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    A3 100C UD Search Results

    A3 100C UD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH1100CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 49 A, 0.0111 Ω@10 V, High-speed diode, SOP Advance(N) Datasheet
    71757-100CALF
    Amphenol Communications Solutions Card Bus Ass'y, Above Mount, D/D(136Pins), R/A, Type 123, 3.3V, 0mm s/o, Right (Lower Deck) & Left (Upper Deck) Push Rod Eject, 9.5mm Eject Travel PDF
    10136870-100CLF
    Amphenol Communications Solutions PCI Express® GEN 3 Card Edge, Storage and Server Connector, One Open End, Vertical, Surface Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch PDF
    72206-100CAHLF
    Amphenol Communications Solutions Card Bus Ass'y, Above Mount, S/D(68Pins), R/A, Type 123, 3.3V, 0mm s/o, Left Push Rod Eject, 9.5mm Eject Travel PDF
    72206-100CALF
    Amphenol Communications Solutions Card Bus Ass'y, Above Mount, S/D(68Pins), R/A, Type 123, 3.3V, 0mm s/o, Left Push Rod Eject, 9.5mm Eject Travel PDF

    A3 100C UD Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    jbk00

    Abstract: kb926 CV203 SLG8SP626 LA-4093P cv190 CV2131 M82-S cv92 tps51125
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 JBK00 LA-4093P Schematics Document Mobile AMD S1G2 CPU with ATI RX781 & SB700 core logic with M86-M 3 3 2009-03-25 REV:1.0 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date


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    JBK00 LA-4093P RX781 SB700 M86-M A4093 CV152 CV148 CV143 kb926 CV203 SLG8SP626 cv190 CV2131 M82-S cv92 tps51125 PDF

    KB926

    Abstract: JBK00 LA4092P JBK00 LA4092P 1.0 JBK00 LA-4092P PC613 PC614 tps51125 RX781 FBMA-L11-201209-221LMA30T
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 JBK00 LA-4092P Schematics Document Mobile AMD S1G2 CPU with ATI RX781 & SB700 core logic with M82-S 3 3 2008-05-13 REV:1.0 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date


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    JBK00 LA-4092P RX781 SB700 M82-S KB926 JBK00 LA4092P JBK00 LA4092P 1.0 PC613 PC614 tps51125 RX781 FBMA-L11-201209-221LMA30T PDF

    JBK00 LA4092P

    Abstract: LA-4092P JBK00 KB926 tps51125 JBK00 LA4092P 1.0 FBMA-L11-201209-221LMA30T kb926qf RT8204 LA-4111P
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 JBK00 LA-4092P Schematics Document Mobile AMD S1G2 CPU with ATI RX781 & SB700 core logic with M82-S 3 3 2008-02-20 REV:0.4 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date


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    JBK00 LA-4092P RX781 SB700 M82-S JBK00 LA4092P KB926 tps51125 JBK00 LA4092P 1.0 FBMA-L11-201209-221LMA30T kb926qf RT8204 LA-4111P PDF

    LA-4091P

    Abstract: PC614 KB926 JBK00 la 4091p rev 1A tps51125 jbk00 la-4091p JBK00 PC613 PR317 hy5ps561621afp-25
    Contextual Info: A B C D E 1 1 Compal confidential 2 2 JBK00 LA-4091P Schematics Document Mobile AMD S1G2 CPU with ATI RS780MN & SB700 core logic 3 3 2008-02-20 REV:0.4 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL


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    JBK00 LA-4091P RS780MN SB700 PC614 KB926 JBK00 la 4091p rev 1A tps51125 jbk00 la-4091p PC613 PR317 hy5ps561621afp-25 PDF

