C3154 Search Results

B 892

Abstract: 27" UNS 2A
Contextual Info: 8 6 7 4 5 3 2 1 REVISION S 2 D 7-FIN HEATSINK: 2.000 DIA. 0.892 HT. LTR DESCRIPTION A ERN: 110986 E.T 9/22/05 B.P 9/27/05 INIT APP'D B ECR-06-020585 E.T 8/29/06 V.K 8/29/06 D 1. MATERIAL: HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 1 2. BEFORE THE HEATSINK APPLICATION, THE USER

Contextual Info: 8 7 6 4 5 3 2 1 REVISION S 2.000 DIA. 1-FIN HS: 0.250 HT. 2 D LTR DESCRIPTION O ECN: 0S60-0055-04 E.T 03/04/04 S.D 3/11/04 INIT APP'D A ECO-05-008423 E.T 9/15/05 B.P 12/1/05 A1 ECR-05-017787 E.T 12/13/05 B.P 12/13/05 D NOTE: 1. MATERIAL: 3 1 HEAT SINK: ALUM. (BLACK ANODIZE)

MAX8770

Abstract: ICS954310 motherboard samsung ba41 MDB41 PC87541 QUANTA C3229 C3198 PC87541 sil3512 quanta
Contextual Info: 1 2 3 4 5 CPU Yonah/Merom 478 PIN micro FC-PGA 1 RJ9 Block Diagram P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM CRT P11 P2 P12 945GM/PM R/G/B ICS954310 R/G/B 1466 PIN (micro FCBGA)

c3148

Abstract: it8511te D8802 asus 2C1208 RAY 33A A23 851-1 diode C1108 d1902 C3152
Contextual Info: A B C D E F6E SCHEMATIC Revision 1.10 1 1 Content PAGE PAGE SYSTEM PAGE REF. 2 3 4 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 CPU-MEROM 1 CPU-MEROM(2) CPU CAP, Thermal Senor

op amp op80

Abstract: AMP03 AMP03BJ AMP03FJ AMP03GP INA105 op43
Contextual Info: a FEATURES High CMRR: 100 dB Typ Low Nonlinearity: 0.001% Max Low Distortion: 0.001% Typ Wide Bandwidth: 3 MHz Typ Fast Slew Rate: 9.5 V/␮s Typ Fast Settling 0.01% : 1 ␮s Typ Low Cost APPLICATIONS Summing Amplifiers Instrumentation Amplifiers Balanced Line Receivers

transistor c3150

Abstract: c3271 KEMA KEUR thermostat C4108
Contextual Info: What’s New? E X PA N D E D C O M P E T I T I V E O F F E R I N G S Cross-Reference & Online Spec Sheets We have expanded our Carol Brand Electronics offering and now have more competitive crosses than anyone. Many of these cables are in stock and ready for

capacitor 1.50 MKT 400V

Abstract: IEC 68-2-6 Vibration c1474 C3105 1.50 MKT av series C3684 mkt 1.50 400V capacitor 0 033 j mkt 250v capacitor 100 nf 100v mkt Siemens film capacitor
Contextual Info: fl235bOS GG37b47 7 • S IE G MKT Capacitors SIEMENS A K T I E N 6 E S E L L S C H A F M7E D -/ f 'C E3 B 32520 .B 32529 fS l 7 ' O S. M e ta liz a d p o ly e s te r film c a p a c ito rs in a c c o rd a n c e w it h DIN 4 4 1 1 2 VR = 63 to 6 3 0 Vdc

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S 2 4-FIN HEAT SINK: 1.375 DIA. 0.546 HT. LTR DESCRIPTION A ECR-06-021564 INIT APP'D E.T 9/18/06 V.K 9/18/06 1. MATERIAL: D D HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 2. BEFORE THE HEATSINK APPLICATION, THE USER SHOULD

