ASE QFP Search Results

PCN0113

Abstract: BGA and QFP Package EP20K1500E EP20K400E EPC16
Contextual Info: PROCESS CHANGE NOTICE PCN0113 ADDITIONAL ASSEMBLY LOCATION Change Description: Altera is adding FineLine BGAä and QFP package capability at ASE’s assembly location in Kaohsiung, Taiwan. Reason For Change: ASE Malaysia is already a strategic manufacturing partner for Altera’s existing products.

3248L

Contextual Info: RELIABILITY REPORT DATE: 6/8/05 QUALITY ENG : PART NUMBER MICREL KS8001L/KSZ8001L KS8001LD/KSZ8001LD PROJECT # PACKAGE TYPE : ASSEMBLY LOC LOT # FAB LOC D/C # PROCESS KS8001S 48L SSOP OSE GD64047MEA TSMC 0437A 0.18 um KS8001LD 48L QFP ASE GD64047MEK TSMC 0503A

PCN0504

Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
Contextual Info: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera’s quad flat pack QFP packages. All QFP packages assembled at ASE in Malaysia and Amkor in

PCN0310

Abstract: EME-6300 MP-8000 MP8000 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000
Contextual Info: PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE FOR 100 LEAD QFP PACKAGE Change Description: ASE Malaysia will be extending the use of Nitto’s MP-8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 series

Contextual Info: RELIABILITY REPORT Date: 10/17/08 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8841/42 PMQL Qual vehicles KSZ8841/42PMQL PACKAGE TYPE : ASSEMBLY FAB LOC 128L QFP ASE/TICP TSMC ESD RATINGS FIT RATE ESD-HBM: +/- 1500V TSMC 0.15 um process: 6.6 FIT PROCESS 0.15 um

Contextual Info: IC S1 8 9 1 Integrated Circuit Systems, Inc. Product Preview 100B ase -T X Integrated PH Y ce iver for Repeaters General Description Features The ICS1891 is a fully integrated physical layer device sup­ porting 100 Megabits per second CSMA/CD Ethernet Re­

QFP128

Abstract: QFP-128 QFP-128 20 x 14
Contextual Info: F R E E S C A L E SEMICONDUCTOR, A L L R I G HT S RESERVED. T IT LE ; INC. MECHANICAL QUAD F L A T P A C K A G E QFP , 128 LEADS, 0. 50 PITCH (14 X 20 X 2.7 P KG) OUTLINE DECUMENT C ASE EEINT NE 98ASE70213A NUMBEE: 9 7 5 - 0 1 5TANDAED VEESIEN NEN-JEDEC

Contextual Info: O K I Semiconductor MSM635176351 L-xx Built-in 8 or 5 bit Serial Port and LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION T h e M SM 6351/6351 L-xx is a lo w -p o w e r m ic ro co n tro lle r m a n u fa c tu re d in silicon g a te C M O S technology. In teg ra te d into a single ch ip a re ROM , RA M , five I / O p o rts, serial I / O p o rt, tim e-b ase

Contextual Info: Flat Plastic Package QFP M ounting M ethods Surface Mounting P ackage Han­ dling Precautions 1. P ack ag e tem p eratu re d istribu tio n T h e m ost com m on m eth od u sed for m ou nting a su rface m ounting d ev ice is infrared reflow . S in ce th e p ack ag e is m ad e of a b lack ep oxy

LED spectrum analyzer

Abstract: AC0831 AD9831 9831a
Contextual Info: MB ANALOG DEVICES G b n p le te C C S Æ8631 FEATURES 3 V /5 V Power Supply 25 MHz Speed On-Chip SINE Look-Up Table On-Chip 10-Bit DAC Parallel Loading Powerdown Option 72 dBSFDR 125 mW (5 V Power Consumption 40 mW (3 V) Power Consumption 48-Pin TQFP G ENERAL D E S C R IPT IO N

iei-1209

Abstract: nec 75312
Contextual Info: NEC /iPD 75312 A , 75316(A ) ORDERING INFORMATION Part N u m b e r Packa ge Q u a lity G rade /iP D 7 5 3 1 2 G F (A )-xxx-3 B 9 8 0 - p i n p l a s t i c QFP (1 4 x 2 0 m m ) S p e c ia l /¿PD7531 6 G F ( A ) - x x x - 3 B 9 8 0 - p i n p l a s t i c QFP (1 4 x 2 0 m m )

Contextual Info: HO LTEK r r HT1620 RAM Mapping 32x4 LCD Controller for I/O uC LCD Product Line Selection Table HT1620 HT1621 HT1622 HT16220 HT1623 HT1625 HT1626 HT1627 HT16270 COM 4 4 8 8 8 8 16 16 16 SEG 32 32 32 32 48 64 48 64 64 V V V V V V B uilt-in Ose. C ry stal Ose.