    ICL71G6

    Abstract: Digital Weighing Scale schematic Low Cost Digital Panel Meter Designs" auto ranging dvm exclusive or pin diagram JCL7106 703C CD4077 ICL7126 ICL712S ICL712SCPL
    Contextual Info: 33 -^ 0 ICL7 1 2 6 NOT RECOMMENDED FOR NEW DESIGN N o ve m b e r 1993 31/2 Digit Low Power Single-Chip A/D Converter Features Description • 8,000 Hours Typical 9V Battery Life T h e IC L 7 1 2 S is a high perfo rm ance, very low power 3 V 2 diait • Guaranteed Zero Reading for 0V Input on All Scales


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    faICL7126 ICL7106 15uVP ICL712SCPL ICL712SRCPL ICL7126 ICL7126 10kAr ICL71G6 Digital Weighing Scale schematic Low Cost Digital Panel Meter Designs" auto ranging dvm exclusive or pin diagram JCL7106 703C CD4077 ICL712S PDF

    ps223

    Abstract: MS1221 ALC888 C1U16Y ICH8M REV 1.0 SiI1392 intel g41 msi Socket AM2 rtl8111b BJ-11
    Contextual Info: 5 MS-1221 VER : 1.0 D C B 01 : BLOCK DIAGRAM 02 : PLATFORM 03 : Merom-1 CPU HOST BUS 04 : Merom-2 CPU (POWER/GND) 05 : 965GM-1 (HOST) 06 : 965GM-2 (DMI / VGA) 07 : 965GM-3 (DDR2) 08 : 965GM-4 (Power-1) 09 : 965GM-5 (Power-2) 10 : 965GM-6 (GND) 11 : DDR2_SODIMM0


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    MS-1221 TPS51120 965GM-1 965GM-2 965GM-3 965GM-4 965GM-5 965GM-6 SiI1392 CK505) ps223 MS1221 ALC888 C1U16Y ICH8M REV 1.0 intel g41 msi Socket AM2 rtl8111b BJ-11 PDF

    scr c1060

    Abstract: 2c1216 foxconn marvell 88SA8040 emc6n300 DC1149 PIN202 Socket AM2 C116 max1535
    Contextual Info: 5 4 3 2 1 D D LAGUNA REV : X00 @ : Depop Component C C PRELIMINARY B B Dothan Schematic with Capture CIS and Function field uFCPGA Dothan 02-07-2004 REV: 0.3 A A DELL CONFIDENTIAL/PROPRIETARY PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL


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    LA2111 PC141 LA2111 scr c1060 2c1216 foxconn marvell 88SA8040 emc6n300 DC1149 PIN202 Socket AM2 C116 max1535 PDF

    tps51620

    Abstract: fds8884 tps51125 Inventec MPLC0730 AM4825P r5c804 TP889 hp d530 crb tps51125 kbc
    Contextual Info: www.laptop-schematics.com INVENTEC Preliminary Test 2008/03/25 EE DATE POWER DATE DRAWER DESIGN CHECK RESPONSIBLE DATE CHANGE NO. REV 3 SIZE = FILE NAME : XXXX-XXXXXX-XX P/N XXXXXXXXXXXX INVENTEC TITLE VER : Preliminary Test SIZE CODE A3 CS DOC. NUMBER REV


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    IEC951098 1-Nov-2007 tps51620 fds8884 tps51125 Inventec MPLC0730 AM4825P r5c804 TP889 hp d530 crb tps51125 kbc PDF

    npce781la0dx

    Abstract: NPCE781 npce781la TI_BQ24721C_QFN_32P NPCE78 BAT54C3 RTL8103 realtek ALC 3232 SLG8SP510T C4161
    Contextual Info: Perugia 10M MP Build A03 2009.05.05 EE DATE POWER DATE DRAWER DESIGN CHECK RESPONSIBLE DATE CHANGE NO. REV SIZE = 3 FILE NAME : XXXX-XXXXXX-XX P/N XXXXXXXXXXXX INVENTEC TITLE VER : Perugia10M SIZE CODE A3 CS SHEET DOC. NUMBER REV 1310A2250501 1 OF x01 63