Contextual Info: 8 7 6 4 5 3 2 1 REVISION S 5-FIN HEAT SINK: 1.375 DIA. 0.678 HT. 2 LTR DESCRIPTION A ECR-06-001164 INIT APP'D E.T 1/17/06 C.W 1/20/06 D D NOTE: 1. MATERIAL: 1 3 HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 4-LEGS CLIP SIZE: 25mm 2. BEFORE THE HEATSINK APPLICATION, THE USER

Contextual Info: 8 7 6 4 5 3 2 1 REVISION S 2 1-FIN HS: 1.375 DIA. 0.255 HT. D LTR DESCRIPTION INIT APP'D O A B ECN: 0S60-0081-04 ECN: 0S60-0181-04 ECR-06-008334 E.T 04/1/04 E.T 7/12/04 E.T 4/5/06 B.P 04/07/04 B.P 7/14/04 C.W 4/6/06 D NOTE: 1. MATERIAL: 4-LEG CLIP SIZE: 25mm

2506D

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S 2 D 2.000 DIA. 0.357 HT. 2-FINS HS: LTR DESCRIPTION O ECN: 0S60-0122-04 E.T 05/07/04 B.P 05/07/04 INIT APP'D A B ECN: 0S60-0181-04 ECR-06-017841 E.T 7/12/04 B.P 7/14/04 E.T 7/25/06 V.K 7/25/06 D 1. MATERIAL: 1 3 HEAT SINK: ALUM. (BLACK ANODIZE)

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S 2 3-FIN HS: D 1.375 DIA. 0.443 HT. LTR DESCRIPTION INIT O ECN: 0S60-0091-04 A ECR-06-011657 APP'D E.T 04/08/04 B.P 04/08/04 E.T 6/2/06 V.K 6/26/06 NOTE: D 1. MATERIAL: HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 3

C3246

Abstract: c3271 c3320 c3244 C5086 C1364 C3247 c3158 C3242 c3243
Contextual Info: Electronics Technical Information Multi-Conductor Cable Product Finder AWG 28 AWG 24 AWG 22 AWG 20 AWG 19 AWG 18 AWG 16 AWG 14 AWG 12 NO. STRAND COND. TYPE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE P/N SHIELD PAGE

nec c3159

Abstract: c3158 C3320 C3311 C3164 C3181 C3159 C3322 C3340 c3163
Contextual Info: Communication & Control Cable, Multi-Conductor Electronics Multi-Conductor, Foil Shield NEC Type CL2 and CM UL c(UL) CMH Product Construction: Conductor: • 24 thru 12 AWG fully annealed solid or stranded tinned copper per ASTM B-33 Insulation: • Premium-grade, coIor-coded

sil3512

Abstract: C3088 CMOS Camera G966-25 C3198 PC87541 ICS9lpr310 7336A 915GM c3197 VT6212
Contextual Info: 1 2 3 4 5 478 PIN micro FC-PGA 1 RJ6 Block Diagram CPU Yonah/Merom P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM 945GM/PM R/G/B CRT P11 R/G/B 1466 PIN (micro FCBGA) 37.5mm x 37.5mm

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S 2 1.375 DIA. 0.546 HT. 4-FINS HS: D LTR DESCRIPTION O ECN: 0S60-0271-04 E.T 11/3/04 B.P 11/22/04 INIT APP'D A ECR-06-020585 E.T 8/25/06 V.K 8/25/06 1. MATERIAL: D HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 2. BEFORE THE HEATSINK APPLICATION, THE USER SHOULD

40x40x10mm

Contextual Info: 8 7 6 4 5 3 4 3 2 REVISION S FAN: 40X40X10mm, 12V, 3 WIRE. DOUBLE BALL BEARING TYPE. AIR FLOW DIRECTION D ALIGN SCREW WITH HOLE ALIGN SCREW WITH HOLE C RED 1 BLUE C LTR DESCRIPTION O ECN: 0S60-0078-04 E.T 03/26/04 B.P 04/05/04 INIT A B ECN: 0S60-0060-05 ECR-06-007721

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S DESCRIPTION INIT APP'D O A ECN: 0S60- 0113- 04 ECR- 06- 014978 E.T 4/27/04 E.T 6/23/06 B.P 04/28/04 V.K 6/26/06 2-FIN HS: 1.375 DIA. 0.292 HT. 2 D LTR D 1. MATERIAL: HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO) 3 1

Contextual Info: 8 6 7 4 5 3 2 1 REVISION S DIA. 2 1-FIN HEAT SINK: 1.375 0.255 HT. D LTR DESCRIPTION INIT APP'D O ECN: 0S60-0055-04 E.T 03/09/04 S.D 03/11/04 A ECR-06-014978 E.T 6/23/06 V.K 6/26/06 D 1. MATERIAL: HEAT SINK: ALUM. (BLACK ANODIZE) CLIP: BLACK PEI (UL94-VO)

WPC8763L

Abstract: ATI M64-M QUANTA GD1 C3157 PCI8402 SAMSUNG GDDR3 quanta Neo c480 l3007 cps psi 100u 1p0
Contextual Info: 1 2 3 4 5 1 CPU MEROM GD1 Block Diagram 478 PIN micro FC-PGA P3,4 14.318MHz A A FSB 667 MHz(166X4) FSB 800 MHz(200X4) CLOCK GEN SVideo Out S-Video 32MVRAM 32bits P34 P10 S-Video LCD LVDS P7 CRT R/G/B 32bits P10 ICS9LPR363 P2 P11 LVDS 1299 Ball (micro FCBGA)

6265A

Abstract: M96-SCE RTL8111d kb3926 RTL8103 RTL8111DL SLG8SP626V C3198 RTL8103E p2003bvg
Contextual Info: 1 2 3 A 1 2 3 4 5 6 : : : : : : 5 6 7 8 01 UT12 SYSTEM DIAGRAM PCB STACK UP LAYER LAYER LAYER LAYER LAYER LAYER 4 DDRII DDRII-SODIMM1 TOP IN1 IN2 VCC IN3 BOT 667/800 MHz AMD Lion Sabie Griffin PAGE 7,8 DDRII DDRII-SODIMM2 CPU THERMAL SENSOR S1G2 Processor

tps51620

Abstract: TPS51610 C3148 kbc 1091 PCMB0603T tps51125 BLM18PG181SN1J BQ24740 Inventec U1015
Contextual Info: Zenith UMA Cycle 1 MV BUILD 2009.03.18 EE DATE DATE POWER DRAWER DESIGN CHECK RESPONSIBLE DATE CHANGE NO. REV 3 SIZE = FILE NAME : XXXX-XXXXXX-XX XXXXXXXXXXXX P/N INVENTEC TITLE VER : Zenith UMA C1 SIZE CODE A3 CS REV DOC. NUMBER 1310A22526-0-MTR A03 SHEET

atmel 0928

Abstract: QUANTA GD1 C3258 max8776 ati c155 100u 1p0 C3257 intel G41 MOTHERBOARD crb l3007 PCI8402 C3261
Contextual Info: 1 2 3 4 5 1 CPU MEROM GD1 Block Diagram 478 PIN micro FC-PGA P3,4 14.318MHz A A FSB 667 MHz(166X4) FSB 800 MHz(200X4) CLOCK GEN SVideo Out S-Video 32MVRAM 32bits P34 P10 S-Video ATI M64 LVDS LCD R/G/B CRT P7 LVDS 29mm x 29mm 32MVRAM 32bits P10 UNBUFFERED

C6104

Abstract: C3684 c1474 C3104
Contextual Info: fl235bOS D037b47 7 M K T Capacitors S IE G □ SIEMENS A KT IE N G E S E L L S C H A F M7E D B 32520 .B 3 2 5 2 9 ft~ O S l 7 - o M etalized polyester film capacitors in accordance w ith D IN 44112 VR = 6 3 to 6 3 0 Vdc W ith quality a sse ssm e n t according to C E C C 30401-043, edition 1, June 1983.