Contextual Info: QFP Carrier & Development Socket Ju n e 1996, ver. 10 Features D ata S h e e t • ■ ■ ■ ■ General Description Q u a d flat p ac k Q FP c a rrie rs p ro te c t frag ile le a d s o n Q F P d ev ice s d u rin g sh ip p in g a n d d ev ic e h a n d lin g .

AT91R40807-33AI

Abstract: ATMEL shipping label AT91M6320025AU AT91R40807-33AU AT91M63200-25AI 020C AT91M63200-25AU AT91R40807 JESD97 33ai
Contextual Info: PCN / EOL Notification Product Change Notification Number: RC061601 Date: May 10, 2006 Title: Transition to Green Version of AT91 ARM-based MCUs in QFP Packages Product Identification: Current Part Number AT91R40807-33AI AT91M63200-25AI Reason for Change:

Contextual Info: KM716V689 64Kx16 Synchronous SRAM 64K X 16-Bit Synchronous Pipelined Burst SRAM FEATURES GENERAL DESCRIPTION • Synchronous O peration. The K M 716V689 is a 1,048,576-bit S ynchronous Static • 2 Stage Pipelined operation with 4 Burst R andom • O n-Chip Address Counter.

FLH 211

Abstract: IR 92 0151 MENS MENS package
Contextual Info: •PACKAGE DIMENSIONS DIP8 Pi8 r~i r^ i h 3 «o O V K? \J LJ rzzzi a ’• r 0-15* Unit: m m DIP 14 r^ i U nit: m m N ew fa panfh cloi Co.,dil . 2-3 4 D I MENS I ONS DIP 16 19.0 O 0 —15* U nit: m m DIP 18 V I J 1 l^ J U 9 7.62 J I = Z L i\ 0 —15* U n it i

WQB3000

Contextual Info: 1 BGAI QFP-Rework System WQB 3000 Betriebsanleitung Operating Instruction Version 1.1 2 T a b la of Contents 1 Description T&çhnfcal u'ata 2 Start-up 2.1 Eei-up 2.2 Preliminaries 2.3 Attachment and al.gnmentof the circuit boarri and soldering nozzle 3 Operation with the Programming unit

SY68730ZC

Abstract: MIC29302BT SY68730 sy10s897 0343a KS8721BL Unisem tsmc cmos tsmc cmos 0.35 KSZ8695PX
Contextual Info: Autoclave Pressure Pot Test + 121C / 15 PSIG (With Pre-con 3X Reflow ) MSL Pkg Lds Device D/C Process Qty Hours Rej Assembler L3 L3 L3 L3 BGA BGA BGA BGA 289 289 289 289 KS8695PX KS8695PX KS8695PX KSZ8695PX 0407 0421A 0417A 0452A TSMC .18 TSMC .18 TSMC .18

EN3742A

Abstract: LB1810M Fdd spindle motor circuit 491-kHz ELTEC 491kHz
Contextual Info: [Ordering number: EN37Ä2A Monolithic Digital 1C LB1810M ISA0YOI FDD Spindle Motor Driver Overview Package Dimensions The LI* 18I0M is a3-phase 1 1) motor driver 10 and is an ideal FDD spindle motor driver for 3.5 inch applications. unirmm 4 ;v ,é$- / 3148-QFP44MA

amplifier equalizer mixer connection diagram

Contextual Info: Monolithic ICs Memory IC s- * Motor Driver- 15 4 D C m otor driver 5 Electronic governor 5 Single phase ful wave motor driver forfanmotor

IC-3333

Abstract: color tv HORIZONTAL DRIVER TRANSISTOR square-law BU12300
Contextual Info: Monolithic ICs Memory ICs-4 Motor Driver- ie U n a -u p . 4 D C m otor d riv e r. . 16

IDT CODE DATE marking FORMAT

Abstract: IDT package marking IDT Package Marking format IDT CODE DATE marking assembly site date code format STAC9750XXTAEC1X STAC9767XXTAEC1X STAC9751XXTAEC1X SG0703-02 STAC9200X5TAEB1X
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SG0703-02 DATE: Product Affected: See Listing in Attachment 2 April 2, 2007 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Mark

D3318

Contextual Info: PDSP16350 @ M ITEL l/Q Splitter/NCO S E M IC O N D U C T O R Supersedes version in Decem ber 1993 Digital Video & DSP IC Handbook, HB3923-1 T h e P D S P 1 6 3 5 0 p ro v id e s an in te g ra te d s o lu tio n to the need for v e ry accurate, digitised, sine and cosine w aveform s.

DAC with 8051 to control speed of 12v dc motor

Abstract: dc servo motor interface with 8051 POWER BRIDGE APW 20 DB
Contextual Info: ¿ihcotiMknts SSI 32H4633 Hybrid Servo & Spindle Controller A TDK Group/Company Preliminary Data December 1992 DESCRIPTION Spindle Motor Speed Control The SSI 32H4633 is a CMOS monolithic integrated circuit housed in a 100-pin QFP and operates on a single +5V supply. In addition to supporting Winchester