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    Philips Semiconductors TDA5637BMC1

    9 V VHF HYPERBAND AND UHF MIXER/OSCILLATOR FOR TV AND VCR 3-BAND Video Tuner, 3-Band, PDSO24
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA TDA5637BMC1 30,365
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    Freescale Semiconductor DSPA56371AF180

    Digital Signal Processor, 24-Bit Size, CMOS, PQFP80
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA DSPA56371AF180 2,790
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    Motorola Semiconductor Products DSPA56371AF180

    INSTOCK
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    Chip 1 Exchange DSPA56371AF180 130
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    NXP Semiconductors KDSPA56371AF180

    Stock, Ship Today
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Flip Electronics KDSPA56371AF180 2,430
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    NXP Semiconductors DSPA56371AF180

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    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Flip Electronics DSPA56371AF180 2,430
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    Find more A5637 price and stock on Findchips.com

    A5637 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TOKO 113kn if transformer

    Abstract: ALL BAND TV TUNER IC toko transformer IF 455 khz SSOP24 TDA5636 TDA5636B TDA5636BM TDA5636BT TDA5637 TDA5637B
    Contextual Info: Philips Semiconductors Product specification 9 V VHF hyperband and UHF mixer/oscillator for TV and VCR 3-band TDA5636B; A5637B FEATURES GENERAL DESCRIPTION • Balanced mixer with a common emitter input for band A single input The TDA5636B and A5637B are monolithic integrated


    OCR Scan     		tda5636tda5637toko 113kn if transformerall band tv tuner ic+6toko transformer if 455 khzssop24tda5636btda5636bmtda5636bttda5637b PDF

    3-band spectrum analyzer

    Abstract: NF 430 n a3 VHF-UHF Band oscillator ALL BAND TV TUNER IC SSOP24 TDA5636 TDA5636B TDA5637 TDA5637B MLD112
    Contextual Info: INTEGRATED CIRCUITS TDA5636B; A5637B Low-power VHF, UHF and hyperband mixer/oscillator for TV and VCR 3-band tuners Objective specification File under Integrated Circuits, IC02 Philips Sem iconductors 7110fl2b DCHlDab Obb This Material Copyrighted By Its Respective Manufacturer


    OCR Scan     		tda5636btda5637b7110fl2bjda5636b+83-band spectrum analyzernf 430 n a3vhf-uhf band oscillatorall band tv tuner icssop24tda5636tda5637mld112 PDF

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		tungsten slug glass diodeceramic pin grid array wire lead frame28f001bx28f010+428f020a5637a5609performance characteristics of ic packages PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		a56203g call flowsensor cement capacitorcq diode databook+6tsop ir sensorslotted optical switchinductive displacement sensorsside brazed ceramic dual-in-line packagesschematic inductive proximity sensorschematic ac inductive proximity sensor PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		a5625-01a5620land pattern for tsop 2-86a5609+628f001bx28f01028f020outline of the heat sink for theta jca5644-01intel 24 pin ceramic dual-in-line package PDF