F100117 Search Results
F100117 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| F100117 | National Semiconductor | -4.2 V to -5.7 V, triple 2-wide OA/OAI gate | Scan | 95.75KB | 3 |
F100117 Datasheets Context Search
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F100117
Abstract: PS 1025 CERPAK
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f100117tl/f/9843-324-pintl/f/9843-5+3 | |
F100117-DCContextual Info: F100117 Triple 2-Wide OA/OAI Gate FAIRCHILD A S chlum berger C om pany F100K ECL Product Connection Diagrams Description The F100117 is a m on olithic triple 2-wide O R /A N D gate w ith true and com plem ent outputs. All inputs have 50 k i 1 pull-dow n resistors and all outputs are buffered. |
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Contextual Info: 100117 ç j l National Æià Semiconductor F100117 Triple 2-Wide OA/OAI Gate General Description The F100117 is a monolithic triple 2-wide OR/AND gate with true and complement outputs. All inputs have 50 k fl pull-down resistors and all outputs are buffered. |
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f100117tl/f/9b43-324-pin24-pln+2 | |
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Contextual Info: F1 °0117 • Hpi 2“WlQ© OA/OAI Gate F A IR C H IL -P A Schlumberger Company F100K ECL Product Description The F100117 is a monolithic triple 2-wide OR/AND gate with true and complement outputs. All inputs have 50 k ii pull-down resistors and all outputs are buffered. |
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Contextual Info: NATIONAL SEMICOND LOGIC 31E D • bSD1122 0G7107T 7 T - H 3 - Z Z -0 0 National Semiconductor F100117 Triple 2-Wide OA/OAI Gate General Description The F100117 is a monolithic triple 2-wlde OR/AND gate with true and complement outputs. All inputs have 50 kfl |
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Contextual Info: Section 3 Contents F100101 Triple 5-Input OR/NOR G a te . F100102 Quint 2-Input OR/NOR Gate . |
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transistor cross reference
Abstract: MPT3N40 Westinghouse SCR handbook LT 8224 ZENER DIODE sje389 N9602N npn transistor RCA 467 TFK 7 segment displays PUT 2N6027 delco 466
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transistor cross referencempt3n40westinghouse scr handbooklt 8224 zener diode+6 | |
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Contextual Info: F100K INTRODUCTION Competitive pressure in the data processing industry, with ever-increasing data volumes and new architec tures, has stimulated the need for faster processing rates, higher machine densities, and greater system reliability. These requirements can only be met by the use of higher speed integrated circuits with more onchip integration and multipurpose logic functions. Advanced packaging techniques and optimum system |
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