A6002 Search Results

LDS-A6002RI

Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER REV. LDS-A6002RI-UPG ELEC TRO -O P TIC AL CHARACTERISTICS Ta = 2 5 T PARAMETER PEAK WAVELENGTH FORWARD VOLTAGE REVERSE VOLTAGE AXIAL INTENSITY EMITTED COLOR: FACE COLOR: SEGMENT COLOR: MIN lf= 1Q m A MAX TYP UNITS 525 3.5

Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER REV. LDS-A6002RI-SUG ELECTRO-OPTICAL CHARACTERISTICS Ta = 25 T PARAMETER PEAK WAVELENGTH FORWARD VOLTAGE REVERSE VOLTAGE AXIAL INTENSITY EMITTED COLOR: FACE COLOR: SEGMENT COLOR: MIN lf=1QmA MAX TYP 574 2.2 UNITS nm Vf Vr

Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER REV. LDS-A6002RI-SUG ELEC TRO -O P TIC AL CHARACTERISTICS Ta = 2 5 T PARAMETER MIN TEST COND nm 2.2 2.6 Vf 5.0 AXIAL INTENSITY EMITTED COLOR: UNITS 574 FORWARD VOLTAGE REVERSE VOLTAGE MAX TYP PEAK WAVELENGTH lf= 1Q m A Vr

MALLORY CAPACITORS

Abstract: MALLORY Inductuner mallory 235 HT-288 mallory capacitor cross reference mallory capacitor HT-361-0 duracap capacitor HT-288-1 HT-234
Contextual Info: MALLORY - DURACAP INTERNATIONAL INC. P.O. Box 210, 59 Montclair Drive Woodstock, Ontario, Canada N4S 7W8 Telephone: 519 539-4891 Sales@duracap.com Fax:(519)539-6684 Cage Code 63778 E.I.A. Code 235 Web: www.duracap.com MALLORY CONTROLS - INDUCTUNER PRODUCTS

FM25L04

Abstract: FM25L04-GA Q100
Contextual Info: AEC Q100 Grade 1 Compliant FM25L04 – Automotive Temp. 4Kb FRAM Serial 3V Memory Features 4K bit Ferroelectric Nonvolatile RAM • Organized as 512 x 8 bits • Unlimited Read/Write Cycles • NoDelay Writes • Advanced High-Reliability Ferroelectric Process

FM25040A-GA

Abstract: FM25040 FM25040A Q100
Contextual Info: AEC Q100 Grade 1 Compliant FM25040A – Automotive Temp. 4Kb FRAM Serial Memory Features 4K bit Ferroelectric Nonvolatile RAM • Organized as 512 x 8 bits • High Endurance 1 Trillion 1012 Read/Writes • NoDelay Writes • Advanced High-Reliability Ferroelectric Process

1.0 k mef 250

Abstract: ME4003 ME4002 MA0411 transistor me6101 transistor BC 172B 2N2959 transistor bf 175 2N5173 2n3072
Contextual Info: INTRODUCTION This is Micro Electronics latest short form catalogue on discrete semi-conductor devices. We have introduced many new products since the previous publication. This guide provides a quick reference on the characteristics o f our products. Separate data sheets for a

xn 1049 dp

Abstract: atmel u122 o2c ADQ44 a6252 ic a6252 atmel 938 32c ADQ36 22B35 ad 11800 t8 ATMEL 812 24C
Contextual Info: This Document can not be used without Samsung's authorization. 7. Circuit Diagram 4 SE DONA Signature : 3 3 APPROVAL 2005/10/05 SEDONA MAIN BA41-#####A PR 0.81 CPU :Intel Y onah667 Chip Set :Intel Calistoga & ICH7-M Remarks : Mobility Platform : : : : : :

Contextual Info: AEC Q100 Grade 1 Compliant FM25040A – Automotive Temp. 4Kb FRAM Serial Memory Features 4K bit Ferroelectric Nonvolatile RAM • Organized as 512 x 8 bits • High Endurance 1 Trillion 1012 Read/Writes • NoDelay Writes • Advanced High-Reliability Ferroelectric Process

Contextual Info: AEC Q100 Grade 1 Compliant FM25L04 – Automotive Temp. 4Kb FRAM Serial 3V Memory Features 4K bit Ferroelectric Nonvolatile RAM • Organized as 512 x 8 bits • Unlimited Read/Write Cycles • NoDelay Writes • Advanced High-Reliability Ferroelectric Process

A5620

Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which

A5625-01

Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which