SOT579 Search Results

SOT579 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
SOT579-1		NXP Semiconductors	Footprint for reflow soldering SOT579-1	Original	PDF	11.54KB	1

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA272 package SOT579-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	BGA272 OT579-1 OT579-1	PDF
BGA272 Abstract: MS-034 Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K	Original	BGA272: OT579-1 MS-034 BGA272 MS-034	PDF
BGA272 Abstract: MS-034 sot579 Contextual Info: Package outline Philips Semiconductors BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A	Original	BGA272: OT579-1 MS-034 BGA272 MS-034 sot579	PDF
BGA272 Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K	Original	BGA272: OT579-1 BGA272	PDF