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    Perugia10M 1310A2250501 16-Dec-2008 NTC031 PAD9500 40X120 PAD9501 40X120 npce781la0dx NPCE781 npce781la TI_BQ24721C_QFN_32P NPCE78 BAT54C3 RTL8103 realtek ALC 3232 SLG8SP510T C4161 PDF

    TI_BQ24721C_QFN_32P

    Abstract: D5036 tps51620 PowerPAD20 AM4825P tps51125 R1019 FM ic GMT_G680LT1_SOT23_5P pt10s TPS51620RHAR
    Contextual Info: INVENTEC PRELIMINARY TEST 07A99 2007 12 20 Pre-MP BUILD INVENTEC TITLE 07A99 Preliminary Test SIZE CODE A3 CHANGE by KOBE 23-Jan-2008 DOC. NUMBER REV X01 CS SHEET 1 OF 63 TABLE OF CONTENTS PAGE 1.COVER PAGE 2.INDEX 3.BLOCK DIAGRAM 4.POWER SEQUENCE BLOCK 5-12.SYSTEM POWER


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    07A99 23-Jan-2008 R9033 R9034 AZ1015 C9038 C9040 R9039 TI_BQ24721C_QFN_32P D5036 tps51620 PowerPAD20 AM4825P tps51125 R1019 FM ic GMT_G680LT1_SOT23_5P pt10s TPS51620RHAR PDF

    2N7002DM

    Abstract: kia 1117 3.3 VT8233 g3mx SMD M05 sot23 H052 W044 kia 1117 1.8 C85C39 c8252
    Contextual Info: - p. <11 « P.02 Cover Page P. 29 DC-DC +1.25V P4 478 P.30 DC-DC +2.5V P. 31 Battery P. 32 Charger 1 of 2 P.03 P4 4 78 - PWR & GND (2 of 2) P.04 NB VT8703 - Host, CRT and TV Interface P.05 NB VT8703 - Memory Interface P.06 NB VT8703 - LVDS, (1 of 3) (2 of 3)


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    P4M266 LTC17D9-9 N355V1 33VSB 2N7002DM kia 1117 3.3 VT8233 g3mx SMD M05 sot23 H052 W044 kia 1117 1.8 C85C39 c8252 PDF

    tps51620

    Abstract: pt10s TPS51620RHAR W775L fds8884 INVENTEC R5C804 tps51125 63A43 Sil1392
    Contextual Info: INVENTEC Preliminary Test 2008/03/25 EE DRAWER DESIGN CHECK RESPONSIBLE SIZE = 3 XXXX-XXXXXX-XX P/N NAME XXXXXXXXXXXX FILE : DATE CHANGE NO. REV DATE DATE POWER INVENTEC TITLE VER : PT10SC DOC. NUMBER A3 CODE SIZE CS Model_No SHEET OF 1 63 REV X01 TABLE OF CONTENTS


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    PT10SC PT10SC IEC951098 1-Nov-2007 tps51620 pt10s TPS51620RHAR W775L fds8884 INVENTEC R5C804 tps51125 63A43 Sil1392 PDF

    ADS1240

    Abstract: MSP430 MSP430F413 MSP430 thermocouple 0HR13 Thermistor S14
    Contextual Info: Application Report SLAA125A – October 2001 Implementing a Direct Thermocouple Interface With the MSP430x4xx and ADS1240 Mike MItchell MSP430 ABSTRACT This application report describes and shows how to implement a direct thermocouple interface, without using the signal conditioning circuitry normally required for


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    SLAA125A MSP430x4xx ADS1240 MSP430 ADS1240, 24-bit MSP430F41x MSP430F413 ADS1240 MSP430 MSP430 thermocouple 0HR13 Thermistor S14 PDF

