ABLEBOND 86 Search Results

Ablebond 74-1

Abstract: 12L3 Z0 607 MN 53231 Ablebond 36-2
Contextual Info: What H EW LETT f t "KM P A C K A R D 6 -2 0 GHz Amplifier Technical Data HMMC-5618 Features • High Efficiency: 11% @ P.ldB Typical • Output Power, P ldB: 18 dBm Typical • High Gain: 14 dB Typical • F lat Gain Response: ±0.5 dB Typical • Low Input/Output VSWR:

Ablebond 71-1

Abstract: Ablebond 71 Ablebond SN74ABT162827 SN74ABT162827A
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT162827A, Die Revision A October 17, 1996 Abstract Texas Instruments has qualified a device revision for the ABT162827A ‘A’ die. This device was redesigned in order to incorporate improved ESD protection circuitry. Included in this revision was an

Ablebond 71

Abstract: Ablebond 190
Contextual Info: • 2 2 1 HEWLETT' ëSE M PACKARD 23 GHz LNA 21.2-26.5 GHz Technical Data HMMC-5023 Features • Frequency Rajige: 21.2-23.6 GHz and 24.5-26.5 GHz Specified 21-30 GHz Performance • Low Noise Temperature: 226 K (2.5 dB N.F.) Typical • High Gain: 24 dB Typical

C5023

Abstract: ZQ50A
Contextual Info: 1 wrm HEW LETT 1 LEM PA C K A R D 23 GHz LNA 2 1 .2 -2 6 .5 GHz Technical Data HMMC-5023 Features • Frequency Range: 21.2-23.6 GHz and 24.5-26.5 GHz Specified 21-30 GHz Performance • Low Noise Temperature: 226 K (2.5 dB N.F.) Typical • High Gain: 24 dB Typical

ablebond 163-4

Abstract: Ablebond 71 GaAs MMIC ESD, Die Attach and Bonding Guidelines HMMC-5023 ABLEBOND 55-1 Ablebond 190
Contextual Info: 23 GHz LNA 21.2 – 26.5 GHz Technical Data HMMC-5023 Features • Frequency Range: 21 .2 – 23.6 GHz and 24.5 – 26.5 GHz Specified 21– 30 GHz Performance • Low Noise Temperature: 226 K (2.5 dB N.F.) Typical • High Gain: 24 dB Typical • 50 Ω Input/Output Matching

Ablebond 71-1

Abstract: j 5804 Ablebond SN54ABT2240A SN74ABT2240A TEXAS INSTRUMENTS, Mold Compound ASL2B
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT2240A, Die Revision J September 17, 1996 Abstract Texas Instruments has qualified a device revision for the ABT2240A, die revision ‘J’ . This device was redesigned in order to incorporate improved ESD protection circuitry. Revision to the A device is

Ablebond

Contextual Info: 27.5-29.5 Three Stage GBAIpJia MMIC Driver Amplifier AA028P3-00 Features • Single Bias Supply Operation +6V ■ Designed for 27.5-29.5 GHZ LMDS & Digital Radio Bands ■ 19 dB Small Signal Gain Typical at 28 GHz ■ 16 dBm Output Power at 28 GHz (1 dBc)

41264

Abstract: 58779
Contextual Info: 20 -24 G H z G a A s M M IC Pow er Am plifier AA022P1-00 Features Chip Layout • Single Bias Supply Operation +6V ■ Broad Coverage of K -B and ■ 15 dB Small Signal Gain ■ 25.5 dBm Saturated Output Power at 23 G H z ■ 18% Power Added Efficiency at 23 GHz

JESD22-A118

Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

7261 markem

Abstract: Ablebond 968 Ablebond 84-1LMISR4 Ablebond 84-1*SR4 CF7000 7261 markem white lonco 3355 sd marking bh cf700095nf texas instruments package marking
Contextual Info: TEXAS INSTRUMENTS Informational Notification of the 400 and 600 MIL PDIP to Pacific Semiconductor Incorporated Manila January 29, 1998 Abstract Texas Instruments Standard Linear and Logic is announcing the transfer of package assembly site for 400 and 600 mil PDIP product from Texas Instruments, Philippines (TIPI) to a qualified subcontractor,

SUMITOMO CRM1076

Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers

Ablebond 71-1

Abstract: Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74BCT8373A, Die Revision B February 7, 1996 Abstract Texas Instruments has qualified the SN74BCT8373A, Die Revision B, to replace the SN74BCT8373, no die revision. Die revision B was redesigned to conform to IEEE Standard 1149.11990 JTAG . The die and device revision are necessary to change the TDO drive state controls to

Contextual Info: Preliminary Information Agilent AMMC-6220 6 - 20 GHz Low Noise Amplifier Data Sheet Features • • • • • • Wide Frequency Range: 6 – 20 GHz High Gain: 23 dB Low Noise Figure: 2.2 dB 50 Ω Input and Output Match Flat Gain Response Single 3V Supply Bias

90980

Abstract: MS 21059 AMMC-6231 9969
Contextual Info: Preliminary Information Agilent AMMC - 6231 18 –31 GHz Low Noise Amplifier Data Sheet Features Features • • • • • • Wide Frequency Range: 18 – 31 GHz High Gain: 22 dB Low Noise Figure: 2.4 dB 50 Ω Input and Output Match Flat Gain Response

avago 4005

Abstract: 339E
Contextual Info: AMMC-6430 25 - 33 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1870 µm 100 x 74 mils Chip Size Tolerance: ± 10µm (±0.4 mils) Chip Thickness: 100 ± 10µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6430 MMIC is a broadband nearly 1W power

gold metal detectors

Abstract: AMMC-6345 AMMC-6430
Contextual Info: AMMC - 6430 25 - 33 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10µm (±0.4 mils) Chip Thickness: 100 ± 10µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6430 MMIC is a broadband nearly 1W power

AMMC-6345

Abstract: AMMC-6430
Contextual Info: Agilent AMMC-6430 25 – 33 GHz Power Amplifier Data Sheet Features • Wide frequency range: 25 - 33 GHz • High gain: 17 dB • Power: @30 GHz, P-1dB=29 dBm Description The AMMC-6430 MMIC is a broadband nearly 1W power amplifier designed for use in transmitters that operate in

AMMC-6345

Abstract: AMMC-6430
Contextual Info: AMMC - 6430 25 - 33 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10µm (±0.4 mils) Chip Thickness: 100 ± 10µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6430 MMIC is a broadband nearly 1W power

DC TO 18GHZ RF AMPLIFIER MMIC

Abstract: gold metal detectors AMMC-6345 AMMC-6425 vg 9612
Contextual Info: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power amplifier

Contextual Info: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power

Contextual Info: AMMC - 6430 25 - 33 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1870 µm 100 x 74 mils Chip Size Tolerance: ± 10µm (±0.4 mils) Chip Thickness: 100 ± 10µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6430 MMIC is a broadband nearly 1W power

Contextual Info: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1870 µm 100 x 74 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power amplifier designed for use in transmitters that operate in

AMMC-6345

Abstract: AMMC-6425 247E03
Contextual Info: Agilent AMMC-6425 18 – 28 GHz Power Amplifier Data Sheet Features • Wide frequency range: 18 - 28 GHz • High gain: 20 dB • Power: @27 GHz, P-1dB=30 dBm Description The AMMC-6425 MMIC is a broadband 1W power amplifier designed for use in transmitters that operate in

AMMC-6425

Abstract: AMMC-6345 DF100
Contextual Info: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power