micromodule
Abstract: ST1305B 24x8 memory card circuit diagram
Contextual Info: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data
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ST1305B
Abstract: memory card circuit diagram
Contextual Info: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data
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1305B
Contextual Info: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING • Single S upply Voltage 5 V ■ M em ory Divided Into: - 16 bits of C ircuit Identification - 48 bits of Card Identification - 48 bits of C ount Data -
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ST1305B
Abstract: 064d
Contextual Info: ST1305B High Endurance CMOS 192 bit EEPROM With Secure Logic Access Control BRIEF DATA • Memory Divided Into: 2 Programming Time: 5 ms 2 ■ Figure 1. Delivery Forms 2 Single 5 V Supply Voltage 2 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification
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ST1305B
Abstract: ST1331 ST1333 ST1335 ST1336 ST16ST2G ST1200 ST133X
Contextual Info: Memory with Security for Memory Cards PRE-PAYMENT, VENDING, TELEPHONE CARDS, ID, TOKENS The ST133x family is a new and better alternative to all current telephone pre-payment ICs. These devices can be implemented in current systems by using an appropriate security module
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MEXICO FUSE
Abstract: ST1335 AN1010 ST1305 ST1305B 128D AN1031R
Contextual Info: AN1010 APPLICATION NOTE Changing from the ST1305 to the ST1335 In Your Application The evolution of the application, from one that uses the ST1305 to one that uses the ST1335, is a relatively straightforward process. This document highlights the issues, and shows how the ST1335 is fully compatible with the ST1305 if the fields have been used in the conventional manner. First, the principle features
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ST1335
Abstract: AN1010 ST1305 ST1305B AN1031R st 104d
Contextual Info: AN1010 APPLICATION NOTE Changing from the ST1305 to the ST1335 In Your Application The evolution of the application, from one that uses the ST1305 to one that uses the ST1335, is a relatively straightforward process. This document highlights the issues, and shows how the ST1335 is fully compatible with the ST1305 if the fields have been used in the conventional manner. First, the principle features
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MIL-STD 833 test method 3015
Abstract: ST1305 M14C04 M14C16 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336
Contextual Info: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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footprint so44
Abstract: 9977 IC SOCKET TSOP48 TSOP32 FOOTPRINT ST1355 52 pin plcc socket ST19GF34 PSDSoft ST19AF08 serial flash 256Mb fast erase spi
Contextual Info: MEMORY SELECTOR Leading Edge Memories • 1999 GO Why a Broad Range? Leading Edge Memories OTP and UV EPROMs Flash Memories Serial and Parallel EEPROMs ASM and Memory Card ICs Memory Systems and NVRAMs BROAD RANGE STMicroelectronics is a world leader in non-volatile memories, manufacturing a broad
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operat911d-90449brmemsel/0699footprint so44+99977ic socket tsop48tsop32 footprintst135552 pin plcc socketst19gf34psdsoftst19af08serial flash 256mb fast erase spi
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SMARTCARD micromodule assembly
Abstract: ST14C02 M14C04 M14C16 M14C32 M14C64 ST1200 ST1305B ST1331 ST1333
Contextual Info: SUPER 35 MM MICROMODULES Super 35 mm Micromodules for Smartcards and Memory Cards DATA BRIEFING • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side 1 1 1 1 1 1 – Support for the chip
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2702 eprom
Abstract: ST1305B ST1331 ISO/IEC 7816-1 micromodule MICROMODULES M14C04 M14C16 ST1200 ST1333
Contextual Info: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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TAG 9109
Abstract: M35080 M95256 equivalent TSOP48 outline EEPROM 16MB NVRAM 1KB TSOP40 "dual access" "nonvolatile memory" -RFID ST1335 asm eagle
Contextual Info: MEMORY SELECTOR Leading Edge Memories • Fall 1998 GO Why a Broad Range? Leading Edge Memories Flash Memories Serial and Parallel EEPROMs Application Specific Memories UV and OTP EPROMs Non-Volatile RAMs BROAD RANGE STMicroelectronics is a world leader in
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