RE933 Search Results

Contextual Info: Multiadapters RE933-06 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 28 - hole dia 1.00 mm - size 21.00 x 23.50 mm

Contextual Info: Multiadapters RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm

RE933-04

Abstract: RE933-03 RE933-08 RE933-10
Contextual Info: TSSOP-CMS Multiadaptateur thin shrink small package RE933 - fibre de verre époxyde FR4 1,50 mm, double face 35 µm CU (entiérement métallisées) - côté de soudure et des composants avec une surface d`or chimique et pourvus d`un masque d`arrêt de soudure

TSSOP8

Abstract: TSSOP8 Package
Contextual Info: TSSOP8 Adapter thin shrink small outline package RE933-01 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 8 - hole dia 1.00 mm - size 9.00 x 23.50 mm

TSSOP48

Contextual Info: TSSOP48 Adapter thin shrink small outline package RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm

Contextual Info: Multiadapters RE933-02 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 14 - hole dia 1.00 mm - size 13.50 x 23.50 mm

Contextual Info: Multiadapters RE933-01 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 8 - hole dia 1.00 mm - size 9.00 x 23.50 mm

TSSOP14

Abstract: TSSOP14 package
Contextual Info: TSSOP14 Adapter thin shrink small outline package RE933-02 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 14 - hole dia 1.00 mm - size 13.50 x 23.50 mm

TSSOP20

Abstract: TSSOP20 package RE933-04
Contextual Info: TSSOP20 Adapter thin shrink small outline package RE933-04 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 20 - hole dia 1.00 mm - size 16.00 x 23.50 mm

TSSOP32

Abstract: TSSOP-32 RE933-07
Contextual Info: TSSOP32 Adapter thin shrink small outline package RE933-07 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (240 mil) - pins: 32 - hole dia 1.00 mm - size 23.50 x 25.50 mm

Contextual Info: Multiadapters RE933-05 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 24 - hole dia 1.00 mm - size 18.50 x 23.50 mm

TSSOP56

Abstract: RE933-10
Contextual Info: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm

Contextual Info: Multiadapters RE933-07 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (240 mil) - pins: 32 - hole dia 1.00 mm - size 23.50 x 25.50 mm

RE933-04

Abstract: RE933-03 RE933-08 RE933-10
Contextual Info: TSSOP-SMD Multiadaptador thin shrink small outline package RE933 - epóxido FR4 1,50 mm, por dos lados 35 µm CU (pth) - lado de soldadura y de componentes con na superficie de oro químico y una máscara inhibidora de soldadura - agujeros Ø 1,00 mm - adaptador para 10 TSSOP diferentes

tSSOP28

Abstract: TSSOP28 package 173-MIL solder stop mask
Contextual Info: TSSOP28 Adapter thin shrink small outline package RE933-06 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 28 - hole dia 1.00 mm - size 21.00 x 23.50 mm

RE933-04

Abstract: RE933-03 RE933-08 RE933-10
Contextual Info: TSSOP-SMD Multiadapter thin shrink small outline package RE933 - Epoxydglashartgewebe FR4 1,50 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseite mit einer Oberfläche aus chem. AU und Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 10 verschiedene TSSOP

RE933-03

Abstract: RE933-04 RE933-08 RE933-10 0.5 mm pitch TSSOP
Contextual Info: TSSOP-SMD Multiadapter thin shrink small outline package RE933 - FR4 EPOXY fibre-glass 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - hole dia 1.00 mm - adapter for 10 differents TSSOP - pitch 0.65 mm / 0.50 mm

RE933-03

Abstract: 173MIL
Contextual Info: Multiadapters RE933-03 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 16 - hole dia 1.00 mm - size 13.50 x 23.50 mm

RE933-08

Contextual Info: Multiadapters RE933-08 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (173 mil) - pins: 38 - hole dia 1.00 mm - size 28.50 x 23.50 mm

RE933-04

Contextual Info: Multiadapters RE933-04 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 20 - hole dia 1.00 mm - size 16.00 x 23.50 mm

RE933-10

Contextual Info: Multiadapters RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm

RE933-03

Abstract: TSSOP16 TSSOP16 datasheet
Contextual Info: TSSOP16 Adapter thin shrink small outline package RE933-03 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch 0.65 mm (173 mil) - pins: 16 - hole dia 1.00 mm - size 13.50 x 23.50 mm

tssop24

Abstract: tssop24 datasheet
Contextual Info: TSSOP24 Adapter thin shrink small outline package RE933-05 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 mm (173 mil) - pins: 24 - hole dia 1.00 mm - size 18.50 x 23.50 mm

solder stop mask

Abstract: RE931
Contextual Info: Stock No.: RE931 Stock No.: RE931 SSOP-SMD Multiadapter shrink small outline package - pitch 0,65 mm / 0,635 mm - Epoxy fibre glass FR 4 1.5 mm double-sided 35 µm CU - plated through holes 1.00 mm Ø - adapter for 7 different SSOP Pitch (mm) 0,65 0,65 0,65