BG20 Search Results

Contextual Info: 1 2 3 5 4 6 7 8 Global Connector Technology Ltd. - BG200: 2.54mm PITCH SOCKET, DUAL ROW, SURFACE MOUNT, HORIZONTAL A A B B C C D D E E SPECIFICATIONS 规格 CURRENT RATING 电流额定值： 3 AMP INSULATOR RESISTANCE 绝缘电阻值： 1000 MEGOHMS MIN. DIELECTRIC WITHSTANDING 耐电压： AC 600 V

Contextual Info: 5 3 1 2 4 Global Connector Technology Ltd. - BG205: 2.54mm PITCH SOCKET, SINGLE ROW, SURFACE MOUNT, HORIZONTAL 6 7 8 A A B B C C D D E E SPECIFICATIONS 规格 CURRENT RATING 电流额定值： 3 AMP INSULATOR RESISTANCE 绝缘电阻值： 1000 MEGOHMS MIN.

BPTM

Contextual Info: H><3 V'-' BG2011SM-B GaAs Integrated Circuit DESCRIPTION: BG2011SM-B is a GaAs Integrated Circuit designed lor Wideband Low Noise Ampfification. See Figures 1 - 1 5 ABSOLUTE MAXIMUM RATINGS: Ta = 25’C Drain to Source Voltage Vds Gate To Source Voltage

Contextual Info: BG2097-642 Diodes Miscellaneous Diode Semiconductor MaterialSilicon Package StyleAssembly Mounting StyleT DescriptionH.V. Tripler;Vi p-p 8.6kV;VO 25kV;IO 1.5mA;w/focus Potentiometer

Diagrams

Abstract: 5185143 BG-272 mold cap BG256 BG352 BG-209 Package Diagrams 14X22
Contextual Info: Package Diagrams Ball Grid Array Packages 119-Lead PBGA 14 x 22 x 2.4 mm BG119 51-85115-*A 1 Package Diagrams 209-Lead PBGA (14 x 22 x 2.20 mm) BG209 51-85143-*A 2 Package Diagrams 256-Lead PBGA (27 x 27 x 2.33 mm) BG256 51-85097-*A 3 Package Diagrams 272-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG272

BG2000-641

Contextual Info: BG2000-641 Diodes Miscellaneous Diode Semiconductor MaterialSilicon Package StyleAssembly Mounting StyleT DescriptionH.V. Tripler;Vi p-p 10kV;VO 27.5kV;IO 1.7mA;w/limiting resistor and clamper diode

Contextual Info: BG2097-641 Diodes Miscellaneous Diode Semiconductor MaterialSilicon Package StyleAssembly Mounting StyleT DescriptionH.V. Tripler;Vi p-p 8.6kV;VO 25kV;IO 1.5mA;w/focus resistor

Contextual Info: BG2000-641-004 Diodes Miscellaneous Diode Semiconductor MaterialSilicon Package StyleAssembly Mounting StyleT DescriptionH.V. Tripler;Vi p-p 10kV;VO 27.5kV;IO 1.7mA;w/limiting resistor and clamper diode

UL-94VO

Abstract: BG2000
Contextual Info: BG2000 SERIES 20 Element BG2000 is a family of Bar graphs of various colours up to 20 elements. Light Emitting Diodes 3x3mm are mounted in a black Polycarbonate housing which conforms to flammability specification UL-94VO. The LEDs are aligned with a flat top

Contextual Info: _ . . . nDHffl GaAs device Absolute maximum ratings Ta=25°C Part No. BG20Î1SM-B Application CATV,DBS IF Electrical characteristics (Ta=25°C ) VDS(V) VGS(V) PT(mW) T c h fC ) PG Typ.(dB) NF Typ.(dB) 6 -4 200 125 10 2.1 •Dimensions •Circuit f(GHz)

SED1520D0A

Abstract: BG20232A
Contextual Info: BO LYMIN BG20232A Feature 1. COB with metal frame 2. Built-in internal clock 3. Built-in controller SED1520D0a 4. 1/32 duty cycle 5. + 5V single power supply 6. Option: LED, EL B/L 7. Option: +3V single power supply Mechanical Data Item Standard Value Module Dimension 146.0 x 43.0

