGA Table of Contents HISTORY: Page 1: Overview Page 2: PCI EXPRESS Interface Page 3: Frame Buffer A GPU Page 4: Frame Buffer A Memories Page 5: Frame Buffer C GPU

Contextual Info: Freescale Semiconductor User Manual Document Number: MPC5604EEVB64UM MPC5604EEVB64 Evaluation board User Manual For MPC5604E Evaluation/Validation by: Pavel Bohacik MSG Application Engineering 1 Introduction The MPC5604EEVB64 Evaluation Board EVB is based on the e200z0 Power Architecture . This board is

samsung r540

Abstract: Samsung R590 R721-R725 C732 SMD 10000NF R616 R617 R714-R715 samsung r580 b16 r649 Smd q535
Contextual Info: - This Document can not be used without Samsung’s authorization - 10. Part List 1 System Board Main System LOCATION SEC CODE NAME SPECIFICATION QUANTITY 0401-000191 DIODE-SWITCHING MMBD4148,75V,200mA,SOT-23,TP 6 D512 0402-001024 DIODE-RECTIFIER MBR0540,40V,0.5A,SOD-123,TP

32N03

Abstract: MS-10422 D0307 MS1100 MARK E31 SOT23-5 BGA136 smd w08 SOT23 FM-1178 D0332 BGA820
Contextual Info: 5 4 3 2 1 D D 10422: MXM-II, G3, 128/256MB, 128-bit, 8/16Mx32 DDR-3 LVDS,DVI_A, DVI_B,TV_OUT,VGA Table of Contents HISTORY: Page 1: Overview Page 2: PCI EXPRESS Interface Page 3: Frame Buffer A GPU Page 4: Frame Buffer A Memories Page 5: Frame Buffer C GPU

CMD44

Abstract: M51517 r305 finger print module BJT 3904 1510487 1SS355 ROHM smd code Z2p CMD62 RJ9 jack dimension CP10-VIA
Contextual Info: A B C D POWER ADAPTER 3V/5V/12V 4 CPU VIA C3 CPUCORE POWER PAGE 33 EBGA PAGE 3,4 PAGE 35 CHARGER BATTERY VTT 2.5V PAGE 36, 37 PAGE 34 PCI ID AD20 CARDBUS AD21 IEEE 1394 AD22 USB 2.0 AD24 LAN AD26 SOUTH BRIDGE AD18 PCI INT PCI REQ/GNT INTA#, INTD# REQ0#/GNT0#

INVENTEC

Abstract: nvidia nvidia MXM R3841 nvidia gpu nv43 c5252 nvidia gpu mxm KNOCKHILL 10 inventec power nv44
Contextual Info: KNOCKHILL nVIDIA VGA BOARD CS BUILD EE DATE POWER DATE DRAWER DESIGN CHECK RESPONSIBLE DATE CHANGE NO. REV SIZE = 3 FILE NAME : XXXX-XXXXXX-XX P/N XXXXXXXXXXXX INVENTEC TITLE KNOCKHILL COVER PAGE VER : SIZE CODE A3 CS SHEET DOC. NUMBER REV Model_No 1 OF 000

RTM875T-606

Abstract: AN12947 DIODE S4 77A PC123 s4 s104 diode 87a RTM875T AN12947A e3317 CLOCK RTM875T CH7318
Contextual Info: A B C D E D-Sub DC-Adapter IN 2 3 4 Page 17 HOST Page 36 +1_8VSUS +1_5VRUN SMDDR_VTERM RT9173BPS TPS51124 Cantiga GM - RGB RGB - Dock Port Replicator TV Out PCI-E x16 Page 14 Cantiga PM/GM Page 14 Low Speed I/O Audio LAN +VTT 1.05V +1.25VRUN.VM Dual Channel DDRII

rtm875t-606

Abstract: 240KR1 AN12947A AN12947 4810b XC390 rtm875t 012u3 XC001 E2B16
Contextual Info: A B C D E D-Sub DC-Adapter IN 2 3 4 Page 17 HOST Page 36 +1_8VSUS +1_5VRUN SMDDR_VTERM RT9173BPS TPS51124 Cantiga GM - RGB RGB - Dock Port Replicator TV Out PCI-E x16 Page 14 Cantiga PM/GM GM45 Page 14 LVDS DDR-SODIMM0 Low Speed I/O Audio LAN Page 17 +1.05VM

24c02 wp

Abstract: transistor CB550 nForce4 G781-1P8F intel DG 31 crb c3421 transistor intel dg 41 crb nvidia ck804 nForce4 sli c3751 transistor
Contextual Info: 5 4 GPU on Normal Mode conduct MXM on master slot only,link to PCIE x16 lanes . PAGE INDEX: 01_BLOCK_DIAGRAM 02_CLOCK_BLOCK_DIAGRAM GPU SLAVE 09_CK804 1/7 _HT/CPU_IF 10_CK804(2/7)_PCIE 11_CK804(3/7)_PCI/LPC 12_CK804(4/7)_SATA/PATA/XTAL-IN 13_CK804(5/7)_USB/MAC/AC97/RTC/SMB