    Texas Instrument Tip 26C transistor

    Abstract: SLAA125 L type thermocouple conversion table MSP430x4xx temperature sensor schematic msp430 ADS1240 MSP430 thermocouple k type Amplifier k thermocouple texas tip 26c thermistor conversion table
    Contextual Info: Application Report SLAA125 – May 2001 Implementing a Direct Thermocouple interface with the MSP430x4xx and ADS1240 Mike MItchell MSP430 ABSTRACT This application report describes and shows how to implement a direct thermocouple interface, without using the signal conditioning circuitry normally required for


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    SLAA125 MSP430x4xx ADS1240 MSP430 ADS1240, 24-bit MSP430F41x MSP430F413 Texas Instrument Tip 26C transistor SLAA125 L type thermocouple conversion table temperature sensor schematic msp430 ADS1240 MSP430 thermocouple k type Amplifier k thermocouple texas tip 26c thermistor conversion table PDF

    CIO-MINI37

    Abstract: RADIO SHACK PARTS CROSS REF amd9513 GORDOS SOLID STATE RELAY laptop cq 42 MOTHERBOARD VOLTAGE diagram S0833 AD7748 DAS-1600 winbook toshiba ICs cross reference catalog
    Contextual Info: ATA ACQUISITION & CONTROL W4 :i' / na/og Volume 6 :f¡ A N EW A G E DAWNS’ ISA to PCM CIA 125 High Street Mansfield, MA 02048 508 261-1123 FAX (508)261-1094 ^ * u j -u a ô u o /a u 0 0 -D A S 0 8 P G H & L C IO -D A SO 8 C IO -D A S 48 » c n a n n e i ZUJS.HZ A / D m > g O ain & 2 C hannels o t 12 B it D /A


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    rtl8111* Reference

    Abstract: h13m GFX DIODE 42A KB910QF-C1 SLG8 foxconn MS14141 ICH8M 676 CMC110 intel g41 msi
    Contextual Info: 5 4 MS-1313 VER : 1.0 3 2007/03/06 2 Merom 478 C B 01 : BLOCK DIAGRAM 02 : PLATFORM 03 : Merom-1 CPU HOST BUS 04 : Merom-2 CPU (POWER/GND) 05 : 965GM-1 (HOST) 06 : 965GM-2 (DMI / VGA) 07 : 965GM-3 (DDR) 08 : 965GM-4 (Power-1) 09 : 965GM-5 (Power-2) 10 : 965GM-6 (GND)


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    MS-1313 TPS51120 25VRUN APL5913 965GM-1 965GM-2 965GM-3 965GM-4 965GM-5 965GM-6 rtl8111* Reference h13m GFX DIODE 42A KB910QF-C1 SLG8 foxconn MS14141 ICH8M 676 CMC110 intel g41 msi PDF

    rtl8111* Reference

    Abstract: ICH8M 676 KB910QF ICS9LP505 ICS9LP505-1 isl6262acrz R5C832 n5c1 ENE3910 SLG8SP51
    Contextual Info: 5 4 MS-1313 VER : 0.A 3 2006/10/18 2 Merom 478 Page 3,4 D C B 01 : BLOCK DIAGRAM 02 : PLATFORM 03 : Merom-1 CPU HOST BUS 04 : Merom-2 CPU (POWER/GND) 05 : 965GM-1 (HOST) 06 : 965GM-2 (DMI / VGA) 07 : 965GM-3 (DDR) 08 : 965GM-4 (Power-1) 09 : 965GM-5 (Power-2)


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    MS-1313 TPS51120 25VRUN APL5913 965GM-1 965GM-2 965GM-3 965GM-4 965GM-5 965GM-6 rtl8111* Reference ICH8M 676 KB910QF ICS9LP505 ICS9LP505-1 isl6262acrz R5C832 n5c1 ENE3910 SLG8SP51 PDF

    DM270

    Abstract: 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash
    Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


