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    A5624 Search Results

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    A5624 Price and Stock

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    Signal Transformer Inc 14A-56-24

    PWR XFMR LAMINATED 56VA TH
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    DigiKey 14A-56-24 Box 791 1
    • 1 $26.46
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    • 100 $21.56
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    Sager 14A-56-24 40
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    • 100 $24.64
    • 1000 $20.15
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    YAGEO Corporation 9C12063A5624FKHFT

    RES SMD 5.62M OHM 1% 1/4W 1206
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9C12063A5624FKHFT Tape & Reel 5,000
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    TE Connectivity FDBA-56-24-19-PN-K-090

    FDBA 56-24-19 PN-K 090
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    DigiKey FDBA-56-24-19-PN-K-090 Bulk 64
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    • 100 $67.33
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    TE Connectivity FDBA-56-24-61-SY-K-090

    FDBA 56-24-61 SY-K 090
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    DigiKey FDBA-56-24-61-SY-K-090 Bulk 52
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    • 100 $83.32
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    TE Connectivity FDBA-56-24-61-SN-K-090

    FDBA 56-24-61 SN-K 090
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    DigiKey FDBA-56-24-61-SN-K-090 Bulk 52
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    A5624 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    A5244

    Abstract: k2333 j5204 K2303 h5104
    Contextual Info: Pilkor components AC and Pulse Metallized Polypropylene film capacitors MKP RADIAL POTTED CAPACITORS PCMP 389 Pitch 10.0/15.0/22.5/27.5 mm reduced pitch 7.5mm QUICK REFERENCE DATA Capacitance range (E24 series) 0.01 to 3.9㎌ Capacitance tolerance ±5%


    Original     		PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF