BGA272 Search Results

PRBG0272FA-A

Abstract: BGA272 PBGA272 P-BGA272-21x21-1 P-BGA-272
Contextual Info: JEITA Package Code P-BGA272-21x21-1.00 RENESAS Code PRBG0272FA-A Previous Code BP-272/BP-272V MASS[Typ.] 1.3g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e Y W V U T R Reference Symbol P B N Dimension in Millimeters Min Nom Max D 21.0 K E 21.0 J v 0.20 w

SF-BGA272A-B-11

Contextual Info: D Package Code: BGA272A C 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] typ. 0.76mm [0.030"] typ. 24.13mm [0.950"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. Ø 0.40mm [Ø 0.0156"] tooling hole X2

PBGA272

Abstract: PBGA-272 P-BGA-272 BGA272
Contextual Info: P-BGA272-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SF-BGA272B-B-11

Contextual Info: D Package Code: BGA272B C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]

MPC555

Abstract: J137 LA-BGA-MPC555-S-B-01 PB-BGA-MPC555-01 C6215
Contextual Info: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View LS-BGA272A-01 included PB-BGA-MPC555-01 (included) 16.10mm [0.634"] Plugged 2 1.321mm [0.052"] 5.959mm [0.235"]

PBGA272

Abstract: PRBG0272DE-A P-BGA-272
Contextual Info: JEITA Package Code P-BGA272-27x27-1.27 RENESAS Code PRBG0272DE-A D Previous Code 272F7X-E MASS[Typ.] 2.8g A D1 A ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA272 package SOT579-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

PBGA-272

Abstract: PBGA272 27x27 BGA272 PRBG0272DA-A
Contextual Info: JEITA Package Code P-BGA272-27x27-1.27 RENESAS Code PRBG0272DA-A B D Previous Code 272F7X-A MASS[Typ.] 2.3g A ZD A D1 b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BGA272

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K

BGA272

Abstract: MS-034 sot579
Contextual Info: Package outline Philips Semiconductors BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A

BGA272

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

BGA272

Abstract: MS-034 sot698
Contextual Info: PDF: 2001 Nov 14 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.75 mm SOT698-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e ∅w M C y y1 C Y W V e U T R P N M L

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

circuit diagram for micro controller based caller

Abstract: TDK 78P7200-IH 74FCT164245TPV D44 SOT23 RTD25 Framatome Connectors MS gal programming timing chart 3225 EPCOS Radiall R126 RJ45 to DB9F cable adapter
Contextual Info: To o l D es cr ip ti on , DS 1, J ul y 20 00 EASY3445 M 13 F X E v a lu a t i on S y s t e m M 13 M u lt i p le x e r a n d D S 3 F r am e r PEB3445 Datacom N e v e r s t o p t h i n k i n g . Edition 2000-07-15 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

R2A25416SP

Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
Contextual Info: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.

272-Pin

Contextual Info: BALL GRID ARRAY PACKAGE 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) 29.00±0.20(1.142±.008)SQ 28.50±0.20(1.122±.008)SQ 1.67(.066) 28.50(1.122)

Contextual Info: v4.0 40MX and 42MX FPGA Families Features • QML Certification High Capacity • Ceramic Devices Available to DSCC SMD • • • • • Ease of Integration Single Chip ASIC Alternative 2,000 to 36,000 Available Logic Gates Up to 2.5 Kbits Configurable Dual-Port SRAM

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

SH7724

Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
Contextual Info: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced

FSQ510 Equivalent

Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Contextual Info: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178

Contextual Info: Æ ic t e ! v 3.0 - m 40MX and 42MX Families FPGAs Features • Q M L C e rtific a tio n High C a p a c ity • C eram ic Devices A va ila b le to DSCCSM D • S ingle C hip A S IC A lte rn a tiv e Ea se of I n t e g r a t i o n

gvrp

Abstract: PLB2224 ardent Infineon Technologies Ardent
Contextual Info: P R O D U C T B R I E F Infineon’s PLB2224 is a highly integrated Layer 2+ switch-on-a-chip with twenty-four 10/100 Mbps and two 10/100/1000 Mbps Ethernet ports. The PLB2224 provides wire-speed, full-duplex switching capability on all ports. On-chip memory for packet buffers and

SM 44P Actel

Abstract: ST 1803 DHL
Contextual Info: Æ ic te ! v 3 .0 - m 40MXand 42MX Families FPGAs Features • Q M L C e rtific a tio n High C a p a c ity • C eram ic Devices A va ila b le to D X C S M D • S ingle C h ip AS IC A lte rn a tiv e Ea se of I n t e g r a t i o n

led matrix circuits

Abstract: BGA-272P-M01
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)