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    02-DT-0704-00 DM270 2Gb NAND FLASH Toshiba QUALCOMM Reference manual Diskonchip toshiba 107ball marking G3 smartphone MOTHERBOARD CIRCUIT diagram Micron 512MB nand FLASH mcp M-Systems diskonchip mcp toshiba MLC nand flash PDF

    hynix hy57v281620

    Abstract: HY57V561620 HY39S512800 LPC2888 K4S280832 LPC2800 dwa 108 a MARKING CODE 436c MT48LC4M32A2 hp 433C
    Contextual Info: UM10208 LPC2880/LPC2888 User manual Rev. 02 — 1 June 2007 User manual Document information Info Content Keywords LPC2880, LPC2888, LPC288x, ARM, ARM7, embedded, 32-bit, microcontroller, USB 2.0, USB HS Abstract LPC288x User manual UM10208 NXP Semiconductors


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    UM10208 LPC2880/LPC2888 LPC2880, LPC2888, LPC288x, 32-bit, LPC288x UM10208 hynix hy57v281620 HY57V561620 HY39S512800 LPC2888 K4S280832 LPC2800 dwa 108 a MARKING CODE 436c MT48LC4M32A2 hp 433C PDF

    smartphone MOTHERBOARD CIRCUIT diagram

    Abstract: AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball
    Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and PSRAM Data Sheet, July 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


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    02-DT-0704-00 smartphone MOTHERBOARD CIRCUIT diagram AP-DOC-070 Micron 512MB nand FLASH mcp J9 G3 MARKING G3 MICRON mcp QUALCOMM Reference manual A0-A21 DM270 Flash MCp nand DRAM 107-ball PDF

    s3f443fx

    Abstract: IR 1836 3v S3F44 ftp2 e 23 equivalent
    Contextual Info: 20-S3-F443FX -092002 USER'S MANUAL S3F443FX 16/32-Bit RISC Microcontroller Revision 0 S3F443FX Preliminary Spec 1 PRODUCT OVERVIEW PRODUCT OVERVIEW INTRODUCTION SAMSUNG S3F443FX 16/32-bit RISC micro-controller is a cost-effective and high-performance solution for HDD


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    20-S3-F443FX S3F443FX 16/32-Bit S3F443FX 256K-byte 512-byte IR 1836 3v S3F44 ftp2 e 23 equivalent PDF

    ELPIDA 512MB NOR FLASH

    Abstract: nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100
    Contextual Info: DiskOnChip-Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, August 2004 • Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


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    97-DT-0304-00 ELPIDA 512MB NOR FLASH nand mcp elpida MCP NOR FLASH SDRAM elpida Diskonchip MS08-D9SD7-B3 marking G3 QUALCOMM Reference manual nec 4 Banks x 1m x 32Bit Synchronous DRAM emblaze qualcomm 1100 PDF

    MCP 256M nand toshiba

    Abstract: Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3
    Contextual Info: DiskOnChip -Based MCP Including DiskOnChip G3 and Mobile RAM Data Sheet, September 2004 Highlights DiskOnChip-based MCP Multi-Chip Package is a complete memory solution. Efficiently packed in a small Fine-Pitch Ball Grid Array (FBGA) package, it is ideal for data and code


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    91-DT-0504-00 MCP 256M nand toshiba Diskonchip QUALCOMM Reference manual TRUEFFS TSOP 48 thermal resistance type1 MARKING G3 MCP 256M nand micron MICRON mcp transistor marking A9M MS06-D9SD8-B3 PDF

    S4UG

    Abstract: DF25SC6M SHINDENGEN 33 s60sc4m
    Contextual Info: •S •Bl » K; m -i. •4 M I at » na* m ff! 3} 9t äS äs 3t 3t 2 lat ? ’S . % 2 9t -o æ 2 -X -X H H m vi pW- i ridi m m. >ii wt N> I a rS IH 3? W > 9tt >4 ° c m m ga (£ — < V fH] $ 38 fit h£ 35 ^ d a vt A ^ I S EG -/I 9' Si Vt A m m ■H a I V*


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