BGA PACKAGE 2015 Search Results

Contextual Info: A P P L I C A T I O N N O T E 2015-01 Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability THE CHALLENGE T H E A D V A N C E D S O L U T I O N IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages QFP to the

Contextual Info: Page:1/1 Update: January 9, 2015 High Speed SRAM Density 64K Configuration 8K x 8 Power Supply 5V 5V 256K Item No. Speed ns LY6164 Isb 12/15 1.0mA(typ) LY61256 12/15 0.5mA(typ) Operating Temp. (*1) Data Sheet C/E/I C/E/I 32K × 8 3.3V LY61L256 12/15 0.5mA(typ)

GS12141

Contextual Info: UHD-SDI FEATURING New UHD-SDI Solutions Broadcast Video Selector Guide • • • • Equalizers Cable Drivers Reclockers Configurable Input/Output Devices • • • • Transmitters Receivers Crosspoint Switches Timing Spring 2015 Complete Portfolio of Broadcast UHD-SDI solutions

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

EPM7032VLC44-12

Abstract: low pass fir Filter VHDL code epf10k100efi484-2 TQFP-100 footprint HP 3070 series 2 specification HP 3070 Tester EPF10K50EFI256-2 EPF10K50EQI240-2 epm3032 EPM7032VLC44-15
Contextual Info: & News Views Third Quarter, August 1999 The Programmable Solutions Company Newsletter for Altera Customers MAX 7000B Devices Provide Solutions for High-Performance Applications The feature-rich, product-term-based MAX® 7000B devices offer propagation delays

LDS6100

Abstract: Tsi578 SXVX-210 VMM1300 LDS6120 vhd1900 932SQ420 CK420BQ 9LPRS485 9LRS3165
Contextual Info: Quick Reference Guide This QRG is a general guide to IDT product categories. Not all IDT products or parts are included. Please check www.IDT.com for detailed product and part information. Table of Contents Page URL Clock Generator / Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

CY62148E

Abstract: R1LP0108ESA-7SR
Contextual Info: Selection Guide Low Power SRAM www.renesas.eu 2014.03 About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices.

GN25L98

Abstract: GN2504 TOSA 10G DFB NT25L90 GN2044 SFP/GN2044 1550nm TOSA EML GN7068 QSFP28 GN25L96
Contextual Info: optical 2015 - High Performance Portfolio Optical & IC Selector Guide • TIAs • ROSAs • Single-Lane CDRs • Dual-Lane CDRs • Quad-Lane CDRs • Multi-Lane Signal Conditioners • Laser & Modulator Drivers • Limiting Amplifiers • Transceiver ICs

CY7C1041DV33-10ZSXI

Abstract: CY7C1041DV33 CY7C1041DV33-10VXI
Contextual Info: CY7C1041DV33 PRELIMINARY 4-Mbit 256K x 16 Static RAM Features Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte LOW Enable (BLE) is LOW, then data from I/O pins (I/O0–I/O7), is written into the location specified on the address pins (A0–A17). If Byte

Contextual Info: T E X A S I N S T R U M E N T S - P R O D U C T I ON D ATA Stellaris LM3S1512 Microcontroller DATA SH E E T DS - LM 3S 1512 -1 2 7 4 6 .2 5 1 5 S P M S 018H C opyri ght 2007- 2012 Texas Instruments Incorpor at ed Copyright Copyright © 2007-2012 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments

philips diode PH 33J

Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without

UM61256FK-15

Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch

RJ2361

Contextual Info: Imaging CMOS CAMERA MODULES ROAD MAP ☆New product ★ Under development • CMOS Camera Modules Road Map Image format ~ 2013 2014 2015 ★RJ63EC200 ★RJ63GC900 21M 1/2.8 type 0.56 cc Built-in high-speed auto focus function 9.5 x 9.5 x 6.15 1/2.4 type 0.94 cc

Contextual Info: IS62WV1288DALL/DBLL IS65WV1288DALL/DBLL 128K x 8 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM FEATURES • High-speed access time: 35ns, 45ns, 55ns • CMOS low power operation: 12 mW typical operating 4 µW (typical) CMOS standby • TTL compatible interface levels

T1598

Abstract: Synton
Contextual Info: Preliminary November 1999 PBA 313 01/2 Bluetooth Radio Description Key Features PBA 313 01/2 is a short-range microwave frequency radio transceiver for Bluetooth communication links that are designed to operate in the globally available ISM frequency band, 2.4–2.5 GHz.

121C-2

Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

Contextual Info: 3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH WITH RATE MATCHING 2,048 x 2,048 IDT72V71623 PRODUCT DISCONTINUATION NOTICE - LAST TIME BUY EXPIRES JULY 31, 2015 • Direct microprocessor access to all internal memories FEATURES: • Memory block programming for quick setup

Contextual Info: DIGITAL ISOLATOR PRODUCT SELECTION AND RESOURCE GUIDE Spring 2015 Edition Performance | Integration | Ef ficiency | Reliability | Safety Digital isolators with iCoupler technology enable designers to implement isolation in designs without the cost, size, power, performance, and

Contextual Info: 3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH 4,096 x 4,096 IDT72V70840 PRODUCT DISCONTINUATION NOTICE - LAST TIME BUY EXPIRES JULY 31, 2015 FEATURES: • • • • • • • • • • • • • Internal Loopback for testing Available in 144-pin Thin Quad Flatpack TQFP and

XC95XXXL

Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
Contextual Info: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

Contextual Info: R DiePlus Advantage SiliconBlue January 25, 2011 2.0.6 Data Sheet DiePlus Advantage is SiliconBlue’s focused program to provide designers with an optimal device mounting solution for mobile handheld applications. This data sheet provides detailed information regarding DiePlus

A9701

Abstract: MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4

XcxxX

Abstract: vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
Contextual Info: The Reliability Data Program Expanded Version April. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4

XC2018 PC84

Abstract: xc4300 XC4020 HQFP208 HQFP34 XC1765D XC3342 XC4305 XC4005E PHYSICAL XC500 356E-09
Contextual Info: The Reliability Data Program Expanded Version April 1, 1998 Cover TABLE OF CONTENTS Introduction .3 The Reliability Program. .3