A5624 Search Results

A5624 Price and Stock

Filter by Manufacturer

TE Connectivity


TE Connectivity FDBA 56-24-61 SN-K - Bulk (Alt: ZPF000000000019741)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	FDBA 56-24-61 SN-K	Bulk			47	1 - 10 - 100 - 1000 - 10000 -	Get Quote
TE Connectivity FDBA 56-24-61 SN-K-A499 - Bag (Alt: ZPF000000000019747)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	FDBA 56-24-61 SN-K-A499	Bag			31	1 - 10 - 100 - 1000 - 10000 -	Get Quote
TE Connectivity FDBA 56-24-19 PN-K 090 - Bag (Alt: ZPF000000000019704)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	FDBA 56-24-19 PN-K 090	Bag		19 Weeks, 2 Days	64	1 - 10 - 100 $87.38 1000 $86.07 10000 $85.63	Buy Now
Interstate Connecting Components	FDBA 56-24-19 PN-K 090					1 - 10 - 100 - 1000 - 10000 -	Buy Now
TE Connectivity DBAS 78GR 37-0 PN 090 A5624 DBAS 78GR 37-0 PN 090 A5624 - Bag (Alt: ZPF000000000206882)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	DBAS 78GR 37-0 PN 090 A5624	Bag			3	1 - 10 $1295.45 100 $938.30 1000 $938.30 10000 $938.30	Buy Now
TE Connectivity FDBA 56-24-61 SW-K 090 - Bag (Alt: ZPF000000000019753)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	FDBA 56-24-61 SW-K 090	Bag			61	1 - 10 - 100 $100.69 1000 $85.73 10000 $83.87	Buy Now
Interstate Connecting Components	FDBA 56-24-61 SW-K 090					1 - 10 - 100 - 1000 - 10000 -	Buy Now

Find more A5624 price and stock on Findchips.com

A5624 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
A5244 Abstract: k2333 j5204 K2303 h5104 Contextual Info: Pilkor components AC and Pulse Metallized Polypropylene film capacitors MKP RADIAL POTTED CAPACITORS PCMP 389 Pitch 10.0/15.0/22.5/27.5 mm reduced pitch 7.5mm QUICK REFERENCE DATA Capacitance range (E24 series) 0.01 to 3.9㎌ Capacitance tolerance ±5%	Original		PDF
tungsten slug glass diode Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF
A5620 Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF
A5625-01 Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which	Original		PDF