IT8502E

Abstract: ITE IT8502E ITE 8502E circuit diagram x58 VARISTOR NTC 10 D 208 as c451 100v 27p ME2N7002E TPS51116REGR 8502E TPCA*8023
Contextual Info: 1 2 3 4 6 7 8 Li 37/39 Block Diagram PCB STACK UP LAYER 1 : TOP CPU Penryn LAYER 2 : SGND1 LAYER 3 : IN1 A 5 CPU CORE ISL6266A LAYER 4 : IN2 01 CPU THERMAL SENSOR 14.318MHz A 478P uPGA /35W LAYER 5 : VCC CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK#

IT8502E

Abstract: ITE IT8502E ITE 8502E RTL8102EL 8502E-J 8502E IT8502 SCK 054 VARISTOR RT8204 5V UART bluetooth
Contextual Info: 1 2 3 4 6 7 8 Li 37/39 Block Diagram PCB STACK UP LAYER 1 : TOP CPU Penryn LAYER 2 : SGND1 LAYER 3 : IN1 A 5 CPU CORE ISL6266A LAYER 4 : IN2 01 CPU THERMAL SENSOR 14.318MHz A 478P uPGA /35W LAYER 5 : VCC CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK#

OZ8118

Abstract: ps223 SD CARD CONTROLLER CMD26 intel g31 msi G993P1UF RTL811C BGA969 5KR04 apa2057a intel g41 msi
Contextual Info: A B C D MS-1431 VER : 0.A E DC JACK & Selector Page 27 1 1 SYS POWER Penryn Page 3,4 HOST +3V +5V FSB 667/800/1066 TPS51120 Page 29 RGB CRT NORTH BRIDGE Page 15 LVDS LVDS 2 NB9M PCIE2.0 Page 15 HDMI HDMI INTEL Dual Channel DDRII 667/800 MHZ Page 31 2 DDR-SODIMM0

foxconn

Abstract: Y27 sot23 zener FW82801FBM Mobile Dothan alviso-GM Socket AM2 Compal Electronics LA-2592 APW7057 ls-2597
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Dothan uFCPGA with Intel Alviso_GM+ICH6-M core logic 2005-04-10 3 3 LA-2592 REV:3A 4 4 Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

schematic diagram hdmi to rca

Abstract: GFX SE DIODE LE88CLPM NH82801HEM TP16355 RAS 0510 SUN HOLD sun hold RAS 0510 SUN HOLD, RAS 0510 f8 vga nb8p BA41-00745A
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D MILAN CPU : Chip Set : Remarks :

BA41-01190A

Abstract: mec1308 K4W1G1646E-HC12 SMSC mec1308 tps51621 marvell 88E8059 AU6336C52 20b1 diode samsung crt GC1036
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D D sheet1. Cover - 1 sheet2. Block Diagram -(2)

MMZ1608S121AT

Abstract: nc10 samsung 45-D2 Samsung ddr2 7SZ14 BA09-00009A INTEL945GMS SMD y8 samsung nc10 bios Socket AM2
Contextual Info: 4 3 1 2 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV

C3604BD-F

Abstract: EMI500 samsung r540 100nF 50V X7R samsung 1608 resistor r336 r331 r322 r330 r1 B536 c796 b527 B538 c337 pnp
Contextual Info: - This Document can not be used without Samsung's authorization - 10. Part List 1 Internal System 10/100) Internal System(10/100 Mbit) Location R231 SEC Code Name 2007-000070 R-CHIP 0ohm,5%,1/10W,TP,1608, Specification Quantity 1 2007-000171 R-CHIP 0ohm,5%,1/16W,TP,1005,

Q514

Abstract: du508 Samsung ddr2 MIC500 EMI502 BA59-01869A BA09-00009A samsung hd50 d4.0 34C1 mx25l8005m2c-15g
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV

SAMSUNG RV410

Abstract: SMB29 isl6260 PC87541 R141 237 000 SCK 054 VARISTOR quanta foxconn R648 PCI7412
Contextual Info: 1 2 3 4 5 6 7 8 MA6 BLOCK DIAGRAM CPU Yonah/Merom USB USB4 A 14.318MHz MAX1993 VGACORE (1.2V/NB_CORE/1.25V) PG 3 1394 X1 ICSXXXX 56pins 479 Pins (uPGA) MODEM PCI-E X1 CRT/S-Video CPU CORE ISL6260+6208 POWER 1.2V/44A PG 45 OSC14M HTREFCLK NBSRCCLK, NBSRCCLK#