AK31 Search Results

Contextual Info: Tension spring | Spacing 5.0 mm AK3101/.WD-5.0-PEBBLE GREY 1- to n-poles Order Data Spacing 5.0 mm Technical Data Article Designation Article Number Solid min 0.14 mm² Material PA 6.6 2 12.90 AK3101/2WD-5.0-PEBBLE GREY 53101020021F 200 solid max 2.5 mm²

Contextual Info: Tension spring | Spacing 5.0 mm AK3100/.-5.0-PEBBLE GREY 1- to n-poles Order Data Spacing 5.0 mm Technical Data Article Designation Article Number Solid min 0.14 mm² Material PA 6.6 2 12.20 AK3100/2-5.0-PEBBLE GREY 53100020001F 200 solid max 2.5 mm² Flammability Class

Contextual Info: Tension spring | Spacing 2.5 mm AK3191/.KD-2.5-PEBBLE GREY 2- to n-poles Order Data Spacing 2.5 mm Technical Data Poles Width (mm) Article Designation Article Number Solid min 0.08 mm² Material PA 6.6 2 7.00 AK3191/2KD-2.5-PEBBLE GREY 53191021001F 200

Contextual Info: Tension spring | Spacing 2.5 mm AK3191/.-2.5-PEBBLE GREY 2- to n-poles Order Data Spacing 2.5 mm Technical Data Poles Width (mm) Article Designation Article Number Solid min 0.08 mm² Material PA 6.6 2 7.00 AK3191/2-2.5-PEBBLE GREY 53191020001F 200 solid max

MC 4011 BCP

Abstract: PKT 4113 API ncp 6131 SWITCHING SYSTEMS INTERNATIONAL sqm 225 leach 1522 her 4541 MSP SNCP t 1451 n 52 toh SWITCHING SYSTEMS INTERNATIONAL sqm 350 k2400 EQUIVALENT
Contextual Info: EtherPHAST -24 Device 2x OC-12/STM-4 SONET/SDH Ethernet Mapper TXC-06745 DATA SHEET TXC-06745-MB, Ed. 2 February 2006 FEATURES APPLICATIONS • Client Interfaces: 2x GMII/24x SMII/4x TBI/MPI 24 channel packet all pin shared • Two serial Gigabit Ethernet (1.25 Gbit/s) ports with integrated CRSU/SerDes (8B/10B)

Contextual Info: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz

ah30 diode

Abstract: AH34 mosfet ak24 diode thermistor M33 irf7832 ISL62882 n34 transistor w8 mosfet transistor c36 Burndy y34 lug specifications
Contextual Info: ISL62882EVAL2Z User Guide Application Note April 9, 2009 AN1461.0 Author: Jia Wei Introduction Interface Connections The ISL62882EVAL2Z evaluation board demonstrates the performance of the ISL62882 multiphase synchronous-buck PWM VCORE controller implementing Intel IMVP-6.5

00XXX001

Abstract: BA 5979 R15C3 OR3T125 OR3T20 OR3T30 OR3T55 PT10 PT11 PT12
Contextual Info: Data Sheet November 2006 ORCA Series 3C and 3T Field-Programmable Gate Arrays Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Baseline FPGA family used in Series 3+ FPSCs field programmable system chips which combine FPGA logic

AT91 TC CAPTURE

Abstract: AT91FR40162
Contextual Info: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor Core • • • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – Embedded ICE In-circuit Emulation

Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 2, 5/2005 Advance Information MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional

APA600

Abstract: AA23 APA075 APA1000 APA150 APA300 APA450 APA750
Contextual Info: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP Note For Package Manufacturing and Environmental information, visit the Package Resource center at . v5.8 2-1 ProASICPLUS Flash Family FPGAs

Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 8, 2/2007 Technical Data MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E PowerQUICC™ II Pro is a next generation PowerQUICC II integrated host processor. The MPC8349E contains a PowerPC™ processor core built on Power

729-Pin

Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
Contextual Info: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at

VR12000

Abstract: uPD30710 0PC25 SGI DSD uPD30700 tag 9022 VR10000 VR5000TM uPD30710RS-300 U12703EJ1V0DS00
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD30700,30700L,30710 VR10000TM, VR12000TM 64-BIT MICROPROCESSORS DESCRIPTION The µPD30700 and 30700L VR10000 and µPD30710 (VR12000) are new members of NEC’s VR seriesTM RISC (Reduced Instruction Set Computer) microprocessors. These new high-performance 64-bit microprocessors employ

Contextual Info: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15

Contextual Info: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15

socket am3 pinout

Abstract: socket AM2 pinout AM2 pinout Socket F am2 socket pin diagram am3 socket pinout am3 socket pin diagram am2 socket pinout socket AM3 pinout diagram PCIe cable pinout LX5511
Contextual Info: Broaddown4 User Manual Issue – 2.00 draft Enterpoint Ltd. - Broaddown4 Manual – Issue 2.00 11/04/2007 Kit Contents You should receive the following items with you Broaddown4 development kit: 1 - Broaddown4 Board 2 - Programming Cable Prog2 Figure 1 - Broaddown4 Board

Contextual Info: Electrical Characteristics 12.1 Signal Specifications 12.1.1 Unused Pins 12 For reliable operation, always connect unused inputs to an appropriate signal level. Unused A G TL+ inputs should be connected to V 7 7 . Unused active low 3.3 V-tolerant inputs should be

SPRS836D

Contextual Info: TCI6638K2K SPRS836D—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6638K2K Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core

Contextual Info: Product Obsolete/Under Obsolescence R XC4000XLA Family Field Programmable Gate Arrays Package Pinouts XC4013XLA Pinout Table XC4013XLA Pinout Table Continued XC4013XLA Pinout Table PAD NAME PQ160 PQ208 PQ240 I/O – – P21 BG256 H1 PAD NAME PQ160 PQ208

AJ314

Abstract: usb joystick circuit diagram intel 945 crb VIP 22 A CS130 RC5 Infrared 38b A216 SC2200UFH-300 SC3200 DOC2000
Contextual Info: Geode SC2200 Thin Client On a Chip General Description The Geode™ SC2200 Thin Client On a Chip device is a member of the National Semiconductor IA Information Appliance On a Chip family of fully integrated x86 system chips. The Geode SC2200 includes:

Contextual Info: 66AK2H12/06 Multicore DSP+ARM KeyStone II System-on-Chip SoC Data Manual PRODUCT PREVIEW information applies to products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products

outp32

Abstract: M21130 AA30 AA34 AB30 OUTP23 NCN30
Contextual Info: M21130 68 x 68 3.2 Gbps Crosspoint Switch with Input Equalization Data Sheet Features - 4 Terminal Descriptions - 5 Specification Tables - 8 Functional Description - 17 Register Information - 20 Package Information - 25 World Wide Sales Companies - 34 21130-DSH-001-B, 3/27/03

transistor bl p89

Abstract: bl p74 transistor J955 XC4000 XC4000A XC4000D XC4000E XC4000EX XC4000H p180 g8
Contextual Info: book XC4000E and XC4000X Series Field Programmable Gate Arrays R January 29, 1999 Version 1.5 6* XC4000E and XC4000X Series Features Note: XC4000 Series devices described in this data sheet include the XC4000E family and XC4000X Series. XC4000X Series devices described in this data sheet