RE931 Search Results

solder stop mask

Abstract: RE931
Contextual Info: Stock No.: RE931 Stock No.: RE931 SSOP-SMD Multiadapter shrink small outline package - pitch 0,65 mm / 0,635 mm - Epoxy fibre glass FR 4 1.5 mm double-sided 35 µm CU - plated through holes 1.00 mm Ø - adapter for 7 different SSOP Pitch (mm) 0,65 0,65 0,65

RE931-02

Abstract: RE931-05 RE931 RE931-07
Contextual Info: SSOP-SMD Multiadapter shrink small outline package RE931 - epóxido FR4 1,5 mm, por dos lados 35 µm CU (pth) - lado de soldadura y de componentes con una superficie de oro químico y una máscara inhibidora de soldadura - agujeros Ø 1,00 mm - adaptador para 7 SSOP diferentes

SSOP56

Abstract: adapter ssop56 adaptor ssop56 RE931-07 SSOP5 ssop-56
Contextual Info: SSOP56 Adapter shrink small outline package RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm

SSOP48

Abstract: SSOP-48
Contextual Info: SSOP48 Adapter shrink small outline package RE931-06 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 48 - hole dia 1.00 mm - size 32.5 x 29.5 mm

SSOP14 package

Abstract: SSOP14
Contextual Info: SSOP14 Adapter shrink small outline package RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - pitch 0.65 mm

SSOP28

Abstract: RE931-05PI
Contextual Info: SSOP28 Adapter shrink small outline package mit Pins RE931-05PI - Epoxydglashartgewebe FR4 1,5 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseiten mit einer Oberfläche aus chem. AU und Lötstoppmaske - pitch: 0,65 (208 mil) - pins: 28

Contextual Info: Multiadapters RE931-01 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 14 - hole dia 1.00 mm - size 13.0 x 23.5 mm

SSOP28 package

Abstract: RE931 shrink SSOP28
Contextual Info: SSOP28 Adapter shrink small outline package with pins RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm

RE931

Abstract: RE931-02 RE931-05 RE931-07
Contextual Info: SSOP-SMD Multiadapter shrink small outline package RE931 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - hole dia 1.00 mm - adapter for 7 different SSOP - pitch 0.65 mm / 0.635 mm

Contextual Info: Multiadapters RE931-06 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 48 - hole dia 1.00 mm - size 32.5 x 29.5 mm

Contextual Info: Multiadapters RE931-04 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 24 - hole dia 1.00 mm - size 19.5 x 23.5 mm

RE931-05

Abstract: 208-MIL
Contextual Info: Multiadapters RE931-05 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 28 - hole dia 1.00 mm - size 13.0 x 23.5 mm

shrink

Abstract: SSOP24
Contextual Info: SSOP24 Adapter shrink small outline package RE931-04 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 24 - hole dia 1.00 mm - pitch 0.65 mm

RE931-05

Abstract: RE931-07 RE931 RE931-02
Contextual Info: SSOP-SMD Multiadapter shrink small outline package RE931 - fibre de verre époxyde FR4 1,5 mm, simple face 35 µm CU (entiérement métallisées) - côté de soudure et des composants avec une surface d´or chimique et pourvus d´un masque d´arrêt de soudure

Contextual Info: Multiadapters RE931-05PI - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 28 - size 13.0 x 23.5 mm

SSOP20

Abstract: SSOP20 package
Contextual Info: SSOP20 Adapter shrink small outline package RE931-03 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 20 - hole dia 1.00 mm - pitch 0.65 mm

FR4 epoxy

Abstract: SSOP16 package ssop16 RE931-02
Contextual Info: SSOP16 Adapter shrink small outline package RE931-02 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 16 - hole dia 1.00 mm - pitch 0.65 mm

solder stop mask

Contextual Info: Multiadapters RE931-03 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0,65 (208 mil) - pins: 20 - hole dia 1.00 mm - size 20.0 x 23.5 mm

RE931-07

Contextual Info: Multiadapters RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU pth - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm

RE931

Abstract: RE931-02 RE931-05 RE931-07
Contextual Info: SSOP-SMD Multiadapter shrink small outline package RE931 - Epoxydglashartgewebe FR4 1,5 mm, zweiseitig 35 µm CU (durchkontaktiert) - Löt- und Komponentenseiten mit einer Oberfläche aus chem. AU und Lötstoppmaske - Lochdurchmesser 1,00 mm - Adaptionsplatine für 7 verschiedene SSOP

SSOP28 package

Abstract: RE931-05 SSOP28 208mil
Contextual Info: SSOP28 Adapter shrink small outline package RE931-05 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.65 (208 mil) - pins: 28 - hole dia 1.00 mm - pitch 0.65 mm

enamelled copper wire swg table

Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Contextual Info: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .