AA18 MARK Search Results

PD6722 - Implementing DMA Functionality

Abstract: CON AT62B LA18 74LS04 PAL20L88 AA23 AA17 LM386-1 CON AT36B con50a lm3861
Contextual Info: PD6722 — Implementing DMA Functionality Application Note May 2001 As of May 2001, this document replaces the Basis Communications Corp. document AN-PD4. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

PD6729 - Routing PCMCIA Interrupts in a PCI-Based System

Abstract: bridge ba20 SI9953DY AA23 BA23 BA24 BA25 CL-PD6729 PD6729 si9953dy cpu
Contextual Info: PD6729 — Routing PCMCIA Interrupts in a PCI-Based System Application Note May 2001 As of May 2001, this document replaces the Basis Communications Corp. document AN-PD3. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

MT29C1G12

Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
Contextual Info: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package

FBGA 896

Abstract: AA13 896-Pin AJ26 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Contextual Info: IGLOO e Packaging 3 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note: This is the bottom view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at

A104

Abstract: AA10 AS3SSD16GB5PBG ata commands 16GB Nand flash dual channel flash chip 8gb silicon power 4GB AB22-AB23
Contextual Info: SOLID STATE DISK PRELIMINARY Solid State Disk On Chip SSDoC AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG Not recommended for new designs. Contact Micross Marketing & Sales to discuss availability. The new microSSD is the recommended replacement part. FEATURES

ICH4-M

Abstract: 82801DB 852GM 852GMV AA10 VCC62 intel DOC 3053* intel
Contextual Info: R Mobile Intel Pentium® 4 Processor-M and Intel® 852PM/GME/GMV Chipset Platform Design Guide Update April 2005 Notice: The Intel® 852PM/GME/GMV chipset families may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current

capacitor AA8

Abstract: CR21-000 resistor 30 pin flex circuit connector CR21-102J capacitor AA7 resistor network 102J TAJB107M016 AMP flex circuit connector mark W8 Diode schottky DIODE MOTOROLA B14
Contextual Info: May 2001, ver. 1.02 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01.01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K200SFC-1 device

resistor network 102J

Abstract: C51 development board CR21-102J TAJC477M010 capacitor AA7 diode AA19 altera board
Contextual Info: June 2000, ver. 1.01 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01.01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K100EFC-1 device

mark AT0

Abstract: 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 AFS090
Contextual Info: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at

IO01

Abstract: mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1
Contextual Info: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at

intel 31154

Abstract: 31154 pci 31154 LT1085 M66EN w612 ad52 001 variable voltage regulator 0/intel 31154 L1014
Contextual Info: Intel 31154 133MHz PCI Bridge Design-In Considerations with IBM PCI-X to PCI-X Bridge Application Note August 2003 Order Number: 278806-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

LSISASx12

Abstract: diode t25 4 F8 lsisas1064 diode t25 4 g8 epbga nas 7820 diode t25 4 d9 diode t25 4 j6 pinout scsi sata smp Y2
Contextual Info: LSISASx12 3.0 Gbit/s Serial Attached SCSI Expander Datasheet Version 2.0 The LSISASx12 expander is a 12-port, 3 Gbit/s Serial Attached SCSI SAS expander device. The LSISASx12 expander provides the functionality for connecting targets and initiators. The expander provides

intel Chipset CRB Schematics

Abstract: vga connector vga connector footprint intel 82801DB pin vga CRT pinout 82801DB 852GM AA10 SN74LVC2G125 intel DOC
Contextual Info: R Mobile Intel Pentium® 4 Processor-M and Intel® 852GM Chipset Platform Design Guide Update April 2005 Notice: The Intel® 852GM chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata

diode t25 4 L9

Abstract: DIODE T25 4 t25 4 l9 diode t25 4 H9 diode t25 4 L5 diode t25 4 F6 DIODE MOTOROLA B34 SOCKET-PLCC20 T25 4 h5 t25 4 k8
Contextual Info: August 1999, ver. 1 Features Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ General Description Altera Corporation A-DS-PCI-C-01 FLEX 10KE PCI Development Board Universal 64-bit, 66-MHz peripheral component interconnect PCI expansion card Includes the FLEX® 10KE EPF10K100EFC-1 device

LSISASx12

Abstract: lsisas1064 pinout scsi sata msi g20 LSISAS ARM926 PAR64 Serial NVSRAM LSI Logic SAS controller chip CPCI-64
Contextual Info: LSISAS1064 4-Port 3 Gbit/s Serial Attached SCSI Controller Datasheet Version 2.0 The LSISAS1064 is a 4-port, 3.0 Gbit/s SAS/SATA controller that is compliant with the Fusion-MPT architecture, provides a PCI-X interface, and supports Integrated RAID™.

nec aa8

Abstract: AA5 mark diagram U1203
Contextual Info: DATA S H EET NEC MOS INTEGRATED CIRCUIT VR5000 64-BIT MICROPROCESSOR DESCRIPTION T h e mPD30500 V r5000 is a high-performance, 64-bit R IS C (Reduced Instruction Set Computer) type microproc­ essor employing the R IS C architecture developed by M IPS.

RX22p

Abstract: H20B2 AA19 AA23 AA30 AG27
Contextual Info: EP2A40 I/O Pins ver. 1.1 Table 1 shows all pins for the EP2A40 672-pin FineLine BGA, 724-pin ball-grid array BGA , and 1,020-pin FineLine BGA Table 1. EP2A40 Device Pin-Outs Pin Dual-Purpose I/O & Name/Function Function VREF Bank 8 IO TrueDiff_TX01p 8 IO

EP2C35

Abstract: LVDS93 LVDS179
Contextual Info: Cyclone II EP2C35 Device Pin-Out PT-EP2C35-1.9 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or

mark 3t1

Abstract: EP2C50 LVDS54P LVDS93
Contextual Info: Cyclone II EP2C50 Device Pin-Out PT-EP2C50-1.6 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or

D9KG

Abstract: marking code micron label marking aa5 152-Ball M2P20 MT46H64M32L2CG-6 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21
Contextual Info: Preliminary‡ 152-Ball x32 LPDDR-SDRAM PoP TI-OMAP Features LPDDR-SDRAM 152-Ball Package-on-a-Package (PoP) TI-OMAP MT46HxxxMxxLxCG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)

Contextual Info: Pin Information for the Cyclone V 5CSEBA5 Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A 5A

Contextual Info: Pin Information for the Cyclone V 5CSEBA5S Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A

bae rad750

Abstract: RAD750 rad750 user manual bae RAD750 processor A22 CGA board ae09 cga 624 hs01 SECDED mcc w04
Contextual Info: HS-01 12/2000 Version: 1.1 Technical Data 1 Power PCI PowerPC/PCI/Memory Controller Hardware Specifications The Power PCI chip developed by BAE SYSTEMS provides a radiation hardened PowerPC microprocessor common hardware reference platform CHRP compliant bridge between the PowerPC

Contextual Info: Pin Information for the Cyclone V 5CSEBA6S Device Version 1.2 Note 1 Bank Number 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3B 3B 3B 3B 3B 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 4A 5A 5A 5A