UL-94VO

Contextual Info: BG2000B SERIES 20 Element Bargraph BG2000B is a family of Bar graphs of various colours up to 20 elements. Light Emitting Diodes 3x3mm are mounted in a black Polycarbonate housing which conforms to flammability specification UL-94VO. The LEDs are aligned with a flat top for direct

94vo

Contextual Info: BG2000 SERIES 20 Element Bargraph BG2000 is a family of Bar graphs of various colours up to 20 elements. Light Emitting Diodes 3x3mm are mounted in a black Polycarbonate housing which conforms to flammability specification UL94VO. The LEDs are aligned with a

Contextual Info: 1 2 3 5 4 6 7 8 Global Connector Technology Ltd. - BG080: 2.54mm PITCH PIN HEADER, SINGLE ROW, SURFACE MOUNT, HORIZONTAL, WITHOUT LOCATING PEG A A B B C C D D E E SPECIFICATIONS 规格 Ordering Grid CURRENT RATING 电流额定值: 3 AMP INSULATION RESISTANCE 绝缘电阻值: 1000MΩ MIN.

Contextual Info: 5 1 2 3 4 Global Connector Technology Ltd. - BG050: 2.54mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT, VERTICAL 6 7 8 A A B B C C D D E E SPECIFICATIONS 规格 Ordering Grid CURRENT RATING 电流额定值: 3.0 AMPERE INSULATION RESISTANCE 绝缘电阻值: 1000MΩ Min.

tundra scv64

Abstract: CA91C078 SCH 298 SCV64 D854 btb 137 SCV-64
Contextual Info: Backplane Interface Components - SCV64 User Manual 4 Signals and DC Characteristics 4.1 Terminology The input and output types have all been abbreviated with a letter code. For example, the VDATA31-00 signals are shown as input type CTTL which are CMOS inputs with normal

MD500

Abstract: automatic daisy chain VME VME DAISY CHAIN 700C1
Contextual Info: NEWBRIDGE MICROSYSTEMS CRUMBS' 2SE D • tSôfllOl 0 0 0 0 b 7 ô 3 CAS1C014 VMEbusAVICS CONTROL CIRCUIT ÀCC T-52 -33 -55 • Full VMEbus system controller functions • Auto-ID slot Identification • Automatic VMEbus SYSCON Identification • The CA91C014 Advanced System Architecture Control

Contextual Info: Openbus I/F Components - VMEbus User Manual 2.0 2.1 ACC Description Introduction This section describes the AVICS Comrol Circuit ACC . A general architectural description of the ACC is provided, followed by detailed descriptions of the signal pins and major ACC functional modules, including

Contextual Info: Mobile 3rd Generation Intel Core Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family Datasheet, Volume 1 of 2 June 2013 Document Number: 326768-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

CY7C1461V25

Abstract: CY7C1463V25 CY7C1465V25
Contextual Info: CY7C1461V25 CY7C1463V25 CY7C1465V25 PRELIMINARY 1M x 36/2M x 18/512K x 72 Flow-Thru SRAM with NoBL Architecture Features • Zero Bus Latency, no dead cycles between Write and Read cycles •Supports 133-MHz bus operations •1M x 36/2M × 18/512K × 72 common I/O

PEC 4179 DIODE

Abstract: 327879-001US
Contextual Info: Intel Communications Chipset 89xx Series Datasheet October 2012 Order Number: 327879-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

g41 motherboard repair

Abstract: TOM - 2088 - BH AF 82801 IBM TOM 2088 BH gm45 intel intel chipset g33 motherboard repair 2088 rgb matrix 320123 laptop lcd cable 30 pin diagram intel g31 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet August 2008 Document Number: 320122-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PM965

Contextual Info: Mobile Intel 965 Express Chipset Family Datasheet Revision 001 May 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

TPS5117

Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
Contextual Info: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation