SECS II wafer map format
Abstract: C075EE UV-tape
Contextual Info: SL2 ICS50 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136530 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L Label ICs on an NXP C075EE process
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ics50c075eeics5001ew/v7secs ii wafer map format+1uv-tape
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Contextual Info: SL2ICS5311EW/V7 Wafer addendum Rev. 3.0 — 8 May 2008 Product data sheet 131030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process
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uv-tape
Abstract: ICODE SLI-S SECS II wafer map format
Contextual Info: SL2ICS5301EW/V7L Wafer addendum Rev. 3.0 — 19 March 2008 Product data sheet 153430 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I-CODE SLI-S Label ICs on an NXP C075EE process
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sl2ics5301ew/v7lc075eeuv-tapeicode sli-s+1secs ii wafer map format
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SECS II wafer map format
Abstract: wafer map format uv-tape ICS53 LCR meter for ICs package
Contextual Info: SL2 ICS53 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135830 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S Label ICs on an NXP C075EE process
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ics53c075eeics5301ew/v7secs ii wafer map format+3wafer map formatuv-tapelcr meter for ics package
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UV-tape
Abstract: wafer map
Contextual Info: SL2 ICS51 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 136630 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-L HC Label ICs on an NXP C075EE
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ics51c075eeics5101ew/v715contents+2uv-tapewafer map
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SECS II wafer map format
Abstract: C075EE uv-tape ICODE SLI-S ICS5401 SL2ICS54 wafer map format
Contextual Info: SL2 ICS54 Wafer addendum Rev. 3.0 — 21 March 2007 Product data sheet 135930 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC of I•CODE SLI-S HC Label ICs on an NXP C075EE
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ics54c075eeics5401ew/v715contents+6secs ii wafer map formatuv-tapeicode sli-sics5401sl2ics54wafer map format
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ICODE Coil design guide
Abstract: M92x 156932
Contextual Info: SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 Product data sheet addendum 150030 PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP
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sl2ics2001dw/v1dc075eeicode coil design guidem92x+1156932
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LB-412
Abstract: ICODE SLI ICS20 SL2ICS20 IBIS wafer map format
Contextual Info: INTEGRATED CIRCUITS ADDENDUM SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification Product Specification Revision 3.0 Public Philips Semiconductors December 2002 Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification
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sca74lb-412icode sliics20+2sl2ics20ibis wafer map format
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Z2450
Abstract: sl3ics3001, ucode hsl SL3ICS30 UCODE hsl Z915 C075EE
Contextual Info: SL3ICS3001 UCODE HSL bumped wafer specification Rev. 3.0 — 6 July 2009 070730 Product data sheet addendum PUBLIC 1. General description The SL3ICS3001FW is a contactless tag IC designed for tags and labels for RFID and AIDC system applications. This specification describes electrical, physical and dimensional properties of Au-bumped,
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sl3ics3001sl3ics3001fwsl3ics3001fw/v1z2450+5sl3ics3001, ucode hslsl3ics30ucode hslz915c075ee
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